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applying isostatic pressure
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CPC
H01L2224/80211
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/80211
applying isostatic pressure
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Patents Grants
last 30 patents
Information
Patent Grant
Method for bonding semiconductor devices, method for forming semico...
Patent number
11,916,037
Issue date
Feb 27, 2024
Taiwan Semiconductor Manufacturing Company Ltd.
Jen-Yuan Chang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHOD FOR BONDING SEMICONDUCTOR DEVICES, METHOD FOR FORMING SEMICO...
Publication number
20230238354
Publication date
Jul 27, 2023
Taiwan Semiconductor Manufacturing company Ltd.
JEN-YUAN CHANG
H01 - BASIC ELECTRIC ELEMENTS