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Arrangements for conducting electric current to or from the solid state body in operation
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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H01L23/48
Arrangements for conducting electric current to or from the solid state body in operation
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Patents Grants
last 30 patents
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Patent Grant
Deep trench capacitors in an inter-layer medium on an interconnect...
Patent number
11,973,019
Issue date
Apr 30, 2024
QUALCOMM Incorporated
Jihong Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solid-state imaging apparatus having output circuit unit for output...
Patent number
11,973,091
Issue date
Apr 30, 2024
Sony Corporation
Harumi Tanaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Self-aligned contact openings for backside through substrate vias
Patent number
11,973,006
Issue date
Apr 30, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Jeffrey Peter Gambino
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
Patent number
11,973,007
Issue date
Apr 30, 2024
Rohm Co., Ltd.
Toshio Hanada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Through-silicon transmission lines and other structures enabled by...
Patent number
11,973,057
Issue date
Apr 30, 2024
Analog Devices, Inc.
Ed Balboni
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method of semiconductor device
Patent number
11,973,022
Issue date
Apr 30, 2024
SK hynix Inc.
Sang Yong Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and method for forming same
Patent number
11,973,045
Issue date
Apr 30, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC.
Ling-Yi Chuang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flip-chip semiconductor-on-insulator transistor layout
Patent number
11,973,033
Issue date
Apr 30, 2024
Skyworks Solutions, Inc.
Yang Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Silica-containing substrates with vias having an axially variable s...
Patent number
11,972,993
Issue date
Apr 30, 2024
Corning Incorporated
Rachel Eileen Dahlberg
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
Patent number
11,967,543
Issue date
Apr 23, 2024
Rohm Co., Ltd.
Toshio Hanada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor device and structure with metal layers
Patent number
11,967,583
Issue date
Apr 23, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices and electronic systems including the same
Patent number
11,967,623
Issue date
Apr 23, 2024
Samsung Electronics Co., Ltd.
Sunggil Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heterogeneous packaging integration of photonic and electronic elem...
Patent number
11,966,090
Issue date
Apr 23, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Stefan Rusu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaging substrate, and semiconductor device comprising same
Patent number
11,967,542
Issue date
Apr 23, 2024
ABSOLICS INC.
Sungjin Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Assembly including plural through wafer vias, method of cooling the...
Patent number
11,967,548
Issue date
Apr 23, 2024
International Business Machines Corporation
Kerry Bernstein
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with sidewall interconnection structure and me...
Patent number
11,961,787
Issue date
Apr 16, 2024
Institute of Microelectronics, Chinese Academy of Sciences
Huilong Zhu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device, method of manufacturing a semiconductor devic...
Patent number
11,961,865
Issue date
Apr 16, 2024
Sony Group Corporation
Hideaki Togashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
One-time programmable memory device including anti-fuse element
Patent number
11,963,347
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Chiung-Ting Ou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonded wafer device structure and methods for making the same
Patent number
11,961,826
Issue date
Apr 16, 2024
Harry-Hak-Lay Chuang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Devices and methods related to dual-sided radio-frequency package w...
Patent number
11,961,805
Issue date
Apr 16, 2024
Skyworks Solutions, Inc.
Howard E. Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including through-electrodes
Patent number
11,961,788
Issue date
Apr 16, 2024
Samsung Electronics Co., Ltd.
Hyoukyung Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor device and structure with metal layers
Patent number
11,961,827
Issue date
Apr 16, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,961,882
Issue date
Apr 16, 2024
Samsung Electronics Co., Ltd.
Shaofeng Ding
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,955,383
Issue date
Apr 9, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC.
Jie Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ultra small molded module integrated with die by module-on-wafer as...
Patent number
11,955,434
Issue date
Apr 9, 2024
Intel Corporation
Yoshihiro Tomita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit semiconductor device including through silicon via
Patent number
11,955,408
Issue date
Apr 9, 2024
Samsung Electronics Co., Ltd.
Sohye Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate comprising interconnects in a core layer configured for s...
Patent number
11,955,409
Issue date
Apr 9, 2024
QUALCOMM Incorporated
Aniket Patil
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal pads over TSV
Patent number
11,955,445
Issue date
Apr 9, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Guilian Gao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reducing loss in stacked quantum devices
Patent number
11,955,465
Issue date
Apr 9, 2024
Google LLC
Theodore Charles White
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Etch damage and ESL free dual damascene metal interconnect
Patent number
11,955,376
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Sunil Kumar Singh
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Active Microelectronic Assembly Containing A Decoupling Capacitor
Publication number
20240145449
Publication date
May 2, 2024
KYOCERA AVX Components Corporation
Laurent Desclos
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TRANSISTORS WITH ASYMMETRIC SOURCE/DRAIN REGIONS
Publication number
20240145538
Publication date
May 2, 2024
International Business Machines Corporation
Min Gyu Sung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING MULTI-DIMENSION THROUGH SILICON VIA...
Publication number
20240145435
Publication date
May 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Ke-Gang Wen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
Publication number
20240145322
Publication date
May 2, 2024
Medtronic, Inc.
Chunho KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH THROUGH-MOLD VIA
Publication number
20240145346
Publication date
May 2, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Dong Joo PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package Assembly
Publication number
20240145529
Publication date
May 2, 2024
KYOCERA AVX Components Corporation
Laurent Desclos
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS FOR PRODUCING A 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH...
Publication number
20240145289
Publication date
May 2, 2024
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240145345
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Yeonggil KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RESISTIVE MEMORY ELEMENTS ACCESSED BY BIPOLAR JUNCTION TRANSISTORS
Publication number
20240147736
Publication date
May 2, 2024
GLOBALFOUNDRIES U.S. Inc.
Venkatesh P. Gopinath
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT ARCHITECTURE WITH SILICON INTERPOSER AND EMIB
Publication number
20240145395
Publication date
May 2, 2024
Intel Corporation
MD Altaf HOSSAIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES HAVING TEST PADS
Publication number
20240145317
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Joongwon Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CELL ARCHITECTURE WITH CENTER-LINE POWER RAILS FOR STACKED FIELD-EF...
Publication number
20240145343
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Panjae PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
VIA STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20240145344
Publication date
May 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Tsung-Chieh Hsiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD
Publication number
20240145364
Publication date
May 2, 2024
STMicroelectronics S.r.l
Aurora SANNA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE WITH INDUCTOR EMBEDDED IN BONDED SEMICONDUCTOR SUBSTRATES...
Publication number
20240145382
Publication date
May 2, 2024
GLOBALFOUNDRIES U.S. Inc.
Ravi P. Srivastava
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Packaged Semiconductor Devices and Methods of Forming the Same
Publication number
20240145431
Publication date
May 2, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Yung-Lung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240138136
Publication date
Apr 25, 2024
Samsung Electronics Co., Ltd.
Jeewoong KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE, SEMICONDUCTOR DEVICE AND METHOD FOR FORMING SEMI...
Publication number
20240136284
Publication date
Apr 25, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC
Jiarui ZHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED CHIP AND FABRICATION METHOD OF STACKED CHIP
Publication number
20240136314
Publication date
Apr 25, 2024
Advantest Corporation
Shinji SUGATANI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240136340
Publication date
Apr 25, 2024
Samsung Electronics Co., Ltd.
Mina Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ISOLATION RAIL BETWEEN BACKSIDE POWER RAILS
Publication number
20240136253
Publication date
Apr 25, 2024
International Business Machines Corporation
Nicholas Anthony Lanzillo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20240136255
Publication date
Apr 25, 2024
Samsung Electronics Co., Ltd.
Bongwee YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
Publication number
20240136290
Publication date
Apr 25, 2024
Samsung Electronics Co., Ltd.
Jee Woong KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION
Publication number
20240136346
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chien Hung LIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Hybrid Power Rail Formation in Dielectric Isolation for Semiconduct...
Publication number
20240136288
Publication date
Apr 25, 2024
International Business Machines Corporation
Nikhil Jain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
Publication number
20240136341
Publication date
Apr 25, 2024
Samsung Electronics Co., Ltd.
Seokgeun AHN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE FAN-O...
Publication number
20240136264
Publication date
Apr 25, 2024
Samsung Electronics Co., Ltd.
Chiwan SONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES
Publication number
20240136334
Publication date
Apr 25, 2024
Samsung Electronics Co., Ltd.
Jinnam KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR POWER MODULE
Publication number
20240136335
Publication date
Apr 25, 2024
ROHM CO., LTD.
Kenji HAYASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT DEVICE
Publication number
20240136254
Publication date
Apr 25, 2024
Samsung Electronics Co., Ltd.
Sangkoo KANG
H01 - BASIC ELECTRIC ELEMENTS