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Applying or finishing the circuit pattern after another process
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H05K2203/1461
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ELECTRICITY
H05
Electric techniques
H05K
PRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2203/00
Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
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H05K2203/1461
Applying or finishing the circuit pattern after another process
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last 30 patents
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Patent Grant
Circuit board and manufacturing method thereof and electronic device
Patent number
12,177,964
Issue date
Dec 24, 2024
Unimicron Technology Corp.
Jun-Rui Huang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wiring board and method for manufacturing wiring board
Patent number
12,144,108
Issue date
Nov 12, 2024
Dai Nippon Printing Co., Ltd.
Naoko Okimoto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for manufacturing printed wiring board
Patent number
12,058,818
Issue date
Aug 6, 2024
Ibiden Co., Ltd.
Satoru Kawai
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Circuit formation method
Patent number
11,849,545
Issue date
Dec 19, 2023
FUJI CORPORATION
Kenji Tsukada
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of fabricating a glass substrate with a plurality of vias
Patent number
11,646,246
Issue date
May 9, 2023
Samtec, Inc.
Tim Mobley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabrication of a soft-matter printed circuit board
Patent number
11,523,514
Issue date
Dec 6, 2022
Carnegie Mellon University
Carmel Majidi
A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information
Patent Grant
Systems and methods for bonding electronic components on substrates...
Patent number
11,337,312
Issue date
May 17, 2022
Palo Alto Research Center Incorporated
Ping Mei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Filling materials and methods of filling through holes of a substrate
Patent number
11,251,109
Issue date
Feb 15, 2022
Samtec, Inc.
Tim Mobley
C03 - GLASS MINERAL OR SLAG WOOL
Information
Patent Grant
Light-emitting device and the method of manufacturing the same
Patent number
11,107,797
Issue date
Aug 31, 2021
Epistar Corporation
Jui-Hsien Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wiring board, multilayer wiring board, and method of manufacturing...
Patent number
10,966,324
Issue date
Mar 30, 2021
Toppan Printing Co., Ltd.
Yasuyuki Hitsuoka
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Substrate-integrated device and method for making the same
Patent number
10,856,408
Issue date
Dec 1, 2020
City University of Hong Kong
Kwok Wa Leung
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic component embedded substrate
Patent number
10,813,220
Issue date
Oct 20, 2020
TDK Corporation
Mitsuhiro Tomikawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for fabrication of a soft-matter printed circuit board
Patent number
10,757,815
Issue date
Aug 25, 2020
Carnegie Mellon University
Carmel Majidi
A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information
Patent Grant
Light-emitting device and the method of manufacturing the same
Patent number
10,756,067
Issue date
Aug 25, 2020
Epistar Corporation
Jui-Hsien Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three-dimensional wiring board production method, three-dimensional...
Patent number
10,537,021
Issue date
Jan 14, 2020
Meiko Electronics Co., Ltd.
Shigeru Michiwaki
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Substrate-less stackable package with wire-bond interconnect
Patent number
10,510,659
Issue date
Dec 17, 2019
Invensas Corporation
Ilyas Mohammed
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing a printed circuit board
Patent number
10,492,288
Issue date
Nov 26, 2019
AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
Simon Sebanz
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Coil coating process
Patent number
10,388,455
Issue date
Aug 20, 2019
voestalpine STAHL GmbH
Michaela Schatzl-Linder
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information
Patent Grant
Filling method of conductive paste and manufacturing method of mult...
Patent number
10,321,578
Issue date
Jun 11, 2019
Nippon Mektron, Ltd.
Shoji Takano
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electrical wiring member production method, electrical wiring membe...
Patent number
10,299,376
Issue date
May 21, 2019
Seiko Epson Corporation
Hidefumi Nakamura
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Three-dimensional wiring board production method, three-dimensional...
Patent number
10,244,624
Issue date
Mar 26, 2019
MEIKO ELECTRONICS CO., LTD.
Shigeru Michiwaki
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device and method of forming semiconductor die with a...
Patent number
10,217,873
Issue date
Feb 26, 2019
STATS ChipPAC Pte. Ltd.
Byung Joon Han
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate-less stackable package with wire-bond interconnect
Patent number
10,170,412
Issue date
Jan 1, 2019
Invensas Corporation
Ilyas Mohammed
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Inkjet system for printing a printed circuit board
Patent number
10,123,427
Issue date
Nov 6, 2018
MUTRACX INTERNATIONAL B.V.
Henk Jan Zwiers
B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information
Patent Grant
Printed circuit board consisting of at least two printed circuit bo...
Patent number
9,980,380
Issue date
May 22, 2018
AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
Rainer Pludra
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of manufacturing an intermediate product for an interposer a...
Patent number
9,974,192
Issue date
May 15, 2018
Ashai Glass Company, Limited
Shintaro Takahashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate-less stackable package with wire-bond interconnect
Patent number
9,953,914
Issue date
Apr 24, 2018
Invensas Corporation
Ilyas Mohammed
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Cortical implant system for brain stimulation and recording
Patent number
9,949,376
Issue date
Apr 17, 2018
Second Sight Medical Products, Inc.
Robert J Greenberg
A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information
Patent Grant
Light-emitting device and the method of manufacturing the same
Patent number
9,917,075
Issue date
Mar 13, 2018
Epistar Corporation
Jui-Hsien Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing a printed circuit board
Patent number
9,795,025
Issue date
Oct 17, 2017
AT&S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
Simon Sebanz
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
Ultra-Thin Sandwich Component
Publication number
20240314928
Publication date
Sep 19, 2024
KYOCERA AVX Components Corporation
Cory Nelson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EPOXY RESIN COMPOSITION, ADHESIVE FILM, PRINTED WIRING BOARD, SEMIC...
Publication number
20240301176
Publication date
Sep 12, 2024
Asahi Kasei Kabushiki Kaisha
Kenzo ONIZUKA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INSULATING SUBSTRATE, ELECTRICAL WIRING SUBSTRATE, THERMAL PRINT HE...
Publication number
20240268018
Publication date
Aug 8, 2024
Rohm Co., Ltd.
Goro Nakatani
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRINTED CIRCUIT BOARD
Publication number
20240196533
Publication date
Jun 13, 2024
Samsung Electro-Mechanics Co., Ltd.
Youn Gyu Han
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PRINTED CIRCUIT BOARD, FABRICATION METHOD OF THE SAME AND ELECTRONI...
Publication number
20230121285
Publication date
Apr 20, 2023
Samsung Electronics Co., Ltd.
Sangwon HA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PRODUCING METHOD OF WIRED CIRCUIT BOARD
Publication number
20230073563
Publication date
Mar 9, 2023
Nitto Denko Corporation
Hayato TAKAKURA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD
Publication number
20230030601
Publication date
Feb 2, 2023
IBIDEN CO., LTD.
Satoru KAWAI
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE
Publication number
20220232695
Publication date
Jul 21, 2022
Unimicron Technology Corp.
Jun-Rui Huang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SYSTEMS AND METHODS FOR BONDING ELECTRONIC COMPONENTS ON SUBSTRATES...
Publication number
20220078917
Publication date
Mar 10, 2022
Palo Alto Research Center Incorporated
Ping Mei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
Publication number
20210385946
Publication date
Dec 9, 2021
DAI NIPPON PRINTING CO., LTD.
Naoko OKIMOTO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD
Publication number
20200053864
Publication date
Feb 13, 2020
AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
Simon Sebanz
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PACKAGING SUBSTRATE FOR SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...
Publication number
20190172782
Publication date
Jun 6, 2019
STMicroelectronics S.r.l
Federico Giovanni Ziglioli
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SUBSTRATE-LESS STACKABLE PACKAGE WITH WIRE-BOND INTERCONNECT
Publication number
20190096803
Publication date
Mar 28, 2019
Invensas Corporation
Ilyas Mohammed
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PRINT HEAD MAINTENANCE
Publication number
20190037704
Publication date
Jan 31, 2019
MUTRACX INTERNATIONAL B.V.
Henk Jan ZWIERS
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information
Patent Application
Substrate-Less Stackable Package With Wire-Bond Interconnect
Publication number
20180233448
Publication date
Aug 16, 2018
Invensas Corporation
Ilyas Mohammed
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIGHT-EMITTING DEVICE AND THE METHOD OF MANUFACTURING THE SAME
Publication number
20180190626
Publication date
Jul 5, 2018
EPISTAR CORPORATION
Jui-Hsien CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
A Method for Making Patterned Conductive Textiles
Publication number
20180168032
Publication date
Jun 14, 2018
DST Innovations Limited
Anthony Miles
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
THREE-DIMENSIONAL WIRING BOARD PRODUCTION METHOD, THREE-DIMENSIONAL...
Publication number
20180160528
Publication date
Jun 7, 2018
Meiko Electronics Co., Ltd.
Shigeru MICHIWAKI
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD
Publication number
20180042099
Publication date
Feb 8, 2018
AT & S AUSTRIA TECHNOLOGIES & SYSTEMTECHNIK AKTIENGESELLSCHAFT
Simon Sebanz
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
INKJET SYSTEM FOR PRINTING A PRINTED CIRCUIT BOARD
Publication number
20170347461
Publication date
Nov 30, 2017
MUTRACX INTERNATIONAL B.V.
Henk Jan ZWIERS
B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information
Patent Application
METHOD OF MANUFACTURING AN INTERMEDIATE PRODUCT FOR AN INTERPOSER A...
Publication number
20170238426
Publication date
Aug 17, 2017
ASAHI GLASS COMPANY, LIMITED
Shintaro TAKAHASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE DIMENSIONAL ORGANIC OR GLASS INTERPOSER
Publication number
20160141237
Publication date
May 19, 2016
International Business Machines Corporation
Mukta G. FAROOQ
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FILLING METHOD OF CONDUCTIVE PASTE AND MANUFACTURING METHOD OF MULT...
Publication number
20160095227
Publication date
Mar 31, 2016
NIPPON MEKTRON, LTD.
Shoji TAKANO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Device Embedded Substrate and Manufacturing Method of Device Embedd...
Publication number
20150327369
Publication date
Nov 12, 2015
Meiko Electronics Co., Ltd.
Yasuaki Seki
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUIT COMPONENT BRIDGE DEVICE
Publication number
20150223336
Publication date
Aug 6, 2015
Intel Corporation
Beom-Taek Lee
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
INKJET SYSTEM FOR PRINTING A PRINTED CIRCUIT BOARD
Publication number
20140374375
Publication date
Dec 25, 2014
Henk Jan Zwiers
B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information
Patent Application
SEMICONDUCTOR SUBSTRATE AND METHOD FOR MAKING THE SAME
Publication number
20140367837
Publication date
Dec 18, 2014
Chun-Che LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPONENT-EMBEDDED SUBSTRATE MANUFACTURING METHOD AND COMPONENT-EMB...
Publication number
20140347835
Publication date
Nov 27, 2014
Meiko Electronics Co., Ltd.
Ryoichi Shimizu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE OF VIA HOLE OF ELECTRICAL CIRCUIT BOARD AND MANUFACTURING...
Publication number
20140299363
Publication date
Oct 9, 2014
KUO-FU SU
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF MANUFACTURING A RIGID-FLEX PRINTED CIRCUIT BOARD OR A SUB...
Publication number
20140216792
Publication date
Aug 7, 2014
AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
Simon Sebanz
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR