Membership
Tour
Register
Log in
Applying permanent coating
Follow
Industry
CPC
H01L2224/2712
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/2712
Applying permanent coating
Industries
Overview
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Method for transferring and bonding of devices
Patent number
11,677,060
Issue date
Jun 13, 2023
ELECTRONICS AND TELEOCMMUNICATIONS RESEARCH INSTITUTE
Jiho Joo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Member for semiconductor device
Patent number
11,107,787
Issue date
Aug 31, 2021
Fuji Electric Co., Ltd.
Shinji Sano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Anisotropic electrically conductive film and connection structure
Patent number
10,892,243
Issue date
Jan 12, 2021
Dexerials Corporation
Seiichiro Shinohara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-layered composite bonding materials and power electronics ass...
Patent number
10,886,251
Issue date
Jan 5, 2021
Toyota Motor Engineering & Manufacturing North America, Inc.
Shailesh N. Joshi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Anisotropic conductive film and production method of the same
Patent number
10,849,236
Issue date
Nov 24, 2020
Dexerials Corporation
Reiji Tsukao
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Anisotropic electrically conductive film and connection structure
Patent number
10,847,487
Issue date
Nov 24, 2020
Dexerials Corporation
Seiichiro Shinohara
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for producing a silver sintering agent having silver oxide s...
Patent number
10,785,877
Issue date
Sep 22, 2020
Heraeus Deutschland GmbH & Co. KG
Michael Schäfer
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Anisotropic conductive film
Patent number
10,714,444
Issue date
Jul 14, 2020
Dexerials Corporation
Yasushi Akutsu
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Nanoscale interconnect array for stacked dies
Patent number
10,600,761
Issue date
Mar 24, 2020
Invensas Corporation
Liang Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Anisotropic conductive film
Patent number
10,553,554
Issue date
Feb 4, 2020
Dexerials Corporation
Yasushi Akutsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Anisotropic conductive film and method for manufacturing the same
Patent number
10,494,549
Issue date
Dec 3, 2019
Samsung Display Co., Ltd.
Minseok Kim
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Anisotropic conductive film, method for producing anisotropic condu...
Patent number
10,373,926
Issue date
Aug 6, 2019
Dexerials Corporation
Kouichi Sato
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Method for producing member for semiconductor device and semiconduc...
Patent number
10,153,246
Issue date
Dec 11, 2018
Fuji Electric Co., Ltd.
Shinji Sano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrical connection material
Patent number
10,154,587
Issue date
Dec 11, 2018
Dexerials Corporation
Yasushi Akutsu
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Anisotropic conductive film, method for producing anisotropic condu...
Patent number
9,960,139
Issue date
May 1, 2018
Dexerials Corporation
Kouichi Sato
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Semiconductor device and manufacturing method for the semiconductor...
Patent number
9,847,311
Issue date
Dec 19, 2017
Toyota Jidosha Kabushiki Kaisha
Takuya Kadoguchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Preform structure for soldering a semiconductor chip arrangement, a...
Patent number
9,536,851
Issue date
Jan 3, 2017
Infineon Technologies AG
Friedrich Kroener
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bump package and methods of formation thereof
Patent number
9,373,609
Issue date
Jun 21, 2016
Infineon Technologies AG
Meng Tong Ong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device connected by anisotropic conductive film
Patent number
9,331,044
Issue date
May 3, 2016
Samsung SDI Co., Ltd.
Young Ju Shin
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device and production method therefor
Patent number
9,018,664
Issue date
Apr 28, 2015
Nichia Corporation
Masafumi Kuramoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and production method therefor
Patent number
8,642,392
Issue date
Feb 4, 2014
Nichia Corporation
Masafumi Kuramoto
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
OPEN WEB ELECTRICAL SUPPORT FOR CONTACT PAD AND METHOD OF MANUFACTURE
Publication number
20220246510
Publication date
Aug 4, 2022
HYPERTAC S.P.A.
Alessandro Bosca
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM AND CONNECTION STRUCTURE
Publication number
20200161268
Publication date
May 21, 2020
DEXERIALS CORPORATION
Seiichiro SHINOHARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ANISOTROPIC CONDUCTIVE FILM
Publication number
20200144214
Publication date
May 7, 2020
DEXERIALS CORPORATION
Yasushi AKUTSU
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
NANOSCALE INTERCONNECT ARRAY FOR STACKED DIES
Publication number
20190237437
Publication date
Aug 1, 2019
Invensas Corporation
Liang Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PRODUCING MEMBER FOR SEMICONDUCTOR DEVICE AND SEMICONDUC...
Publication number
20190081020
Publication date
Mar 14, 2019
Fuji Electric Co., Ltd.
Shinji SANO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PRODUCING MEMBER FOR SEMICONDUCTOR DEVICE AND SEMICONDUC...
Publication number
20170207187
Publication date
Jul 20, 2017
Fuji Electric Co., Ltd.
Shinji SANO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SEMICONDUCTOR...
Publication number
20160126205
Publication date
May 5, 2016
Toyota Jidosha Kabushiki Kaisha
Takuya KADOGUCHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Bump Package and Methods of Formation Thereof
Publication number
20140110835
Publication date
Apr 24, 2014
INFINEON TECHNOLOGIES AG
Meng Tong Ong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
Publication number
20140110740
Publication date
Apr 24, 2014
Nichia Corporation.
Masafumi KURAMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOUNTED STRUCTURE
Publication number
20140048942
Publication date
Feb 20, 2014
Taichi Nakamura
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
Publication number
20100187563
Publication date
Jul 29, 2010
Masafumi Kuramoto
H01 - BASIC ELECTRIC ELEMENTS