Applying interconnections to be used for carrying current between separate components within a device

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00

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H01L2221/10Applying interconnections to be used for carrying current between separate components within a device

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of fabricating semiconductor package
- Patent number 12,218,001
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Zi-Jheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices with a polysilicon structure above a stairc...
- Patent number 12,218,081
- Issue date Feb 4, 2025
- Lodestar Licensing Group LLC
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanopore structures
- Patent number 12,210,011
- Issue date Jan 28, 2025
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanowire bonding interconnect for fine-pitch microelectronics
- Patent number 12,191,267
- Issue date Jan 7, 2025
- Adeia Semiconductor Technologies, LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective recessing to form a fully aligned via
- Patent number 12,183,634
- Issue date Dec 31, 2024
- Adeia Semiconductor Solutions LLC
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,165,920
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hwei-Jay Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems of forming metal interconnect layers using engi...
- Patent number 12,165,881
- Issue date Dec 10, 2024
- Rashid Mavliev
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor structure including a trench having a high aspect rat...
- Patent number 12,148,654
- Issue date Nov 19, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yong Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with damascene structur...
- Patent number 12,142,518
- Issue date Nov 12, 2024
- NANYA TECHNOLOGY CORPORATION
- Wei-Chen Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating semiconductor package
- Patent number 12,125,741
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Zi-Jheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guard ring and manufacturing method thereof
- Patent number 12,087,709
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement and method of making
- Patent number 12,074,059
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device and method for manufacturing the same
- Patent number 12,068,243
- Issue date Aug 20, 2024
- Kioxia Corporation
- Ryota Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming a protective layer to prevent formation of leakage paths
- Patent number 12,057,350
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Leo Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming components without adding tabs during etching
- Patent number 12,044,965
- Issue date Jul 23, 2024
- Hutchinson Technology Incorporated
- Clark T. Olsen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Combined Dolan bridge and quantum dot Josephson junction in series
- Patent number 12,041,859
- Issue date Jul 16, 2024
- International Business Machines Corporation
- Steven J. Holmes
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods of forming electronic devices comprising silicon carbide ma...
- Patent number 12,027,363
- Issue date Jul 2, 2024
- Micron Technology, Inc.
- Santanu Sarkar
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 12,029,032
- Issue date Jul 2, 2024
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having a conductive pillar and methods of man...
- Patent number 12,027,495
- Issue date Jul 2, 2024
- Samsung Electronics Co., Ltd.
- Kun Sil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Local contacts of three-dimensional memory devices and methods for...
- Patent number 12,022,656
- Issue date Jun 25, 2024
- Yangtze Memory Technologies Co., Ltd.
- Jianzhong Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,009,388
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Zheng-Long Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air gap seal for interconnect air gap and method of fabricating the...
- Patent number 11,996,353
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doped selective metal caps to improve copper electromigration with...
- Patent number 11,990,368
- Issue date May 21, 2024
- Applied Materials, Inc.
- Mehul B. Naik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation method of semiconductor structure
- Patent number 11,984,352
- Issue date May 14, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jun Xia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with spacers for self aligned vias
- Patent number 11,984,359
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Pokuan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Porogen bonded gap filling material in semiconductor manufacturing
- Patent number 11,984,316
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Jiun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a porous dielectric layer, and metho...
- Patent number 11,955,424
- Issue date Apr 9, 2024
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch damage and ESL free dual damascene metal interconnect
- Patent number 11,955,376
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sunil Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit devices and methods of manufacturing the same
- Patent number 11,929,393
- Issue date Mar 12, 2024
- Samsung Electronics Co., Ltd.
- Jungoo Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via connection to a partially filled trench
- Patent number 11,929,258
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH DAMASCENE STRUCTUR...
- Publication number 20250029871
- Publication date Jan 23, 2025
- NANYA TECHNOLOGY CORPORATION
- WEI-CHEN PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240429093
- Publication date Dec 26, 2024
- UNITED MICROELECTRONICS CORP.
- Chien-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...
- Publication number 20240413076
- Publication date Dec 12, 2024
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240404877
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsai-Ming HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED COPPER INTERCONNECTS WITH HYBRID MICROSTRUCTURE
- Publication number 20240387264
- Publication date Nov 21, 2024
- Adeia Semiconductor Solutions LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240379437
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- HWEI-JAY CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GUARD RING AND MANUFACTURING METHOD THEREOF
- Publication number 20240379586
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE FABRICATING METHOD
- Publication number 20240371784
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- Ji Soo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240371756
- Publication date Nov 7, 2024
- KIOXIA Corporation
- Ryota SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240355821
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- YUNG-CHIN HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE RECESSING TO FORM A FULLY ALIGNED VIA
- Publication number 20240347383
- Publication date Oct 17, 2024
- Adeia Semiconductor Solutions LLC
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES COMPRISING SILICON CARBIDE MATERIALS
- Publication number 20240332002
- Publication date Oct 3, 2024
- Micron Technology, Inc.
- Santanu Sarkar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20240315018
- Publication date Sep 19, 2024
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Air Gap Seal for Interconnect Air Gap and Method of Fabricating The...
- Publication number 20240312876
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SPACERS FOR SELF ALIGNED VIAS
- Publication number 20240297077
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Pokuan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ASSEMBLED GUIDED HOLE AND VIA PATTERNING OVER GRATING
- Publication number 20240290651
- Publication date Aug 29, 2024
- Intel Corporation
- Florian Gstrein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240290824
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Zheng-Long CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA CONNECTION TO A PARTIALLY FILLED TRENCH
- Publication number 20240213034
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20240186369
- Publication date Jun 6, 2024
- Samsung Electronics Co., Ltd.
- Jungoo Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE ASSEMBLY
- Publication number 20240153903
- Publication date May 9, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Katleen Fajardo Timbol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL DEPOSITION OF SILICON CARBIDE FILMS
- Publication number 20240145234
- Publication date May 2, 2024
- Novellus Systems, Inc.
- Bhadri N. Varadarajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR PREPARING THE SAME
- Publication number 20240087895
- Publication date Mar 14, 2024
- NANYA TECHNOLOGY CORPORATION
- Cheng-Hsiang FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Contact Structure and Method of Forming the Same in a Semicon...
- Publication number 20240087953
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING INTERCONNECTION STRUCTURE
- Publication number 20240071924
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Jungil PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20240071814
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zi-Jheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING A COLORED CONDUCTIVE RIBBON FOR INTEGRATION IN A...
- Publication number 20230411541
- Publication date Dec 21, 2023
- The Solaria Corporation
- Lisong Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOWIRE-BASED INTERCONNECTS FOR SUB-MILLIMETER WAVE INTEGRATED CIR...
- Publication number 20230411221
- Publication date Dec 21, 2023
- Regents of the University of Minnesota
- Rhonda Franklin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH CONTACT STRUCTURE
- Publication number 20230386900
- Publication date Nov 30, 2023
- NANYA TECHNOLOGY CORPORATION
- CHIH-HSUAN YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230387125
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lien HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR PREPARING THE SAME
- Publication number 20230386842
- Publication date Nov 30, 2023
- NANYA TECHNOLOGY CORPORATION
- Cheng-Hsiang FAN
- H01 - BASIC ELECTRIC ELEMENTS

Applying interconnections to be used for carrying current between separate components within a device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and method of fabricating semiconductor package

Microelectronic devices with a polysilicon structure above a stairc...

Nanopore structures

Nanowire bonding interconnect for fine-pitch microelectronics

Selective recessing to form a fully aligned via

Semiconductor structure and method for forming the same

Methods and systems of forming metal interconnect layers using engi...

Semiconductor structure including a trench having a high aspect rat...

Method for fabricating semiconductor device with damascene structur...

Semiconductor package and method of fabricating semiconductor package

Guard ring and manufacturing method thereof

Semiconductor arrangement and method of making

Semiconductor storage device and method for manufacturing the same

Forming a protective layer to prevent formation of leakage paths

Method for forming components without adding tabs during etching

Combined Dolan bridge and quantum dot Josephson junction in series

Methods of forming electronic devices comprising silicon carbide ma...

Integrated assemblies and methods of forming integrated assemblies

Semiconductor devices having a conductive pillar and methods of man...

Local contacts of three-dimensional memory devices and methods for...

Semiconductor device and manufacturing method thereof

Air gap seal for interconnect air gap and method of fabricating the...

Doped selective metal caps to improve copper electromigration with...

Formation method of semiconductor structure

Semiconductor device with spacers for self aligned vias

Porogen bonded gap filling material in semiconductor manufacturing

Semiconductor device including a porous dielectric layer, and metho...

Etch damage and ESL free dual damascene metal interconnect

Integrated circuit devices and methods of manufacturing the same

Via connection to a partially filled trench

Patents Applicationslast 30 patents

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH DAMASCENE STRUCTUR...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE

ADVANCED COPPER INTERCONNECTS WITH HYBRID MICROSTRUCTURE

SEMICONDUCTOR STRUCTURE

GUARD RING AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE FABRICATING METHOD

SEMICONDUCTOR STORAGE DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

SELECTIVE RECESSING TO FORM A FULLY ALIGNED VIA

ELECTRONIC DEVICES COMPRISING SILICON CARBIDE MATERIALS

Integrated Assemblies and Methods of Forming Integrated Assemblies

Air Gap Seal for Interconnect Air Gap and Method of Fabricating The...

SEMICONDUCTOR DEVICE WITH SPACERS FOR SELF ALIGNED VIAS

SELF-ASSEMBLED GUIDED HOLE AND VIA PATTERNING OVER GRATING

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

VIA CONNECTION TO A PARTIALLY FILLED TRENCH

INTEGRATED CIRCUIT DEVICES AND METHODS OF MANUFACTURING THE SAME

FLIP CHIP PACKAGE ASSEMBLY

CONFORMAL DEPOSITION OF SILICON CARBIDE FILMS

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR PREPARING THE SAME

Metal Contact Structure and Method of Forming the Same in a Semicon...

INTEGRATED CIRCUIT DEVICE INCLUDING INTERCONNECTION STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

METHODS OF FORMING A COLORED CONDUCTIVE RIBBON FOR INTEGRATION IN A...

NANOWIRE-BASED INTERCONNECTS FOR SUB-MILLIMETER WAVE INTEGRATED CIR...

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH CONTACT STRUCTURE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR PREPARING THE SAME