Applying permanent coating

Industry

CPC
H01L2224/2712

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/2712Applying permanent coating

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Method for transferring and bonding of devices
- Patent number 11,677,060
- Issue date Jun 13, 2023
- ELECTRONICS AND TELEOCMMUNICATIONS RESEARCH INSTITUTE
- Jiho Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Member for semiconductor device
- Patent number 11,107,787
- Issue date Aug 31, 2021
- Fuji Electric Co., Ltd.
- Shinji Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic electrically conductive film and connection structure
- Patent number 10,892,243
- Issue date Jan 12, 2021
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layered composite bonding materials and power electronics ass...
- Patent number 10,886,251
- Issue date Jan 5, 2021
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and production method of the same
- Patent number 10,849,236
- Issue date Nov 24, 2020
- Dexerials Corporation
- Reiji Tsukao
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Anisotropic electrically conductive film and connection structure
- Patent number 10,847,487
- Issue date Nov 24, 2020
- Dexerials Corporation
- Seiichiro Shinohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a silver sintering agent having silver oxide s...
- Patent number 10,785,877
- Issue date Sep 22, 2020
- Heraeus Deutschland GmbH & Co. KG
- Michael Schäfer
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Anisotropic conductive film
- Patent number 10,714,444
- Issue date Jul 14, 2020
- Dexerials Corporation
- Yasushi Akutsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Nanoscale interconnect array for stacked dies
- Patent number 10,600,761
- Issue date Mar 24, 2020
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film
- Patent number 10,553,554
- Issue date Feb 4, 2020
- Dexerials Corporation
- Yasushi Akutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and method for manufacturing the same
- Patent number 10,494,549
- Issue date Dec 3, 2019
- Samsung Display Co., Ltd.
- Minseok Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Anisotropic conductive film, method for producing anisotropic condu...
- Patent number 10,373,926
- Issue date Aug 6, 2019
- Dexerials Corporation
- Kouichi Sato
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for producing member for semiconductor device and semiconduc...
- Patent number 10,153,246
- Issue date Dec 11, 2018
- Fuji Electric Co., Ltd.
- Shinji Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connection material
- Patent number 10,154,587
- Issue date Dec 11, 2018
- Dexerials Corporation
- Yasushi Akutsu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Anisotropic conductive film, method for producing anisotropic condu...
- Patent number 9,960,139
- Issue date May 1, 2018
- Dexerials Corporation
- Kouichi Sato
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device and manufacturing method for the semiconductor...
- Patent number 9,847,311
- Issue date Dec 19, 2017
- Toyota Jidosha Kabushiki Kaisha
- Takuya Kadoguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preform structure for soldering a semiconductor chip arrangement, a...
- Patent number 9,536,851
- Issue date Jan 3, 2017
- Infineon Technologies AG
- Friedrich Kroener
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump package and methods of formation thereof
- Patent number 9,373,609
- Issue date Jun 21, 2016
- Infineon Technologies AG
- Meng Tong Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device connected by anisotropic conductive film
- Patent number 9,331,044
- Issue date May 3, 2016
- Samsung SDI Co., Ltd.
- Young Ju Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and production method therefor
- Patent number 9,018,664
- Issue date Apr 28, 2015
- Nichia Corporation
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and production method therefor
- Patent number 8,642,392
- Issue date Feb 4, 2014
- Nichia Corporation
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPEN WEB ELECTRICAL SUPPORT FOR CONTACT PAD AND METHOD OF MANUFACTURE
- Publication number 20220246510
- Publication date Aug 4, 2022
- HYPERTAC S.P.A.
- Alessandro Bosca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM AND CONNECTION STRUCTURE
- Publication number 20200161268
- Publication date May 21, 2020
- DEXERIALS CORPORATION
- Seiichiro SHINOHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM
- Publication number 20200144214
- Publication date May 7, 2020
- DEXERIALS CORPORATION
- Yasushi AKUTSU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
NANOSCALE INTERCONNECT ARRAY FOR STACKED DIES
- Publication number 20190237437
- Publication date Aug 1, 2019
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING MEMBER FOR SEMICONDUCTOR DEVICE AND SEMICONDUC...
- Publication number 20190081020
- Publication date Mar 14, 2019
- Fuji Electric Co., Ltd.
- Shinji SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING MEMBER FOR SEMICONDUCTOR DEVICE AND SEMICONDUC...
- Publication number 20170207187
- Publication date Jul 20, 2017
- Fuji Electric Co., Ltd.
- Shinji SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SEMICONDUCTOR...
- Publication number 20160126205
- Publication date May 5, 2016
- Toyota Jidosha Kabushiki Kaisha
- Takuya KADOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump Package and Methods of Formation Thereof
- Publication number 20140110835
- Publication date Apr 24, 2014
- INFINEON TECHNOLOGIES AG
- Meng Tong Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20140110740
- Publication date Apr 24, 2014
- Nichia Corporation.
- Masafumi KURAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTED STRUCTURE
- Publication number 20140048942
- Publication date Feb 20, 2014
- Taichi Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20100187563
- Publication date Jul 29, 2010
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS

Applying permanent coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for transferring and bonding of devices

Member for semiconductor device

Anisotropic electrically conductive film and connection structure

Multi-layered composite bonding materials and power electronics ass...

Anisotropic conductive film and production method of the same

Anisotropic electrically conductive film and connection structure

Method for producing a silver sintering agent having silver oxide s...

Anisotropic conductive film

Nanoscale interconnect array for stacked dies

Anisotropic conductive film

Anisotropic conductive film and method for manufacturing the same

Anisotropic conductive film, method for producing anisotropic condu...

Method for producing member for semiconductor device and semiconduc...

Electrical connection material

Anisotropic conductive film, method for producing anisotropic condu...

Semiconductor device and manufacturing method for the semiconductor...

Preform structure for soldering a semiconductor chip arrangement, a...

Bump package and methods of formation thereof

Semiconductor device connected by anisotropic conductive film

Semiconductor device and production method therefor

Semiconductor device and production method therefor

Patents Applicationslast 30 patents

OPEN WEB ELECTRICAL SUPPORT FOR CONTACT PAD AND METHOD OF MANUFACTURE

ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM AND CONNECTION STRUCTURE

ANISOTROPIC CONDUCTIVE FILM

NANOSCALE INTERCONNECT ARRAY FOR STACKED DIES

METHOD FOR PRODUCING MEMBER FOR SEMICONDUCTOR DEVICE AND SEMICONDUC...

METHOD FOR PRODUCING MEMBER FOR SEMICONDUCTOR DEVICE AND SEMICONDUC...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SEMICONDUCTOR...

Bump Package and Methods of Formation Thereof

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

MOUNTED STRUCTURE

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR