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Applying interconnections to be used for carrying current between separate components within a device
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last 30 patents
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Semiconductor package and method of fabricating semiconductor package
Patent number
12,218,001
Issue date
Feb 4, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Zi-Jheng Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic devices with a polysilicon structure above a stairc...
Patent number
12,218,081
Issue date
Feb 4, 2025
Lodestar Licensing Group LLC
Jivaan Kishore Jhothiraman
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Nanopore structures
Patent number
12,210,011
Issue date
Jan 28, 2025
International Business Machines Corporation
Kangguo Cheng
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Nanowire bonding interconnect for fine-pitch microelectronics
Patent number
12,191,267
Issue date
Jan 7, 2025
Adeia Semiconductor Technologies, LLC
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Selective recessing to form a fully aligned via
Patent number
12,183,634
Issue date
Dec 31, 2024
Adeia Semiconductor Solutions LLC
Benjamin D. Briggs
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor structure and method for forming the same
Patent number
12,165,920
Issue date
Dec 10, 2024
Taiwan Semiconductor Manufacturing Company Ltd.
Hwei-Jay Chu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Methods and systems of forming metal interconnect layers using engi...
Patent number
12,165,881
Issue date
Dec 10, 2024
Rashid Mavliev
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
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Patent Grant
Semiconductor structure including a trench having a high aspect rat...
Patent number
12,148,654
Issue date
Nov 19, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC.
Yong Lu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method for fabricating semiconductor device with damascene structur...
Patent number
12,142,518
Issue date
Nov 12, 2024
NANYA TECHNOLOGY CORPORATION
Wei-Chen Pan
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package and method of fabricating semiconductor package
Patent number
12,125,741
Issue date
Oct 22, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Zi-Jheng Liu
H01 - BASIC ELECTRIC ELEMENTS
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Guard ring and manufacturing method thereof
Patent number
12,087,709
Issue date
Sep 10, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Jen-Yuan Chang
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor arrangement and method of making
Patent number
12,074,059
Issue date
Aug 27, 2024
Taiwan Semiconductor Manufacturing Company Limited
Hsi-Wen Tien
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor storage device and method for manufacturing the same
Patent number
12,068,243
Issue date
Aug 20, 2024
Kioxia Corporation
Ryota Suzuki
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Forming a protective layer to prevent formation of leakage paths
Patent number
12,057,350
Issue date
Aug 6, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Leo Hsu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method for forming components without adding tabs during etching
Patent number
12,044,965
Issue date
Jul 23, 2024
Hutchinson Technology Incorporated
Clark T. Olsen
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Grant
Combined Dolan bridge and quantum dot Josephson junction in series
Patent number
12,041,859
Issue date
Jul 16, 2024
International Business Machines Corporation
Steven J. Holmes
G06 - COMPUTING CALCULATING COUNTING
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Methods of forming electronic devices comprising silicon carbide ma...
Patent number
12,027,363
Issue date
Jul 2, 2024
Micron Technology, Inc.
Santanu Sarkar
C01 - INORGANIC CHEMISTRY
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Integrated assemblies and methods of forming integrated assemblies
Patent number
12,029,032
Issue date
Jul 2, 2024
Micron Technology, Inc.
Justin B. Dorhout
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor devices having a conductive pillar and methods of man...
Patent number
12,027,495
Issue date
Jul 2, 2024
Samsung Electronics Co., Ltd.
Kun Sil Lee
H01 - BASIC ELECTRIC ELEMENTS
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Local contacts of three-dimensional memory devices and methods for...
Patent number
12,022,656
Issue date
Jun 25, 2024
Yangtze Memory Technologies Co., Ltd.
Jianzhong Wu
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device and manufacturing method thereof
Patent number
12,009,388
Issue date
Jun 11, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Zheng-Long Chen
H01 - BASIC ELECTRIC ELEMENTS
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Air gap seal for interconnect air gap and method of fabricating the...
Patent number
11,996,353
Issue date
May 28, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Xusheng Wu
H01 - BASIC ELECTRIC ELEMENTS
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Doped selective metal caps to improve copper electromigration with...
Patent number
11,990,368
Issue date
May 21, 2024
Applied Materials, Inc.
Mehul B. Naik
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Formation method of semiconductor structure
Patent number
11,984,352
Issue date
May 14, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC.
Jun Xia
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device with spacers for self aligned vias
Patent number
11,984,359
Issue date
May 14, 2024
Taiwan Semiconductor Manufacturing Company Limited
Pokuan Ho
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Porogen bonded gap filling material in semiconductor manufacturing
Patent number
11,984,316
Issue date
May 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Bo-Jiun Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device including a porous dielectric layer, and metho...
Patent number
11,955,424
Issue date
Apr 9, 2024
Adeia Semiconductor Solutions LLC
Benjamin David Briggs
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Etch damage and ESL free dual damascene metal interconnect
Patent number
11,955,376
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Sunil Kumar Singh
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Integrated circuit devices and methods of manufacturing the same
Patent number
11,929,393
Issue date
Mar 12, 2024
Samsung Electronics Co., Ltd.
Jungoo Kang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Via connection to a partially filled trench
Patent number
11,929,258
Issue date
Mar 12, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Shih-Ming Chang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH DAMASCENE STRUCTUR...
Publication number
20250029871
Publication date
Jan 23, 2025
NANYA TECHNOLOGY CORPORATION
WEI-CHEN PAN
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
Publication number
20240429093
Publication date
Dec 26, 2024
UNITED MICROELECTRONICS CORP.
Chien-Ting Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...
Publication number
20240413076
Publication date
Dec 12, 2024
Adeia Semiconductor Solutions LLC
Benjamin David Briggs
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20240404877
Publication date
Dec 5, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Tsai-Ming HUANG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
ADVANCED COPPER INTERCONNECTS WITH HYBRID MICROSTRUCTURE
Publication number
20240387264
Publication date
Nov 21, 2024
Adeia Semiconductor Solutions LLC
Daniel C. Edelstein
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR STRUCTURE
Publication number
20240379437
Publication date
Nov 14, 2024
Taiwan Semiconductor Manufacturing company Ltd.
HWEI-JAY CHU
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
GUARD RING AND MANUFACTURING METHOD THEREOF
Publication number
20240379586
Publication date
Nov 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Jen-Yuan CHANG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE FABRICATING METHOD
Publication number
20240371784
Publication date
Nov 7, 2024
Samsung Electronics Co., Ltd.
Ji Soo Park
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR STORAGE DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20240371756
Publication date
Nov 7, 2024
KIOXIA Corporation
Ryota SUZUKI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
Publication number
20240355821
Publication date
Oct 24, 2024
Taiwan Semiconductor Manufacturing company Ltd.
YUNG-CHIN HOU
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SELECTIVE RECESSING TO FORM A FULLY ALIGNED VIA
Publication number
20240347383
Publication date
Oct 17, 2024
Adeia Semiconductor Solutions LLC
Benjamin D. Briggs
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
ELECTRONIC DEVICES COMPRISING SILICON CARBIDE MATERIALS
Publication number
20240332002
Publication date
Oct 3, 2024
Micron Technology, Inc.
Santanu Sarkar
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
Publication number
20240315018
Publication date
Sep 19, 2024
Micron Technology, Inc.
Justin B. Dorhout
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Air Gap Seal for Interconnect Air Gap and Method of Fabricating The...
Publication number
20240312876
Publication date
Sep 19, 2024
Taiwan Semiconductor Manufacturing Co., LTD
Xusheng Wu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE WITH SPACERS FOR SELF ALIGNED VIAS
Publication number
20240297077
Publication date
Sep 5, 2024
Taiwan Semiconductor Manufacturing Company Limited
Pokuan Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELF-ASSEMBLED GUIDED HOLE AND VIA PATTERNING OVER GRATING
Publication number
20240290651
Publication date
Aug 29, 2024
Intel Corporation
Florian Gstrein
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20240290824
Publication date
Aug 29, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Zheng-Long CHEN
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
VIA CONNECTION TO A PARTIALLY FILLED TRENCH
Publication number
20240213034
Publication date
Jun 27, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Shih-Ming Chang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
INTEGRATED CIRCUIT DEVICES AND METHODS OF MANUFACTURING THE SAME
Publication number
20240186369
Publication date
Jun 6, 2024
Samsung Electronics Co., Ltd.
Jungoo Kang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
FLIP CHIP PACKAGE ASSEMBLY
Publication number
20240153903
Publication date
May 9, 2024
TEXAS INSTRUMENTS INCORPORATED
Katleen Fajardo Timbol
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
CONFORMAL DEPOSITION OF SILICON CARBIDE FILMS
Publication number
20240145234
Publication date
May 2, 2024
Novellus Systems, Inc.
Bhadri N. Varadarajan
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR PREPARING THE SAME
Publication number
20240087895
Publication date
Mar 14, 2024
NANYA TECHNOLOGY CORPORATION
Cheng-Hsiang FAN
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Metal Contact Structure and Method of Forming the Same in a Semicon...
Publication number
20240087953
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING INTERCONNECTION STRUCTURE
Publication number
20240071924
Publication date
Feb 29, 2024
Samsung Electronics Co., Ltd.
Jungil PARK
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
Publication number
20240071814
Publication date
Feb 29, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Zi-Jheng Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF FORMING A COLORED CONDUCTIVE RIBBON FOR INTEGRATION IN A...
Publication number
20230411541
Publication date
Dec 21, 2023
The Solaria Corporation
Lisong Zhou
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
NANOWIRE-BASED INTERCONNECTS FOR SUB-MILLIMETER WAVE INTEGRATED CIR...
Publication number
20230411221
Publication date
Dec 21, 2023
Regents of the University of Minnesota
Rhonda Franklin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH CONTACT STRUCTURE
Publication number
20230386900
Publication date
Nov 30, 2023
NANYA TECHNOLOGY CORPORATION
CHIH-HSUAN YEH
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR PREPARING THE SAME
Publication number
20230386842
Publication date
Nov 30, 2023
NANYA TECHNOLOGY CORPORATION
Cheng-Hsiang FAN
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20230387125
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Lien HUANG
H01 - BASIC ELECTRIC ELEMENTS