Membership
Tour
Register
Log in
Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
Follow
Industry
CPC
H01L21/768
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Current Industry
H01L21/768
Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
Industries
Overview
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Metal-insulator-metal capacitor with top contact
Patent number
11,973,020
Issue date
Apr 30, 2024
QUALCOMM Incorporated
John Jianhong Zhu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked via structure
Patent number
11,973,023
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Po-Han Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and methods of forming the same
Patent number
11,973,027
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Pei-Yu Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Singulation process for chiplets
Patent number
11,972,970
Issue date
Apr 30, 2024
HRL Laboratories, LLC
Florian G. Herrault
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Self-aligned barrier for metal vias
Patent number
11,972,974
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Sung-Li Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device structure with inner spacer layer and method f...
Patent number
11,973,129
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Han-Yu Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing a semiconductor package including correctin...
Patent number
11,972,966
Issue date
Apr 30, 2024
Samsung Electronics Co., Ltd.
Gyujin Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
1D vertical edge blocking (VEB) via and plug
Patent number
11,972,979
Issue date
Apr 30, 2024
Intel Corporation
Leonard P. Guler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method forming the same
Patent number
11,973,021
Issue date
Apr 30, 2024
Vanguard International Semiconductor Corporation
Kai-Chun Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for depositing a gap-fill layer by plasma-assisted deposition
Patent number
11,972,944
Issue date
Apr 30, 2024
ASM IP Holding B.V.
Timothee Julien Vincent Blanquart
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Semiconductor device
Patent number
11,973,113
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chia-Chung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,973,117
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chun-Hsien Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming the same
Patent number
11,973,149
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Company Ltd.
Yu-Hsing Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Atomic layer deposition on 3D NAND structures
Patent number
11,972,952
Issue date
Apr 30, 2024
Lam Research Corporation
Ruopeng Deng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of making a three-dimensional memory device using composite...
Patent number
11,972,954
Issue date
Apr 30, 2024
SanDisk Technologies LLC
Roshan Jayakhar Tirukkonda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fabrication of rigid close-pitch interconnects
Patent number
11,972,977
Issue date
Apr 30, 2024
International Business Machines Corporation
Chanro Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Redistribution substrate, method of fabricating the same, and semic...
Patent number
11,973,028
Issue date
Apr 30, 2024
Samsung Electronics Co., Ltd.
Jongyoun Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Nanotwin copper materials in semiconductor devices
Patent number
11,973,034
Issue date
Apr 30, 2024
Applied Materials, Inc.
Eric J. Bergman
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Semiconductor structure and method of manufacturing a semiconductor...
Patent number
11,972,973
Issue date
Apr 30, 2024
Chun-Ming Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Planarization system, planarization process, and method of manufact...
Patent number
11,972,976
Issue date
Apr 30, 2024
Canon Kabushiki Kaisha
Byung-Jin Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive via of integrated circuitry, memory array comprising str...
Patent number
11,972,978
Issue date
Apr 30, 2024
Micron Technology, Inc.
Yiping Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor memory device
Patent number
11,973,024
Issue date
Apr 30, 2024
Kioxia Corporation
Hisashi Kato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor memory device and electronic system including the same
Patent number
11,973,035
Issue date
Apr 30, 2024
Samsung Electronics Co., Ltd.
Ha-Min Hwang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device structure having air gap and method for formin...
Patent number
11,972,975
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Hsi-Wen Tien
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
SRAM layout for double patterning
Patent number
11,974,421
Issue date
Apr 30, 2024
Texas Instruments Incorporated
James Walter Blatchford
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method probe with high density electrodes, and a formation thereof
Patent number
11,963,774
Issue date
Apr 23, 2024
International Business Machines Corporation
Kangguo Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Self-assembled monolayer for selective deposition
Patent number
11,967,523
Issue date
Apr 23, 2024
Applied Materials, Inc.
Xiangjin Xie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fully aligned subtractive processes and electronic devices therefrom
Patent number
11,967,527
Issue date
Apr 23, 2024
Applied Materials, Inc.
He Ren
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure with via extending across adjacent conducti...
Patent number
11,967,550
Issue date
Apr 23, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Shu-Wei Chung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and manufacturing method of the same
Patent number
11,967,553
Issue date
Apr 23, 2024
Taiwan Semiconductor Manufacturing Company Ltd.
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHOD OF PATTERNING UNDERLYING STRUCTURE
Publication number
20240145244
Publication date
May 2, 2024
Powerchip Semiconductor Manufacturing Corporation
Yun-An Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
VIA-FIRST SELF-ALIGNED INTERCONNECT FORMATION PROCESS
Publication number
20240145297
Publication date
May 2, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu-Tse Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL THIN-FILM PRECURSOR COMPOSITION, METHOD OF FORMING THIN FILM...
Publication number
20240145301
Publication date
May 2, 2024
Soulbrain Co., LTD
Chang Bong YEON
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
DECOUPLING CAPACITANCE IN BACKSIDE INTERCONNECT
Publication number
20240145376
Publication date
May 2, 2024
International Business Machines Corporation
Rajiv Joshi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING MULTI-DIMENSION THROUGH SILICON VIA...
Publication number
20240145435
Publication date
May 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Ke-Gang Wen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR FILM PLATING PERIMETER MAPPING AND COMPENSATION
Publication number
20240145251
Publication date
May 2, 2024
Applied Materials, Inc.
Kyle M. Hanson
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
SELF-ALIGNED GATE ENDCAP (SAGE) ARCHITECTURE HAVING GATE CONTACTS
Publication number
20240145477
Publication date
May 2, 2024
Intel Corporation
Sairam Subramanian
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Fin Field-Effect Transistor Device Having Contact Plugs with Re-Ent...
Publication number
20240145597
Publication date
May 2, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu-Lien Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PLANARIZATION STRUCTURE FOR MIM TOPOGRAPHY
Publication number
20240145377
Publication date
May 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Liang-Shiuan Peng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
VIA WITH SACRIFICIAL STRESS BARRIER RING
Publication number
20240145378
Publication date
May 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Tzu-Ting Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPOSITE DIELECTRIC STRUCTURES FOR SEMICONDUCTOR DIE ASSEMBLIES AN...
Publication number
20240145436
Publication date
May 2, 2024
Micron Technology, Inc.
Hung Cheng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
Publication number
20240145366
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Dongjoon Oh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE DIMENSIONAL INTEGRATED CIRCUIT WITH INTERCONNECT NETWORK LAYER
Publication number
20240145459
Publication date
May 2, 2024
Silicon Genesis Corporation
Michael I. CURRENT
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Cross-Wafer RDLs in Constructed Wafers
Publication number
20240145257
Publication date
May 2, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS FOR PRODUCING A 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH...
Publication number
20240145289
Publication date
May 2, 2024
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Application
STAIRCASE FORMATION IN THREE-DIMENSIONAL MEMORY DEVICE
Publication number
20240145296
Publication date
May 2, 2024
Yangtze Memory Technologies Co., Ltd.
Yu Ting ZHOU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELECTIVE THIN FILM FORMATION METHOD AND METHOD OF MANUFACTURING SE...
Publication number
20240145303
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Sunhye HWANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR COMPONENTS HAVING CONDUCTIVE VIAS WITH ALIGNED BACK S...
Publication number
20240145305
Publication date
May 2, 2024
Micron Technology, Inc.
Jin Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BARRIER STRUCTURE ON INTERCONNECT WIRE TO INCREASE PROCESSING WINDO...
Publication number
20240145380
Publication date
May 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsin-Chieh Yao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF
Publication number
20240145391
Publication date
May 2, 2024
Tahoe Research, Ltd.
Christopher J. JEZEWSKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONFORMAL DEPOSITION OF SILICON CARBIDE FILMS
Publication number
20240145234
Publication date
May 2, 2024
Novellus Systems, Inc.
Bhadri N. Varadarajan
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20240145295
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Jihyun LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DOPING FREE CONNECTION STRUCTURES AND METHODS
Publication number
20240145298
Publication date
May 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Shih-Min Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20240145304
Publication date
May 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Han Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
VIA STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20240145344
Publication date
May 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Tsung-Chieh Hsiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED...
Publication number
20240147727
Publication date
May 2, 2024
Lodestar Licensing Group LLC
Lifang Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING A FINFET BY IMPLANTING A DIELECTRIC WITH A...
Publication number
20240145596
Publication date
May 2, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Su-Hao Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE AND METHOD TO IMPROVE FAV RIE PROCESS MARGIN AND ELECTROM...
Publication number
20240145299
Publication date
May 2, 2024
TESSERA LLC
Benjamin David Briggs
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Buffer Layer for Dielectric Protection in Physical Vapor Deposition...
Publication number
20240145300
Publication date
May 2, 2024
Sahil PATEL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING INTERCONNECTING M...
Publication number
20240145302
Publication date
May 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Shien SHIAH
H01 - BASIC ELECTRIC ELEMENTS