Applying interconnections to be used for carrying current between separate components within a device

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H01L2221/10

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00

Current Industry

H01L2221/10Applying interconnections to be used for carrying current between separate components within a device

Industries

Patents Grantslast 30 patents

Information Patent Grant
Formation method of semiconductor structure
- Patent number 11,984,352
- Issue date May 14, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jun Xia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with spacers for self aligned vias
- Patent number 11,984,359
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Pokuan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Porogen bonded gap filling material in semiconductor manufacturing
- Patent number 11,984,316
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Jiun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a porous dielectric layer, and metho...
- Patent number 11,955,424
- Issue date Apr 9, 2024
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch damage and ESL free dual damascene metal interconnect
- Patent number 11,955,376
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sunil Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit devices and methods of manufacturing the same
- Patent number 11,929,393
- Issue date Mar 12, 2024
- Samsung Electronics Co., Ltd.
- Jungoo Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via connection to a partially filled trench
- Patent number 11,929,258
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming nanostructures utilizing self-assembled nucleic...
- Patent number 11,923,197
- Issue date Mar 5, 2024
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing a FinFET by implanting a dielectric with a...
- Patent number 11,901,455
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Hao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,894,269
- Issue date Feb 6, 2024
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal deposition of silicon carbide films
- Patent number 11,894,227
- Issue date Feb 6, 2024
- Novellus Systems, Inc.
- Bhadri N. Varadarajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Advanced copper interconnects with hybrid microstructure
- Patent number 11,881,433
- Issue date Jan 23, 2024
- TESSERA LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package assembly
- Patent number 11,876,065
- Issue date Jan 16, 2024
- Texas Instruments Incorporated
- Katleen Fajardo Timbol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a colored conductive ribbon for integration in a...
- Patent number 11,876,139
- Issue date Jan 16, 2024
- SOLARCA LLC
- Lisong Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring formation method, method for manufacturing semiconductor dev...
- Patent number 11,869,866
- Issue date Jan 9, 2024
- Kioxia Corporation
- Ryoichi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating semiconductor package
- Patent number 11,862,512
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Zi-Jheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal contact structure and method of forming the same in a semicon...
- Patent number 11,854,874
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with air-gaps
- Patent number 11,842,962
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective recessing to form a fully aligned via
- Patent number 11,837,501
- Issue date Dec 5, 2023
- TESSERA LLC
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,837,515
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yin-Jie Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 11,817,351
- Issue date Nov 14, 2023
- SK hynix Inc.
- Ki-Hong Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and manufacturing method of the semicon...
- Patent number 11,812,615
- Issue date Nov 7, 2023
- SK hynix Inc.
- Nam Jae Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for preparing semiconductor device including conductive cont...
- Patent number 11,791,264
- Issue date Oct 17, 2023
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device structure with fine patte...
- Patent number 11,776,813
- Issue date Oct 3, 2023
- NANYA TECHNOLOGY CORPORATION
- Cheng-Hsiang Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement and method of making
- Patent number 11,776,845
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a semiconductor device having an air spacer
- Patent number 11,769,770
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor structure
- Patent number 11,764,062
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ping-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor devices
- Patent number 11,764,107
- Issue date Sep 19, 2023
- Samsung Electronics Co., Ltd.
- Byoungdeog Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems of forming metal interconnect layers using engi...
- Patent number 11,756,800
- Issue date Sep 12, 2023
- Rashid Mavliev
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Methods of forming an apparatus including laminate spacer structures
- Patent number 11,729,964
- Issue date Aug 15, 2023
- Micron Technology, Inc.
- Silvia Borsari
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLIP CHIP PACKAGE ASSEMBLY
- Publication number 20240153903
- Publication date May 9, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Katleen Fajardo Timbol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL DEPOSITION OF SILICON CARBIDE FILMS
- Publication number 20240145234
- Publication date May 2, 2024
- Novellus Systems, Inc.
- Bhadri N. Varadarajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR PREPARING THE SAME
- Publication number 20240087895
- Publication date Mar 14, 2024
- NANYA TECHNOLOGY CORPORATION
- Cheng-Hsiang FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Contact Structure and Method of Forming the Same in a Semicon...
- Publication number 20240087953
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING INTERCONNECTION STRUCTURE
- Publication number 20240071924
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Jungil PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20240071814
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zi-Jheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING A COLORED CONDUCTIVE RIBBON FOR INTEGRATION IN A...
- Publication number 20230411541
- Publication date Dec 21, 2023
- The Solaria Corporation
- Lisong Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOWIRE-BASED INTERCONNECTS FOR SUB-MILLIMETER WAVE INTEGRATED CIR...
- Publication number 20230411221
- Publication date Dec 21, 2023
- Regents of the University of Minnesota
- Rhonda Franklin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH CONTACT STRUCTURE
- Publication number 20230386900
- Publication date Nov 30, 2023
- NANYA TECHNOLOGY CORPORATION
- CHIH-HSUAN YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR PREPARING THE SAME
- Publication number 20230386842
- Publication date Nov 30, 2023
- NANYA TECHNOLOGY CORPORATION
- Cheng-Hsiang FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230387125
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lien HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20230386947
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yin-Jie Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20230377951
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zi-Jheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING
- Publication number 20230369099
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Hsi-Wen TIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS OF FORMING METAL INTERCONNECT LAYERS USING ENGI...
- Publication number 20230369065
- Publication date Nov 16, 2023
- Rashid Mavliev
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MICROELECTRONIC DEVICES WITH A POLYSILICON STRUCTURE ABOVE A STAIRC...
- Publication number 20230361053
- Publication date Nov 9, 2023
- Lodestar Licensing Group, LLC
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...
- Publication number 20230361023
- Publication date Nov 9, 2023
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR GAP SPACER FOR METAL GATES
- Publication number 20230352480
- Publication date Nov 2, 2023
- TESSERA LLC
- Marc A. Bergendahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH DAMASCENE STRUCTURE
- Publication number 20230307288
- Publication date Sep 28, 2023
- NANYA TECHNOLOGY CORPORATION
- WEI-CHEN PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH DAMASCENE STRUCTUR...
- Publication number 20230307289
- Publication date Sep 28, 2023
- NANYA TECHNOLOGY CORPORATION
- WEI-CHEN PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Porogen Bonded Gap Filling Material In Semiconductor Manufacturing
- Publication number 20230299003
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Jiun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230268276
- Publication date Aug 24, 2023
- Samsung Electronics Co., Ltd.
- Sang Hoon AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nanopore Structures
- Publication number 20230258622
- Publication date Aug 17, 2023
- International Business Machines Corporation
- Kangguo Cheng
- B82 - NANO-TECHNOLOGY
Information Patent Application
COMBINED DOLAN BRIDGE AND QUANTUM DOT JOSEPHSON JUNCTION IN SERIES
- Publication number 20230247917
- Publication date Aug 3, 2023
- International Business Machines Corporation
- Steven J. Holmes
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONFORMAL DEPOSITION OF SILICON CARBIDE FILMS USING HETEROGENEOUS P...
- Publication number 20230203646
- Publication date Jun 29, 2023
- LAM RESEARCH CORPORATION
- Matthew Scott WEIMER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20230209822
- Publication date Jun 29, 2023
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ASSEMBLED MONOLAYER FOR SELECTIVE DEPOSITION
- Publication number 20230197508
- Publication date Jun 22, 2023
- Applied Materials, Inc.
- Xiangjin Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCAL CONTACTS OF THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR...
- Publication number 20230171961
- Publication date Jun 1, 2023
- Yangtze Memory Technologies Co., Ltd.
- Jianzhong Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPLACEMENT CONDUCTIVE MATERIAL FOR INTERCONNECT FEATURES
- Publication number 20230163024
- Publication date May 25, 2023
- Intel Corporation
- Prashant Majhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20230163164
- Publication date May 25, 2023
- Samsung Electronics Co., Ltd.
- Jungoo Kang
- H01 - BASIC ELECTRIC ELEMENTS

Applying interconnections to be used for carrying current between separate components within a device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Formation method of semiconductor structure

Semiconductor device with spacers for self aligned vias

Porogen bonded gap filling material in semiconductor manufacturing

Semiconductor device including a porous dielectric layer, and metho...

Etch damage and ESL free dual damascene metal interconnect

Integrated circuit devices and methods of manufacturing the same

Via connection to a partially filled trench

Methods of forming nanostructures utilizing self-assembled nucleic...

Method of manufacturing a FinFET by implanting a dielectric with a...

Integrated assemblies and methods of forming integrated assemblies

Conformal deposition of silicon carbide films

Advanced copper interconnects with hybrid microstructure

Flip chip package assembly

Methods of forming a colored conductive ribbon for integration in a...

Wiring formation method, method for manufacturing semiconductor dev...

Semiconductor package and method of fabricating semiconductor package

Metal contact structure and method of forming the same in a semicon...

Interconnect structure with air-gaps

Selective recessing to form a fully aligned via

Semiconductor device and method

Method for fabricating semiconductor device

Semiconductor memory device and manufacturing method of the semicon...

Method for preparing semiconductor device including conductive cont...

Method for preparing semiconductor device structure with fine patte...

Semiconductor arrangement and method of making

Methods of forming a semiconductor device having an air spacer

Method of forming semiconductor structure

Methods of manufacturing semiconductor devices

Methods and systems of forming metal interconnect layers using engi...

Methods of forming an apparatus including laminate spacer structures

Patents Applicationslast 30 patents

FLIP CHIP PACKAGE ASSEMBLY

CONFORMAL DEPOSITION OF SILICON CARBIDE FILMS

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR PREPARING THE SAME

Metal Contact Structure and Method of Forming the Same in a Semicon...

INTEGRATED CIRCUIT DEVICE INCLUDING INTERCONNECTION STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

METHODS OF FORMING A COLORED CONDUCTIVE RIBBON FOR INTEGRATION IN A...

NANOWIRE-BASED INTERCONNECTS FOR SUB-MILLIMETER WAVE INTEGRATED CIR...

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH CONTACT STRUCTURE

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR PREPARING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING

METHODS AND SYSTEMS OF FORMING METAL INTERCONNECT LAYERS USING ENGI...

MICROELECTRONIC DEVICES WITH A POLYSILICON STRUCTURE ABOVE A STAIRC...

SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...

AIR GAP SPACER FOR METAL GATES

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH DAMASCENE STRUCTURE

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH DAMASCENE STRUCTUR...

Porogen Bonded Gap Filling Material In Semiconductor Manufacturing

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Nanopore Structures

COMBINED DOLAN BRIDGE AND QUANTUM DOT JOSEPHSON JUNCTION IN SERIES

CONFORMAL DEPOSITION OF SILICON CARBIDE FILMS USING HETEROGENEOUS P...

Integrated Assemblies and Methods of Forming Integrated Assemblies

SELF-ASSEMBLED MONOLAYER FOR SELECTIVE DEPOSITION

LOCAL CONTACTS OF THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR...

REPLACEMENT CONDUCTIVE MATERIAL FOR INTERCONNECT FEATURES

INTEGRATED CIRCUIT DEVICES AND METHODS OF MANUFACTURING THE SAME