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applying isostatic pressure
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H01L2224/80211
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/80211
applying isostatic pressure
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last 30 patents
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Patent Grant
Method for bonding semiconductor devices, method for forming semico...
Patent number
11,916,037
Issue date
Feb 27, 2024
Taiwan Semiconductor Manufacturing Company Ltd.
Jen-Yuan Chang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
METHOD FOR BONDING SEMICONDUCTOR DEVICES, METHOD FOR FORMING SEMICO...
Publication number
20230238354
Publication date
Jul 27, 2023
Taiwan Semiconductor Manufacturing company Ltd.
JEN-YUAN CHANG
H01 - BASIC ELECTRIC ELEMENTS