Applying permanent coating to the layer connector in the bonding apparatus

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H01L2224/8302

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/8302Applying permanent coating to the layer connector in the bonding apparatus

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Patents Grantslast 30 patents

Information Patent Grant
Structures for low temperature bonding using nanoparticles
- Patent number 12,027,487
- Issue date Jul 2, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for low temperature bonding using nanoparticles
- Patent number 11,973,056
- Issue date Apr 30, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display module and manufacturing method thereof
- Patent number 11,817,414
- Issue date Nov 14, 2023
- Samsung Electronics Co., Ltd.
- Won Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermosetting resin composition, semiconductor device, and electric...
- Patent number 11,784,153
- Issue date Oct 10, 2023
- Kyocera Corporation
- Masakazu Fujiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-substrate assemblies having sinter-bonded backside via structur...
- Patent number 11,749,639
- Issue date Sep 5, 2023
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 11,710,718
- Issue date Jul 25, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for micro-transfer-printing
- Patent number 11,472,171
- Issue date Oct 18, 2022
- X Display Company Technology Limited
- Christopher Bower
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Soldering a conductor to an aluminum metallization
- Patent number 11,450,642
- Issue date Sep 20, 2022
- Infineon Technologies AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible integrated display module, manufacturing method thereof, a...
- Patent number 11,442,565
- Issue date Sep 13, 2022
- WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Jinrong Zhao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Soldering a conductor to an aluminum layer
- Patent number 11,424,217
- Issue date Aug 23, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anodic bonding of a substrate of glass having contact vias to a sub...
- Patent number 11,398,452
- Issue date Jul 26, 2022
- X-FAB SEMICONDUCTOR FOUNDRIES GMBH
- Stefan Weinberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing assembly pads on a carrier for the self-a...
- Patent number 11,380,648
- Issue date Jul 5, 2022
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Léa Di Cioccio
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Chip bonding method and bonding device
- Patent number 11,239,198
- Issue date Feb 1, 2022
- BOE Technology Group Co., Ltd.
- Lili Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,201,134
- Issue date Dec 14, 2021
- United Microelectronics Corp.
- Yonghui Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device production method
- Patent number 10,998,283
- Issue date May 4, 2021
- TOSHIBA MEMORY CORPORATION
- Takahiko Kawasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inkjet adhesive, manufacturing method for semiconductor device, and...
- Patent number 10,961,411
- Issue date Mar 30, 2021
- Sekisui Chemical Co., Ltd.
- Mitsuru Tanikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Soldering a conductor to an aluminum metallization
- Patent number 10,896,893
- Issue date Jan 19, 2021
- Infineon Technologies AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,892,246
- Issue date Jan 12, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering a conductor to an aluminum metallization
- Patent number 10,892,247
- Issue date Jan 12, 2021
- Infineon Technologies AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of bonding semiconductor substrates
- Patent number 10,886,252
- Issue date Jan 5, 2021
- Imec VZW
- Lan Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,886,250
- Issue date Jan 5, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer to wafer bonding method and wafer to wafer bonding system
- Patent number 10,811,381
- Issue date Oct 20, 2020
- Samsung Electronics Co., Ltd.
- Joon-Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 10,636,762
- Issue date Apr 28, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takatoshi Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 10,636,766
- Issue date Apr 28, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering a conductor to an aluminum metallization
- Patent number 10,615,145
- Issue date Apr 7, 2020
- Infineon Technologies AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
A-staged thermoplastic-polyimide (TPI) adhesive compound and method...
- Patent number 10,550,299
- Issue date Feb 4, 2020
- FRAIVILLIG TECHNOGIES COMPANY
- James B. Fraivillig
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,535,626
- Issue date Jan 14, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
A-staged thermoplastic-polyimide (TPI) adhesive compound containing...
- Patent number 10,435,603
- Issue date Oct 8, 2019
- Fravillig Technologies Company
- James B. Fraivillig
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for applying a bonding layer
- Patent number 10,438,925
- Issue date Oct 8, 2019
- EV Group E. Thallner GmbH
- Markus Wimplinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
CERAMIC SUBSTRATE FOR POWER MODULE, METHOD FOR MANUFACTURING SAME,...
- Publication number 20240387438
- Publication date Nov 21, 2024
- AMOSENSE CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING SEMICONDUCTOR MODULE
- Publication number 20240379608
- Publication date Nov 14, 2024
- Fuji Electric Co., Ltd.
- Yuta TAKEUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20240312954
- Publication date Sep 19, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH SOLDER MASK
- Publication number 20240170438
- Publication date May 23, 2024
- NXP USA, Inc.
- Aznita Abdul Aziz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION LAYER FOR FORMING SEMICONDUCTOR BONDING STRUCTURE, SPUT...
- Publication number 20240145421
- Publication date May 2, 2024
- SOLAR APPLIED MATERIALS TECHNOLOGY CORP.
- Kuan-Neng CHEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THERMOSETTING RESIN COMPOSITION, SEMICONDUCTOR DEVICE AND ELECTRICA...
- Publication number 20230411335
- Publication date Dec 21, 2023
- Kyocera Corporation
- Masakazu FUJIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20230335531
- Publication date Oct 19, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20230207517
- Publication date Jun 29, 2023
- Fuji Electric Co., Ltd.
- Tsunehiro NAKAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20230132060
- Publication date Apr 27, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-SUBSTRATE ASSEMBLIES HAVING SINTER-BONDED BACKSIDE VIA STRUCTUR...
- Publication number 20230111320
- Publication date Apr 13, 2023
- NXP USA, Inc.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20220013489
- Publication date Jan 13, 2022
- Samsung Electronics Co., Ltd.
- Won Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE INTEGRATED DISPLAY MODULE, MANUFACTURING METHOD THEREOF, A...
- Publication number 20210405790
- Publication date Dec 30, 2021
- Wuhan China Star Optoelectronics Semeiconductor Diplay Technology Co., LTD.
- Jinrong Zhao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210327849
- Publication date Oct 21, 2021
- UNITED MICROELECTRONICS CORP.
- YONGHUI GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT, AND WORKPIECE
- Publication number 20210320006
- Publication date Oct 14, 2021
- OSRAM OLED GmbH
- Martin Behringer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures And Methods For Low Temperature Bonding Using Nanoparticles
- Publication number 20210225801
- Publication date Jul 22, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING METHOD AND BONDING DEVICE
- Publication number 20210159208
- Publication date May 27, 2021
- BOE TECHNOLOGY GROUP CO., LTD.
- Lili WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Anodic Bonding of a Substrate of Glass having Contact Vias to a Sub...
- Publication number 20200258863
- Publication date Aug 13, 2020
- X-FAB SEMICONDUCTOR FOUNDRIES GmbH
- Stefan WEINBERGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Anodic Bonding of a Substrate of Glass having Contact Vias to a Sub...
- Publication number 20200258862
- Publication date Aug 13, 2020
- X-FAB SEMICONDUCTOR FOUNDRIES GmbH
- Stefan WEINBERGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION
- Publication number 20200243480
- Publication date Jul 30, 2020
- INFINEON TECHNOLOGIES AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY
- Publication number 20200219848
- Publication date Jul 9, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures And Methods For Low Temperature Bonding Using Nanoparticles
- Publication number 20200152598
- Publication date May 14, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Anodic Bonding of a Substrate of Glass having Contact Vias to a Sub...
- Publication number 20200118967
- Publication date Apr 16, 2020
- X-FAB SEMICONDUCTOR FOUNDRIES GmbH
- Stefan WEINBERGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PRODUCTION METHOD
- Publication number 20200035636
- Publication date Jan 30, 2020
- Toshiba Memory Corporation
- Takahiro KAWASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INKJET ADHESIVE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND...
- Publication number 20190092963
- Publication date Mar 28, 2019
- Sekisui Chemical Co., Ltd
- Mitsuru Tanikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound Containing...
- Publication number 20190048238
- Publication date Feb 14, 2019
- James B. Fraivillig
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190035762
- Publication date Jan 31, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- Takatoshi ISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION
- Publication number 20190035764
- Publication date Jan 31, 2019
- INFINEON TECHNOLOGIES AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound and Method...
- Publication number 20180346777
- Publication date Dec 6, 2018
- James B. Fraivillig
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD OF BONDING SEMICONDUCTOR SUBSTRATES
- Publication number 20180247914
- Publication date Aug 30, 2018
- IMEC vzw
- Lan Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20180218998
- Publication date Aug 2, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS

Applying permanent coating to the layer connector in the bonding apparatus

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Structures for low temperature bonding using nanoparticles

Methods for low temperature bonding using nanoparticles

Display module and manufacturing method thereof

Thermosetting resin composition, semiconductor device, and electric...

Die-substrate assemblies having sinter-bonded backside via structur...

Structures and methods for low temperature bonding using nanoparticles

Chip assembly

Apparatus and methods for micro-transfer-printing

Soldering a conductor to an aluminum metallization

Flexible integrated display module, manufacturing method thereof, a...

Soldering a conductor to an aluminum layer

Anodic bonding of a substrate of glass having contact vias to a sub...

Process for manufacturing assembly pads on a carrier for the self-a...

Chip bonding method and bonding device

Method of manufacturing semiconductor device

Semiconductor device production method

Inkjet adhesive, manufacturing method for semiconductor device, and...

Soldering a conductor to an aluminum metallization

Structures and methods for low temperature bonding using nanoparticles

Soldering a conductor to an aluminum metallization

Method of bonding semiconductor substrates

Structures and methods for low temperature bonding using nanoparticles

Wafer to wafer bonding method and wafer to wafer bonding system

Method of manufacturing semiconductor device

Chip assembly

Soldering a conductor to an aluminum metallization

A-staged thermoplastic-polyimide (TPI) adhesive compound and method...

Structures and methods for low temperature bonding using nanoparticles

A-staged thermoplastic-polyimide (TPI) adhesive compound containing...

Method for applying a bonding layer

Patents Applicationslast 30 patents

CERAMIC SUBSTRATE FOR POWER MODULE, METHOD FOR MANUFACTURING SAME,...

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING SEMICONDUCTOR MODULE

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

PACKAGE WITH SOLDER MASK

PASSIVATION LAYER FOR FORMING SEMICONDUCTOR BONDING STRUCTURE, SPUT...

THERMOSETTING RESIN COMPOSITION, SEMICONDUCTOR DEVICE AND ELECTRICA...

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

DIE-SUBSTRATE ASSEMBLIES HAVING SINTER-BONDED BACKSIDE VIA STRUCTUR...

DISPLAY MODULE AND MANUFACTURING METHOD THEREOF

FLEXIBLE INTEGRATED DISPLAY MODULE, MANUFACTURING METHOD THEREOF, A...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT, AND WORKPIECE

Structures And Methods For Low Temperature Bonding Using Nanoparticles

CHIP BONDING METHOD AND BONDING DEVICE

Anodic Bonding of a Substrate of Glass having Contact Vias to a Sub...

Anodic Bonding of a Substrate of Glass having Contact Vias to a Sub...

SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION

METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY

Structures And Methods For Low Temperature Bonding Using Nanoparticles

Anodic Bonding of a Substrate of Glass having Contact Vias to a Sub...

SEMICONDUCTOR DEVICE PRODUCTION METHOD

INKJET ADHESIVE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND...

A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound Containing...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION

A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound and Method...

METHOD OF BONDING SEMICONDUCTOR SUBSTRATES

STRUCTURES AND METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES