Applying flux

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H01L2224/03828

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/03828Applying flux

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor wafer and method of ball drop on thin wafer with edge...
- Patent number 12,154,877
- Issue date Nov 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer-level package including under bump metal layer
- Patent number 11,862,589
- Issue date Jan 2, 2024
- Samsung Electronics Co., Ltd.
- Hyung Sun Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,848,346
- Issue date Dec 19, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package including under bump metal layer
- Patent number 11,810,878
- Issue date Nov 7, 2023
- Samsung Electronics Co., Ltd.
- Hyung Sun Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device bonding area including fused solder film and m...
- Patent number 11,545,452
- Issue date Jan 3, 2023
- Lapis Semiconductor Co., Ltd.
- Masanori Shindo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with UBM and methods of forming
- Patent number 11,164,832
- Issue date Nov 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method of ball drop on thin wafer with edge...
- Patent number 11,164,835
- Issue date Nov 2, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer-level package including under bump metal layer
- Patent number 11,107,783
- Issue date Aug 31, 2021
- Samsung Electronics Co., Ltd.
- Hyung Sun Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods of forming same
- Patent number 11,043,463
- Issue date Jun 22, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball protection in packages
- Patent number 10,985,117
- Issue date Apr 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packaging facility and method, and device processing apparat...
- Patent number 10,937,757
- Issue date Mar 2, 2021
- Semigear, Inc.
- Jian Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,930,695
- Issue date Feb 23, 2021
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device bonding area including fused solder film and m...
- Patent number 10,910,331
- Issue date Feb 2, 2021
- Lapis Semiconductor Co., Ltd.
- Masanori Shindo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming hybrid bonding structures with elongated bumps
- Patent number 10,867,957
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming connector pad structures, interconnect structure...
- Patent number 10,840,199
- Issue date Nov 17, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level chip-scale package device having bump assemblies config...
- Patent number 10,804,233
- Issue date Oct 13, 2020
- Maxim Integrated Products, Inc.
- Viren Khandekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods of forming same
- Patent number 10,714,442
- Issue date Jul 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with UBM and methods of forming
- Patent number 10,700,026
- Issue date Jun 30, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging devices and methods of manufacture thereof
- Patent number 10,629,555
- Issue date Apr 21, 2020
- Taiwan Semiconductor Manufacturing Company
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming connector pad structures, interconnect structure...
- Patent number 10,515,915
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball protection in packages
- Patent number 10,510,689
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper pillar bump structure and manufacturing method therefor
- Patent number 10,312,208
- Issue date Jun 4, 2019
- Semiconductor Manufacturing International (Shanghai) Corporation
- Xingtao Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package
- Patent number 10,312,209
- Issue date Jun 4, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chao-Wen Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming connector pad structures, interconnect structure...
- Patent number 10,269,739
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods of forming same
- Patent number 10,262,964
- Issue date Apr 16, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming hybrid bonding structures with elongated bumps
- Patent number 10,163,846
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for connecting packages onto printed circuit b...
- Patent number 10,068,873
- Issue date Sep 4, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing printed circuit board and semiconductor pa...
- Patent number 10,049,970
- Issue date Aug 14, 2018
- Samsung Electronics Co., Ltd.
- Hai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball protection in packages
- Patent number 10,049,990
- Issue date Aug 14, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strong, heat stable junction
- Patent number 10,026,708
- Issue date Jul 17, 2018
- The United States of America as represented by the Secretary of the Army
- Patrick J Taylor
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR WAFER AND METHOD OF BALL DROP ON THIN WAFER WITH EDGE...
- Publication number 20220028812
- Publication date Jan 27, 2022
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER-LEVEL PACKAGE INCLUDING UNDER BUMP METAL LAYER
- Publication number 20210358874
- Publication date Nov 18, 2021
- Samsung Electronics Co., Ltd.
- Hyung Sun JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE BONDING AREA INCLUDING FUSED SOLDER FILM AND M...
- Publication number 20210118831
- Publication date Apr 22, 2021
- LAPIS SEMICONDUCTOR CO., LTD.
- Masanori Shindo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE INCLUDING UNDER BUMP METAL LAYER
- Publication number 20210091026
- Publication date Mar 25, 2021
- Samsung Electronics Co., Ltd.
- Hyung Sun JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structures and Methods of Forming Same
- Publication number 20200343209
- Publication date Oct 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE INCLUDING UNDER BUMP METAL LAYER
- Publication number 20200161261
- Publication date May 21, 2020
- Samsung Electronics Co., Ltd.
- Hyung Sun JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Ball Protection in Packages
- Publication number 20200118947
- Publication date Apr 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING CONNECTOR PAD STRUCTURES, INTERCONNECT STRUCTURE...
- Publication number 20190244918
- Publication date Aug 8, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structures and Methods of Forming Same
- Publication number 20190244920
- Publication date Aug 8, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING SIDE MOLDING
- Publication number 20190172814
- Publication date Jun 6, 2019
- LBSEMICON CO., LTD.
- Do Hyung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package With UBM and Methods of Forming
- Publication number 20190103372
- Publication date Apr 4, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Ball Protection in Packages
- Publication number 20180337144
- Publication date Nov 22, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID LOW METAL LOADING FLUX
- Publication number 20180236609
- Publication date Aug 23, 2018
- Intel Corporation
- Rajen S. SIDHU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20180233472
- Publication date Aug 16, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- CHAO-WEN SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structures and Methods of Forming Same
- Publication number 20180226373
- Publication date Aug 9, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Connector Pad Structures, Interconnect Structure...
- Publication number 20180211928
- Publication date Jul 26, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHEET MOLDING PROCESS FOR WAFER LEVEL PACKAGING
- Publication number 20170372998
- Publication date Dec 28, 2017
- Yenhao Benjamin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Connecting Packages onto Printed Circuit B...
- Publication number 20170301645
- Publication date Oct 19, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT AND MANUFACTURING APP...
- Publication number 20170263585
- Publication date Sep 14, 2017
- Kabushiki Kaisha Toshiba
- Soichi HOMMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Connector Pad Structures, Interconnect Structure...
- Publication number 20170154862
- Publication date Jun 1, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING AND MANUFACTURING METHOD THEREOF
- Publication number 20170062369
- Publication date Mar 2, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- CHAO-WEN SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE WITH SELECTIVE SURFACE FINISHES FOR FLIP CHIP A...
- Publication number 20170040276
- Publication date Feb 9, 2017
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A SUBSTRATE STRUCTURE WITH SELECTIVE S...
- Publication number 20170040273
- Publication date Feb 9, 2017
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Devices and Methods of Manufacture Thereof
- Publication number 20170033064
- Publication date Feb 2, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICES
- Publication number 20160247772
- Publication date Aug 25, 2016
- RENESAS ELECTRONICS CORPORATION
- Takaomi Nishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICES
- Publication number 20160064343
- Publication date Mar 3, 2016
- Renesas Electronics Corporation
- Takaomi Nishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED INSULATOR IN PACKAGE ASSEMBLY
- Publication number 20150318191
- Publication date Nov 5, 2015
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A THROUGH-SUBSTRATE VIA
- Publication number 20140284793
- Publication date Sep 25, 2014
- Arkadii V. Samoilov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MOUNTING SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE
- Publication number 20140285989
- Publication date Sep 25, 2014
- Fujitsu Limited
- Takashi KUBOTA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Apparatus for Connecting Packages onto Printed Circuit B...
- Publication number 20140252593
- Publication date Sep 11, 2014
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS

Applying flux

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor wafer and method of ball drop on thin wafer with edge...

Wafer-level package including under bump metal layer

Semiconductor device and method of manufacturing the same

Wafer-level package including under bump metal layer

Semiconductor device bonding area including fused solder film and m...

Package with UBM and methods of forming

Semiconductor wafer and method of ball drop on thin wafer with edge...

Wafer-level package including under bump metal layer

Interconnect structures and methods of forming same

Solder ball protection in packages

Device packaging facility and method, and device processing apparat...

Semiconductor device and method of manufacturing the same

Semiconductor device bonding area including fused solder film and m...

Mechanisms for forming hybrid bonding structures with elongated bumps

Methods of forming connector pad structures, interconnect structure...

Wafer-level chip-scale package device having bump assemblies config...

Interconnect structures and methods of forming same

Package with UBM and methods of forming

Packaging devices and methods of manufacture thereof

Methods of forming connector pad structures, interconnect structure...

Solder ball protection in packages

Copper pillar bump structure and manufacturing method therefor

Manufacturing method of semiconductor package

Methods of forming connector pad structures, interconnect structure...

Interconnect structures and methods of forming same

Mechanisms for forming hybrid bonding structures with elongated bumps

Method and apparatus for connecting packages onto printed circuit b...

Methods of manufacturing printed circuit board and semiconductor pa...

Solder ball protection in packages

Strong, heat stable junction

Patents Applicationslast 30 patents

SEMICONDUCTOR WAFER AND METHOD OF BALL DROP ON THIN WAFER WITH EDGE...

WAFER-LEVEL PACKAGE INCLUDING UNDER BUMP METAL LAYER

SEMICONDUCTOR DEVICE BONDING AREA INCLUDING FUSED SOLDER FILM AND M...

WAFER-LEVEL PACKAGE INCLUDING UNDER BUMP METAL LAYER

Interconnect Structures and Methods of Forming Same

WAFER-LEVEL PACKAGE INCLUDING UNDER BUMP METAL LAYER

Solder Ball Protection in Packages

METHODS OF FORMING CONNECTOR PAD STRUCTURES, INTERCONNECT STRUCTURE...

Interconnect Structures and Methods of Forming Same

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING SIDE MOLDING

Package With UBM and Methods of Forming

Solder Ball Protection in Packages

HYBRID LOW METAL LOADING FLUX

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

Interconnect Structures and Methods of Forming Same

Methods of Forming Connector Pad Structures, Interconnect Structure...

SHEET MOLDING PROCESS FOR WAFER LEVEL PACKAGING

Method and Apparatus for Connecting Packages onto Printed Circuit B...

METHOD FOR MANUFACTURING ELECTRONIC COMPONENT AND MANUFACTURING APP...

Methods of Forming Connector Pad Structures, Interconnect Structure...

SEMICONDUCTOR PACKAGING AND MANUFACTURING METHOD THEREOF

SUBSTRATE STRUCTURE WITH SELECTIVE SURFACE FINISHES FOR FLIP CHIP A...

SEMICONDUCTOR PACKAGE HAVING A SUBSTRATE STRUCTURE WITH SELECTIVE S...

Packaging Devices and Methods of Manufacture Thereof

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICES

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICES

MOLDED INSULATOR IN PACKAGE ASSEMBLY

SEMICONDUCTOR DEVICE HAVING A THROUGH-SUBSTRATE VIA

METHOD OF MOUNTING SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE

Method and Apparatus for Connecting Packages onto Printed Circuit B...