Arrangement of the bonding areas prior to mounting

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/8019Arrangement of the bonding areas prior to mounting

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Arrangement of the bonding areas prior to mounting

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor interconnect structure and method

Device including semiconductor chips and method for producing such...

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Semiconductor device

Semiconductor device

Device including semiconductor chips and method for producing such...

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Solid-state imaging device, manufacturing method thereof, and elect...

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Methods of forming a microelectronic device structure, and related...

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Patents Applicationslast 30 patents

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DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...

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CONDUCTIVE BARRIER DIRECT HYBRID BONDING

SEMICONDUCTOR DEVICE

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CONDUCTIVE BARRIER DIRECT HYBRID BONDING

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ELECTRONIC COMPONENT MOUNTING STRUCTURE