Applying permanent coating

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CPC
H01L2224/8392

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8392Applying permanent coating

Industries

Patents Grantslast 30 patents

Information Patent Grant
Display device and method of manufacturing the same
- Patent number 11,862,601
- Issue date Jan 2, 2024
- Samsung Display Co., Ltd.
- Min Sung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 11,842,992
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,502,057
- Issue date Nov 15, 2022
- Kioxia Corporation
- Soichi Homma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 11,410,966
- Issue date Aug 9, 2022
- Samsung Display Co., Ltd.
- Min Sung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 11,342,322
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,282,818
- Issue date Mar 22, 2022
- Kioxia Corporation
- Toshimitsu Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices, methods of packaging semiconductor...
- Patent number 11,158,588
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Company
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices, methods of packaging semiconductor...
- Patent number 11,158,587
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Company
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 10,910,523
- Issue date Feb 2, 2021
- Genesis Photonics Inc.
- Cheng-Wei Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including organic interposer
- Patent number 10,854,528
- Issue date Dec 1, 2020
- Samsung Electronics Co., Ltd.
- Jun Woo Myung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure along with multiple chips bonded through mi...
- Patent number 10,854,580
- Issue date Dec 1, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wei-Heng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed adhesion deposition to mitigate integrated circuit package...
- Patent number 10,727,085
- Issue date Jul 28, 2020
- Texas Instruments Incorporated
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 10,727,218
- Issue date Jul 28, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices, methods of packaging semiconductor...
- Patent number 10,529,673
- Issue date Jan 7, 2020
- Taiwan Semiconductor Manufacturing Company
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 10,453,832
- Issue date Oct 22, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed adhesion deposition to mitigate integrated circuit delamina...
- Patent number 10,347,508
- Issue date Jul 9, 2019
- Texas Instruments Incorporated
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedding additive particles in encapsulant of electronic device
- Patent number 9,852,918
- Issue date Dec 26, 2017
- Infineon Technologies AG
- Peh Hean Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded chip package and method of manufacturing the same
- Patent number 9,780,061
- Issue date Oct 3, 2017
- Infineon Technologies AG
- Franz Gabler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode connection structure and electrode connection method
- Patent number 9,601,448
- Issue date Mar 21, 2017
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices, methods of packaging semiconductor...
- Patent number 9,355,973
- Issue date May 31, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,177,833
- Issue date Nov 3, 2015
- Renesas Electronics Corporation
- Takuya Nakajo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection arrangement of an electric and/or electronic component
- Patent number 9,177,934
- Issue date Nov 3, 2015
- Robert Bosch GmbH
- Christiane Frueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and the method to manufacture thereof
- Patent number 9,171,818
- Issue date Oct 27, 2015
- Cyntec Co., Ltd.
- Da-Jung Chen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electronic device and method of manufacturing the same
- Patent number 8,598,458
- Issue date Dec 3, 2013
- Denso Corporation
- Hiroshi Ishino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,492,202
- Issue date Jul 23, 2013
- Renesas Electronics Corporation
- Ryoichi Kajiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,314,484
- Issue date Nov 20, 2012
- Renesas Electronics Corporation
- Ryoichi Kajiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering silver paste material and method for bonding semiconducto...
- Patent number 8,303,854
- Issue date Nov 6, 2012
- Hitachi, Ltd.
- Ryoichi Kajiwara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for integrated circuit packages using material...
- Patent number 8,252,631
- Issue date Aug 28, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Jin-Wook Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and article for attaching high-operating-temperature electro...
- Patent number 6,274,407
- Issue date Aug 14, 2001
- Visteon Global Technologies, Inc.
- Jay DeAvis Baker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-operating-temperature electronic component
- Patent number 6,144,104
- Issue date Nov 7, 2000
- Visteon Corporation
- Jay DeAvis Baker
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20230326768
- Publication date Oct 12, 2023
- Mitsubishi Electric Corporation
- Daisuke MURATA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220352117
- Publication date Nov 3, 2022
- SAMSUNG DISPLAY CO., LTD.
- Min Sung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210257332
- Publication date Aug 19, 2021
- KIOXIA Corporation
- Soichi HOMMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210125956
- Publication date Apr 29, 2021
- SAMSUNG DISPLAY CO., LTD.
- Min Sung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210082878
- Publication date Mar 18, 2021
- KIOXIA Corporation
- Toshimitsu ARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Devices, Methods of Packaging Semiconductor...
- Publication number 20200312791
- Publication date Oct 1, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING ORGANIC INTERPOSER
- Publication number 20200152538
- Publication date May 14, 2020
- Samsung Electronics Co., Ltd.
- Jun Woo MYUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Devices, Methods of Packaging Semiconductor...
- Publication number 20200144202
- Publication date May 7, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20200090953
- Publication date Mar 19, 2020
- Kabushiki Kaisha Toshiba
- Hisashi Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PERFORMING DIE-BASED HETEROGENEOUS INTEGRATION AND DEVICE...
- Publication number 20190123035
- Publication date Apr 25, 2019
- Samsung Electronics Co., Ltd.
- Daniel N. Carothers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RING STRUCTURES AND METHODS OF FORMING SAME
- Publication number 20190109125
- Publication date Apr 11, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Devices, Methods of Packaging Semiconductor...
- Publication number 20180350756
- Publication date Dec 6, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Devices, Methods of Packaging Semiconductor...
- Publication number 20150050779
- Publication date Feb 19, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20140264383
- Publication date Sep 18, 2014
- RENESAS ELECTRONICS CORPORATION
- Ryoichi KAJIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Devices, Methods of Packaging Semiconductor...
- Publication number 20140264839
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130228907
- Publication date Sep 5, 2013
- RENESAS ELECTRONICS CORPORATION
- Takuya NAKAJO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING METHOD AND STRUCTURE THEREOF
- Publication number 20130214419
- Publication date Aug 22, 2013
- Chipbond Technology Corporation
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND THE METHOD TO MANUFACTURE THEREOF
- Publication number 20130146341
- Publication date Jun 13, 2013
- CYNTEC CO., LTD.
- DA-JUNG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130071971
- Publication date Mar 21, 2013
- RENESAS ELECTRONICS CORPORATION
- Ryoichi KAJIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERING SILVER PASTE MATERIAL AND METHOD FOR BONDING SEMICONDUCTO...
- Publication number 20110290863
- Publication date Dec 1, 2011
- Ryoichi KAJIWARA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110192630
- Publication date Aug 11, 2011
- DENSO CORPORATION
- Hiroshi Ishino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100187678
- Publication date Jul 29, 2010
- Renesas Technology Corp.
- Ryoichi KAJIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Housings Having Coupling Coatings
- Publication number 20070262426
- Publication date Nov 15, 2007
- Joachim Mahler
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Applying permanent coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device and method of manufacturing the same

Seal ring structures and methods of forming same

Semiconductor device and manufacturing method thereof

Display device and method of manufacturing the same

Seal ring structures and methods of forming same

Semiconductor device

Packaged semiconductor devices, methods of packaging semiconductor...

Packaged semiconductor devices, methods of packaging semiconductor...

Light emitting device

Semiconductor package including organic interposer

Semiconductor structure along with multiple chips bonded through mi...

Printed adhesion deposition to mitigate integrated circuit package...

Seal ring structures and methods of forming same

Packaged semiconductor devices, methods of packaging semiconductor...

Seal ring structures and methods of forming same

Printed adhesion deposition to mitigate integrated circuit delamina...

Embedding additive particles in encapsulant of electronic device

Molded chip package and method of manufacturing the same

Electrode connection structure and electrode connection method

Packaged semiconductor devices, methods of packaging semiconductor...

Semiconductor device and method of manufacturing the same

Connection arrangement of an electric and/or electronic component

Package structure and the method to manufacture thereof

Electronic device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Sintering silver paste material and method for bonding semiconducto...

Method and apparatus for integrated circuit packages using material...

Method and article for attaching high-operating-temperature electro...

High-operating-temperature electronic component

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

Packaged Semiconductor Devices, Methods of Packaging Semiconductor...

SEMICONDUCTOR PACKAGE INCLUDING ORGANIC INTERPOSER

Packaged Semiconductor Devices, Methods of Packaging Semiconductor...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF PERFORMING DIE-BASED HETEROGENEOUS INTEGRATION AND DEVICE...

SEAL RING STRUCTURES AND METHODS OF FORMING SAME

Packaged Semiconductor Devices, Methods of Packaging Semiconductor...

Packaged Semiconductor Devices, Methods of Packaging Semiconductor...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Packaged Semiconductor Devices, Methods of Packaging Semiconductor...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGING METHOD AND STRUCTURE THEREOF

PACKAGE STRUCTURE AND THE METHOD TO MANUFACTURE THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SINTERING SILVER PASTE MATERIAL AND METHOD FOR BONDING SEMICONDUCTO...

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Housings Having Coupling Coatings