Applying permanent coating

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H01L2224/2782

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/2782Applying permanent coating

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Patents Grantslast 30 patents

Information Patent Grant
Connection structure
- Patent number 11,735,556
- Issue date Aug 22, 2023
- Mikuni Electron Corporation
- Sakae Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Connection structure
- Patent number 11,133,279
- Issue date Sep 28, 2021
- Mikuni Electron Corporation
- Sakae Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film (ACF) with controllable distribution st...
- Patent number 10,957,668
- Issue date Mar 23, 2021
- WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Hui Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Porous Cu on Cu surface for semiconductor packages
- Patent number 10,914,018
- Issue date Feb 9, 2021
- Infineon Technologies AG
- Norbert Pielmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure
- Patent number 10,804,235
- Issue date Oct 13, 2020
- Mikuni Electron Corporation
- Sakae Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-temperature bonding with spaced nanorods and eutectic alloys
- Patent number 10,646,964
- Issue date May 12, 2020
- Northeastern University
- Stephen Peter Stagon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection structure and method for manufacturing connection structure
- Patent number 10,580,751
- Issue date Mar 3, 2020
- MIKUNI ELECTRON CORPORATION
- Sakae Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure and method for manufacturing connection structure
- Patent number 10,529,681
- Issue date Jan 7, 2020
- MIKUNI ELECTRON CORPORATION
- Sakae Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacture of wire bondable and solderable surfaces on...
- Patent number 9,401,466
- Issue date Jul 26, 2016
- Atotech Deutschland GmbH
- Andreas Walter
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Bump package and methods of formation thereof
- Patent number 9,373,609
- Issue date Jun 21, 2016
- Infineon Technologies AG
- Meng Tong Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder, solder joint structure and method of forming solder joint s...
- Patent number 9,308,603
- Issue date Apr 12, 2016
- Industrial Technology Research Institute
- Kuo-Shu Kao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding pad for thermocompression bonding, process for producing a...
- Patent number 9,281,280
- Issue date Mar 8, 2016
- Robert Bosch GmbH
- Christoph Schelling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip-on-wafer bonding method and bonding device, and structure comp...
- Patent number 9,142,532
- Issue date Sep 22, 2015
- BONDTECH CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reducing formation of oxide on solder
- Patent number 9,132,496
- Issue date Sep 15, 2015
- Raytheon Company
- Buu Q. Diep
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reducing formation of oxide on solder
- Patent number 8,844,793
- Issue date Sep 30, 2014
- Raytheon Company
- Buu Diep
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting structure
- Patent number 8,497,432
- Issue date Jul 30, 2013
- Seiko Epson Corporation
- Nobuaki Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and structure for wafer to wafer bonding in semiconductor pa...
- Patent number 8,377,798
- Issue date Feb 19, 2013
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Huei Peng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device, circuit board, electro-optic device, electron...
- Patent number 7,375,427
- Issue date May 20, 2008
- Seiko Epson Corporation
- Shuichi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONNECTION STRUCTURE
- Publication number 20210398931
- Publication date Dec 23, 2021
- MIKUNI ELECTRON CORPORATION
- SAKAE TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE
- Publication number 20200343211
- Publication date Oct 29, 2020
- MIKUNI ELECTRON CORPORATION
- SAKAE TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Porous Cu on Cu Surface for Semiconductor Packages
- Publication number 20200291538
- Publication date Sep 17, 2020
- INFINEON TECHNOLOGIES AG
- Norbert Pielmeier
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONNECTION STRUCTURE
- Publication number 20200098718
- Publication date Mar 26, 2020
- Mikuni Electron Corporation
- SAKAE TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE
- Publication number 20190237424
- Publication date Aug 1, 2019
- Mikuni Electron Corporation
- SAKAE TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-WAFER BONDING METHOD AND BONDING DEVICE, AND STRUCTURE COMP...
- Publication number 20150048523
- Publication date Feb 19, 2015
- BONDTECH CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER, SOLDER JOINT STRUCTURE AND METHOD OF FORMING SOLDER JOINT S...
- Publication number 20140134459
- Publication date May 15, 2014
- Industrial Technology Research Institute
- Kuo-Shu Kao
- B32 - LAYERED PRODUCTS
Information Patent Application
Bump Package and Methods of Formation Thereof
- Publication number 20140110835
- Publication date Apr 24, 2014
- INFINEON TECHNOLOGIES AG
- Meng Tong Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A BONDING PAD FOR THERMOCOMPRESSION BONDING, A...
- Publication number 20140035167
- Publication date Feb 6, 2014
- ROBERT BOSCH GmbH
- Christoph Schelling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDING PAD FOR THERMOCOMPRESSION BONDING, PROCESS FOR PRODUCING A...
- Publication number 20140035168
- Publication date Feb 6, 2014
- ROBERT BOSCH GmbH
- Christoph Schelling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND STRUCTURE FOR WAFER TO WAFER BONDING IN SEMICONDUCTOR PA...
- Publication number 20120115305
- Publication date May 10, 2012
- Taiwan Semiconductor Manufacturing Co., LTD
- Jung-Huei PENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Reducing Formation Of Oxide On Solder
- Publication number 20120111925
- Publication date May 10, 2012
- Raytheon Company
- Buu Diep
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING STRUCTURE
- Publication number 20100071946
- Publication date Mar 25, 2010
- SEIKO EPSON CORPORATION
- Nobuaki HASHIMOTO
- G02 - OPTICS
Information Patent Application
Semiconductor device, circuit board, electro-optic device, electron...
- Publication number 20060091539
- Publication date May 4, 2006
- Seiko Epson Corporation
- Shuichi Tanaka
- G02 - OPTICS

Applying permanent coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Connection structure

Sintering materials and attachment methods using same

Connection structure

Anisotropic conductive film (ACF) with controllable distribution st...

Porous Cu on Cu surface for semiconductor packages

Connection structure

Low-temperature bonding with spaced nanorods and eutectic alloys

Connection structure and method for manufacturing connection structure

Connection structure and method for manufacturing connection structure

Method for manufacture of wire bondable and solderable surfaces on...

Bump package and methods of formation thereof

Solder, solder joint structure and method of forming solder joint s...

Bonding pad for thermocompression bonding, process for producing a...

Chip-on-wafer bonding method and bonding device, and structure comp...

Reducing formation of oxide on solder

Reducing formation of oxide on solder

Electronic component mounting structure

Method and structure for wafer to wafer bonding in semiconductor pa...

Semiconductor device, circuit board, electro-optic device, electron...

Patents Applicationslast 30 patents

CONNECTION STRUCTURE

CONNECTION STRUCTURE

Porous Cu on Cu Surface for Semiconductor Packages

CONNECTION STRUCTURE

CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE

CHIP-ON-WAFER BONDING METHOD AND BONDING DEVICE, AND STRUCTURE COMP...

SOLDER, SOLDER JOINT STRUCTURE AND METHOD OF FORMING SOLDER JOINT S...

Bump Package and Methods of Formation Thereof

METHOD FOR PRODUCING A BONDING PAD FOR THERMOCOMPRESSION BONDING, A...

BONDING PAD FOR THERMOCOMPRESSION BONDING, PROCESS FOR PRODUCING A...

METHOD AND STRUCTURE FOR WAFER TO WAFER BONDING IN SEMICONDUCTOR PA...

Reducing Formation Of Oxide On Solder

ELECTRONIC COMPONENT MOUNTING STRUCTURE

Semiconductor device, circuit board, electro-optic device, electron...