Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections

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H01L23/52

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections

Industries

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit and method of designing the same
- Patent number 12,147,751
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Seungman Lim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Tiered-profile contact for semiconductor
- Patent number 12,148,663
- Issue date Nov 19, 2024
- International Business Machines Corporation
- Kisik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices having air gap structures integrated with i...
- Patent number 12,148,690
- Issue date Nov 19, 2024
- Tahoe Research, LTD.
- Han Wui Then
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,148,692
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 12,148,837
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Bo Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
eFUSE programming feedback circuits and methods
- Patent number 12,150,298
- Issue date Nov 19, 2024
- Texas Instruments Incorporated
- Anand Seshadri
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor chip
- Patent number 12,150,308
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Feng Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including a trench having a high aspect rat...
- Patent number 12,148,654
- Issue date Nov 19, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yong Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device manufacturing method
- Patent number 12,148,698
- Issue date Nov 19, 2024
- Realtek Semiconductor Corporation
- Chien Cheng Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High aspect ratio buried power rail metallization
- Patent number 12,148,699
- Issue date Nov 19, 2024
- International Business Machines Corporation
- Sagarika Mukesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices and methods for forming the same
- Patent number 12,148,714
- Issue date Nov 19, 2024
- Yangtze Memory Technologies Co., Ltd.
- Wei Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method for fabricating the same
- Patent number 12,148,831
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure and same
- Patent number 12,150,294
- Issue date Nov 19, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Zhongming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Co-optimizing power supply voltage in an integrated circuit design
- Patent number 12,147,749
- Issue date Nov 19, 2024
- Synopsys, Inc.
- Qiang Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,148,657
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for reducing dual damascene distortion
- Patent number 12,148,696
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chao-Chun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, and associated method and system
- Patent number 12,148,700
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shih-Wei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layout pattern for magnetoresistive random access memory
- Patent number 12,150,315
- Issue date Nov 19, 2024
- United Microelectronics Corp.
- Ya-Huei Tsai
- G11 - INFORMATION STORAGE
Information Patent Grant
Methods for forming stairs in three-dimensional memory devices
- Patent number 12,148,655
- Issue date Nov 19, 2024
- Yangtze Memory Technologies Co., Ltd.
- Xiangning Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated structure and manufacturing method the...
- Patent number 12,148,691
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with patterned ground shielding
- Patent number 12,148,694
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods of local interconnect stitches and power grids
- Patent number 12,148,697
- Issue date Nov 19, 2024
- ARM Limited
- Jean-Luc Pelloie
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated magnetic assembly
- Patent number 12,148,556
- Issue date Nov 19, 2024
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of a placeholder for backside contact formation for transistor...
- Patent number 12,148,751
- Issue date Nov 19, 2024
- Intel Corporation
- Andy Chih-Hung Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate and display panel
- Patent number 12,148,762
- Issue date Nov 19, 2024
- Hefei Xinsheng Optoelectronics Technology Co., Ltd.
- Xingfeng Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active via
- Patent number 12,148,838
- Issue date Nov 19, 2024
- ZINITE CORPORATION
- Douglas W. Barlage
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon transformer integrated chip
- Patent number 12,148,693
- Issue date Nov 19, 2024
- Murata Manufacturing Co., Ltd.
- Takayuki Tange
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fuse structure and manufacturing method thereof
- Patent number 12,148,695
- Issue date Nov 19, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Xiong LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with built-in electronic components and electronic device
- Patent number 12,148,724
- Issue date Nov 19, 2024
- Fujitsu Limited
- Yukiko Oshikubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetoresistive random access memory having a blocking layer on me...
- Patent number 12,150,313
- Issue date Nov 19, 2024
- United Microelectronics Corp.
- Jia-Rong Wu
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
Structure and Method for MRAM Devices with a Slot Via
- Publication number 20240386932
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Fan Huang
- G11 - INFORMATION STORAGE
Information Patent Application
SYSTEMS AND METHODS OF TESTING MEMORY DEVICES
- Publication number 20240387303
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT AND METHOD OF FORMING
- Publication number 20240387316
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through-Circuit Vias In Interconnect Structures
- Publication number 20240387331
- Publication date Nov 21, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Jian-Hong LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING
- Publication number 20240387354
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wan-Yu Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CONTACT STRUCTURE
- Publication number 20240387356
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECT STRUCTURE WITH BOTTOM SELF-ALIGNED VIA L...
- Publication number 20240387357
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING OVERLYING THIN FILM TRAN...
- Publication number 20240387370
- Publication date Nov 21, 2024
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Satoru MAYUZUMI
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF
- Publication number 20240387372
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Chih Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Having a High Cell Density
- Publication number 20240387373
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Sheng-Hsiung Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LOW-RESISTANCE COPPER INTERCONNECTS
- Publication number 20240387382
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DELAMINATION SENSOR
- Publication number 20240387411
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240387462
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Junbae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RUTHENIUM-BASED LINER FOR A COPPER INTERCONNECT
- Publication number 20240387256
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Min LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multigate Devices with Varying Channel Layers
- Publication number 20240387743
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuan-Lun Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20240387789
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITORS WITH THICK INTERMEDIATE ELECTRODE...
- Publication number 20240387609
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMMON RAIL CONTACT
- Publication number 20240387655
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUTTED CONTACTS AND METHODS OF FABRICATING THE SAME IN SEMICONDUCTO...
- Publication number 20240387658
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Zhen YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Thereof
- Publication number 20240387664
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY ARRAYS WITH LAYER SELECTOR TRANSISTORS
- Publication number 20240389300
- Publication date Nov 21, 2024
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING THREE-DIMENSIONAL MEMORY DEVICES
- Publication number 20240389334
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE OF THREE-DIMENSIONAL MEMORY ARRAY
- Publication number 20240389339
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Han LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP
- Publication number 20240389351
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Feng Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR IMPLEMENTING CAPACITORS IN SEMICONDUCTOR...
- Publication number 20240387353
- Publication date Nov 21, 2024
- Intel Corporation
- Michael Langenbuch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MANUFACTURING AN INTERCONNECT STRUCTURE
- Publication number 20240387358
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- KHADERBAD MRUNAL ABHIJITH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure of Semiconductor Device and Method of Formin...
- Publication number 20240387360
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tung Ying Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ONE-TIME-PROGRAMMABLE DEVICE STRUCTURE
- Publication number 20240387365
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURES AND METHODS OF MANUFACTURE
- Publication number 20240387366
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Ming LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIDDLE-END-OF-LINE STRAP FOR STANDARD CELL
- Publication number 20240387369
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Hung SHEN
- H01 - BASIC ELECTRIC ELEMENTS

Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated circuit and method of designing the same

Tiered-profile contact for semiconductor

Microelectronic devices having air gap structures integrated with i...

Semiconductor package and manufacturing method thereof

Semiconductor devices

eFUSE programming feedback circuits and methods

Semiconductor chip

Semiconductor structure including a trench having a high aspect rat...

Semiconductor device and semiconductor device manufacturing method

High aspect ratio buried power rail metallization

Three-dimensional memory devices and methods for forming the same

Semiconductor device and a method for fabricating the same

Method for manufacturing semiconductor structure and same

Co-optimizing power supply voltage in an integrated circuit design

Semiconductor structure and method for forming the same

Methods for reducing dual damascene distortion

Semiconductor device, and associated method and system

Layout pattern for magnetoresistive random access memory

Methods for forming stairs in three-dimensional memory devices

Three-dimensional integrated structure and manufacturing method the...

Semiconductor device with patterned ground shielding

Devices and methods of local interconnect stitches and power grids

Integrated magnetic assembly

Use of a placeholder for backside contact formation for transistor...

Array substrate and display panel

Active via

Silicon transformer integrated chip

Fuse structure and manufacturing method thereof

Package with built-in electronic components and electronic device

Magnetoresistive random access memory having a blocking layer on me...

Patents Applicationslast 30 patents

Structure and Method for MRAM Devices with a Slot Via

SYSTEMS AND METHODS OF TESTING MEMORY DEVICES

SEMICONDUCTOR ARRANGEMENT AND METHOD OF FORMING

Through-Circuit Vias In Interconnect Structures

SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING

SEMICONDUCTOR DEVICE WITH CONTACT STRUCTURE

SEMICONDUCTOR INTERCONNECT STRUCTURE WITH BOTTOM SELF-ALIGNED VIA L...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING OVERLYING THIN FILM TRAN...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF

Integrated Circuit Having a High Cell Density

LOW-RESISTANCE COPPER INTERCONNECTS

DELAMINATION SENSOR

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

RUTHENIUM-BASED LINER FOR A COPPER INTERCONNECT

Multigate Devices with Varying Channel Layers

SEMICONDUCTOR DEVICES

METAL-INSULATOR-METAL CAPACITORS WITH THICK INTERMEDIATE ELECTRODE...

COMMON RAIL CONTACT

BUTTED CONTACTS AND METHODS OF FABRICATING THE SAME IN SEMICONDUCTO...

Semiconductor Device and Method of Forming Thereof

THREE-DIMENSIONAL MEMORY ARRAYS WITH LAYER SELECTOR TRANSISTORS

METHODS OF FORMING THREE-DIMENSIONAL MEMORY DEVICES

STRUCTURE OF THREE-DIMENSIONAL MEMORY ARRAY

SEMICONDUCTOR CHIP

METHODS AND APPARATUS FOR IMPLEMENTING CAPACITORS IN SEMICONDUCTOR...

METHODS FOR MANUFACTURING AN INTERCONNECT STRUCTURE

Interconnect Structure of Semiconductor Device and Method of Formin...

ONE-TIME-PROGRAMMABLE DEVICE STRUCTURE

SEMICONDUCTOR DEVICE STRUCTURES AND METHODS OF MANUFACTURE

MIDDLE-END-OF-LINE STRAP FOR STANDARD CELL