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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48091Arched

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with electromagnetic interference film and met...
- Patent number 12,243,833
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hsi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with EMI shield and fabricating method thereof
- Patent number 12,243,834
- Issue date Mar 4, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Doo Soub Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers and memory...
- Patent number 12,243,765
- Issue date Mar 4, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Proximity sensor including enclosed accommodation space with sealed...
- Patent number 12,235,391
- Issue date Feb 25, 2025
- Pixart Imaging Incorporation
- Nientse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy structure of stacked and bonded semiconductor device
- Patent number 12,237,291
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through stack bridge bonding devices and associated methods
- Patent number 12,237,301
- Issue date Feb 25, 2025
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,237,304
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Minkyeong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure
- Patent number 12,238,865
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package having wirebonded multi-die stack
- Patent number 12,237,305
- Issue date Feb 25, 2025
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having side wall plating
- Patent number 12,224,232
- Issue date Feb 11, 2025
- SILICONIX INCORPORATED
- Barry Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package having a main die and a dummy die
- Patent number 12,224,247
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yan-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component arrangement, package and package arrangement, as well as...
- Patent number 12,224,388
- Issue date Feb 11, 2025
- MSG LITHOGLAS GMBH
- Oliver Gyenge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DC and AC magnetic field protection for MRAM device using magnetic-...
- Patent number 12,218,074
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS packages and methods of manufacture thereof
- Patent number 12,209,015
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stiffener package and method of fabricating stiffener package
- Patent number 12,211,705
- Issue date Jan 28, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device, resin package, resin-molded body, and method...
- Patent number 12,211,959
- Issue date Jan 28, 2025
- Nichia Corporation
- Hirofumi Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 12,211,821
- Issue date Jan 28, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable semiconductor packages
- Patent number 12,211,863
- Issue date Jan 28, 2025
- UTAC HEADQUARTERS PTE. LTD.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for integrated shielding in a current sensor
- Patent number 12,210,040
- Issue date Jan 28, 2025
- ALLEGRO MICROSYSTEMS, LLC
- Shaun D. Milano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transient liquid phase bonding compositions and power electronics a...
- Patent number 12,208,448
- Issue date Jan 28, 2025
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Power module and related methods
- Patent number 12,211,771
- Issue date Jan 28, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jonghwan Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure of power semiconductor module
- Patent number 12,205,872
- Issue date Jan 21, 2025
- STARPOWER SEMICONDUCTOR LTD.
- Danting Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package
- Patent number 12,205,873
- Issue date Jan 21, 2025
- TDK Corporation
- Yosuke Komasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio-frequency switching devices having improved voltage handling...
- Patent number 12,205,851
- Issue date Jan 21, 2025
- Skyworks Solutions, Inc.
- Guillaume Alexandre Blin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with top side pin array and manufacturing method...
- Patent number 12,205,827
- Issue date Jan 21, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Devarajan Balaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage solid-state transducers and solid-state transducer arr...
- Patent number 12,205,928
- Issue date Jan 21, 2025
- Martin F. Schubert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor devices and structures with metal layers
- Patent number 12,199,093
- Issue date Jan 14, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode with high efficiency
- Patent number 12,199,214
- Issue date Jan 14, 2025
- SEOUL VIOSYS CO., LTD.
- Keum Ju Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,191,287
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic sensors with sensor die in package structure cavity
- Patent number 12,187,601
- Issue date Jan 7, 2025
- Texas Instruments Incorporated
- Barry Jon Male
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
RESIN MOLDED PRODUCT AND MANUFACTURING METHOD THEREOF, AND WAVELENG...
- Publication number 20250083421
- Publication date Mar 13, 2025
- TOPPAN INC.
- Kazuyuki YAMASHITA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
MECHANICAL MITIGATION OF NEUTRON SEE
- Publication number 20250087595
- Publication date Mar 13, 2025
- Rockwell Collins, Inc.
- Eric N. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20250087546
- Publication date Mar 13, 2025
- Amkor Technology Singapore Holding Pte. Ltd
- Joon Dong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES...
- Publication number 20250089154
- Publication date Mar 13, 2025
- Skyworks Solutions, Inc.
- Shaul BRANCHEVSKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF
- Publication number 20250089427
- Publication date Mar 13, 2025
- SEOUL SEMICONDUCTOR CO., LTD.
- Motonobu TAKEYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGES WITH INTEGRATED MILLIMETER-WAVE REFLECTOR CAVITIES
- Publication number 20250087604
- Publication date Mar 13, 2025
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING PACKAGE STRUCTURE
- Publication number 20250087648
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LONG-LIFE EXTENDED TEMPERATURE RANGE EMBEDDED DIODE DESIGN FOR ELEC...
- Publication number 20250087518
- Publication date Mar 13, 2025
- LAM RESEARCH CORPORATION
- Siyuan TIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250079369
- Publication date Mar 6, 2025
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE EMPLOYING FILM SUBSTRATE AND AN OUTER PRE-IMPREGN...
- Publication number 20250079281
- Publication date Mar 6, 2025
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Methods for Integrated Shielding in a Current Sensor
- Publication number 20250067778
- Publication date Feb 27, 2025
- ALLEGRO MICROSYSTEMS, LLC
- Shaun D. Milano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID STATE LIGHTING DEVICES WITH ACCESSIBLE ELECTRODES AND METHODS...
- Publication number 20250072170
- Publication date Feb 27, 2025
- Micron Technology, Inc.
- Martin F. Schubert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SWITCHING POWER DEVICE
- Publication number 20250070101
- Publication date Feb 27, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURABLE DEVICES FORMED ON GALLIUM AND NITROGEN MATERIAL
- Publication number 20250070536
- Publication date Feb 27, 2025
- KYOCERA SLD Laser, Inc.
- Melvin McLaurin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY INTEGRATED CIRCUIT
- Publication number 20250069976
- Publication date Feb 27, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Vernon BUCK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT SOURCE DEVICE AND DISPLAY UNIT
- Publication number 20250067417
- Publication date Feb 27, 2025
- Saturn Licensing LLC
- Koichi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING TH...
- Publication number 20250063876
- Publication date Feb 20, 2025
- ROHM CO., LTD.
- Masahiko KOBAYAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250062199
- Publication date Feb 20, 2025
- ROHM CO., LTD.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SEMICONDUCTOR DIE CURRENT SENSOR INTEGRATED CIRCUIT
- Publication number 20250062198
- Publication date Feb 20, 2025
- ALLEGRO MICROSYSTEMS, LLC
- Matthew Hein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250054927
- Publication date Feb 13, 2025
- Rohm Co., Ltd.
- Yuji ISHIMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE, IMAGING MODULE, ELECTRONIC DEVICE, AND IMAGING SYSTEM
- Publication number 20250053798
- Publication date Feb 13, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Takayuki IKEDA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHODS RELATED TO RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVE...
- Publication number 20250056880
- Publication date Feb 13, 2025
- Skyworks Solutions, Inc.
- Guillaume Alexandre BLIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PACKAGE WITH IMMERSION TIN ON FLANK
- Publication number 20250046621
- Publication date Feb 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BASE MEMBER FOR LIGHT EMITTING DEVICE
- Publication number 20250048800
- Publication date Feb 6, 2025
- Nichia Corporation.
- Kazuma KOZURU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPUTING DEVICE
- Publication number 20250048938
- Publication date Feb 6, 2025
- Kabushiki Kaisha Toshiba
- Hayato GOTO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250046747
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Junyun KWEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250038068
- Publication date Jan 30, 2025
- QingDing Precision Electronics (Huai’an) Co., Ltd.
- Hao WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Package and Manufacturing Method Thereof
- Publication number 20250038096
- Publication date Jan 30, 2025
- DIODES INCORPORATED
- Shiau-Shi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Submounts with Stud Protrusions for Semiconductor Packages
- Publication number 20250038055
- Publication date Jan 30, 2025
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
- Publication number 20250029883
- Publication date Jan 23, 2025
- Fuji Electric Co., Ltd.
- Shohei KASAI
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with electromagnetic interference film and met...

Semiconductor package with EMI shield and fabricating method thereof

3D semiconductor device and structure with metal layers and memory...

Proximity sensor including enclosed accommodation space with sealed...

Dummy structure of stacked and bonded semiconductor device

Through stack bridge bonding devices and associated methods

Semiconductor package

Integrated circuit structure

Integrated circuit package having wirebonded multi-die stack

Semiconductor package having side wall plating

Fan-out package having a main die and a dummy die

Component arrangement, package and package arrangement, as well as...

DC and AC magnetic field protection for MRAM device using magnetic-...

MEMS packages and methods of manufacture thereof

Stiffener package and method of fabricating stiffener package

Light emitting device, resin package, resin-molded body, and method...

Package-on-package assembly with wire bond vias

Reliable semiconductor packages

Systems and methods for integrated shielding in a current sensor

Transient liquid phase bonding compositions and power electronics a...

Power module and related methods

Packaging structure of power semiconductor module

Electronic component package

Radio-frequency switching devices having improved voltage handling...

Electronic device with top side pin array and manufacturing method...

High voltage solid-state transducers and solid-state transducer arr...

3D semiconductor devices and structures with metal layers

Light emitting diode with high efficiency

Package structure

Electronic sensors with sensor die in package structure cavity

Patents Applicationslast 30 patents

RESIN MOLDED PRODUCT AND MANUFACTURING METHOD THEREOF, AND WAVELENG...

MECHANICAL MITIGATION OF NEUTRON SEE

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES...

DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF

DEVICE PACKAGES WITH INTEGRATED MILLIMETER-WAVE REFLECTOR CAVITIES

METHOD FOR FORMING PACKAGE STRUCTURE

LONG-LIFE EXTENDED TEMPERATURE RANGE EMBEDDED DIODE DESIGN FOR ELEC...

SEMICONDUCTOR DEVICE

PACKAGE SUBSTRATE EMPLOYING FILM SUBSTRATE AND AN OUTER PRE-IMPREGN...

Systems and Methods for Integrated Shielding in a Current Sensor

SOLID STATE LIGHTING DEVICES WITH ACCESSIBLE ELECTRODES AND METHODS...

DUAL SWITCHING POWER DEVICE

MANUFACTURABLE DEVICES FORMED ON GALLIUM AND NITROGEN MATERIAL

CAVITY INTEGRATED CIRCUIT

LIGHT SOURCE DEVICE AND DISPLAY UNIT

SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING TH...

SEMICONDUCTOR DEVICE

DUAL SEMICONDUCTOR DIE CURRENT SENSOR INTEGRATED CIRCUIT

SEMICONDUCTOR DEVICE

IMAGING DEVICE, IMAGING MODULE, ELECTRONIC DEVICE, AND IMAGING SYSTEM

METHODS RELATED TO RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVE...

IC PACKAGE WITH IMMERSION TIN ON FLANK

BASE MEMBER FOR LIGHT EMITTING DEVICE

COMPUTING DEVICE

SEMICONDUCTOR PACKAGE

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Semiconductor Chip Package and Manufacturing Method Thereof

Submounts with Stud Protrusions for Semiconductor Packages

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE