Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections

Industries

Patents Grantslast 30 patents

Information Patent Grant
Stack for fabricating an integrated circuit intended to perform an...
- Patent number 11,990,678
- Issue date May 21, 2024
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Gabriel Pares
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same, and ele...
- Patent number 11,990,366
- Issue date May 21, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Suguru Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Amplifier modules with power transistor die and peripheral ground c...
- Patent number 11,990,384
- Issue date May 21, 2024
- Elie A. Maalouf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,990,390
- Issue date May 21, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ping-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capping layer overlying dielectric structure to increase reliability
- Patent number 11,990,400
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Ya Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-end-of-line passive device structure
- Patent number 11,990,401
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric helmet-based approaches for back end of line (BEOL) inte...
- Patent number 11,990,403
- Issue date May 21, 2024
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buried power rails located in a base layer including first, second,...
- Patent number 11,990,412
- Issue date May 21, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including aluminum alloy word lines...
- Patent number 11,990,413
- Issue date May 21, 2024
- SanDisk Technologies LLC
- Linghan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 11,990,415
- Issue date May 21, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Tiantian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including first structure having peripheral circuit and seco...
- Patent number 11,990,450
- Issue date May 21, 2024
- Samsung Electronics Co., Ltd.
- Eunji Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical memory device
- Patent number 11,991,883
- Issue date May 21, 2024
- Samsung Electronics Co., Ltd.
- Chang-Bum Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with buffer layer
- Patent number 11,990,353
- Issue date May 21, 2024
- Pep Innovation PTE Ltd.
- Hwee Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with fine metal lines for BEOL structure and m...
- Patent number 11,990,409
- Issue date May 21, 2024
- Samsung Electronics Co., Ltd.
- Taeyong Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via interconnect having a line with a reduced bottom dimension
- Patent number 11,990,410
- Issue date May 21, 2024
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including under bump metallization pad
- Patent number 11,990,439
- Issue date May 21, 2024
- Samsung Electronics Co., Ltd.
- Jaeean Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including topside cooling interfaces and me...
- Patent number 11,990,872
- Issue date May 21, 2024
- NXP USA, INC.
- Geoffrey Tucker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variable capacitor bank
- Patent number 11,990,884
- Issue date May 21, 2024
- AES Global Holdings, PTE. LTD
- Courtney L. Crandell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory
- Patent number 11,991,887
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chenchen Jacob Wang
- G11 - INFORMATION STORAGE
Information Patent Grant
Voltage regulator with power rail tracking
- Patent number 11,989,046
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Haruki Mori
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Capacitor with MIM
- Patent number 11,990,504
- Issue date May 21, 2024
- Sumitomo Electric Device Innovations, Inc.
- Yoshihide Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming conductive vias, and associated devices and sys...
- Patent number 11,990,370
- Issue date May 21, 2024
- Micron Technology, Inc.
- Trupti D. Gawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device chip scale package including a protective layer
- Patent number 11,990,411
- Issue date May 21, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Tae Ki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation for semiconductor devices and methods of manufacture
- Patent number 11,990,404
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Fong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of a semiconductor device and method for creat...
- Patent number 11,990,406
- Issue date May 21, 2024
- Kioxia Corporation
- Kosuke Yanagidaira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
WLCSP reliability improvement for package edges including package s...
- Patent number 11,990,408
- Issue date May 21, 2024
- Intel Corporation
- Thomas Wagner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BEOL alternative metal interconnects: integration and process
- Patent number 11,990,414
- Issue date May 21, 2024
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with logic and memory
- Patent number 11,991,884
- Issue date May 21, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and equipment
- Patent number 11,990,402
- Issue date May 21, 2024
- Canon Kabushiki Kaisha
- Yuichi Kazue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement and method for producing a semiconductor...
- Patent number 11,990,405
- Issue date May 21, 2024
- Infineon Technologies AG
- Michael Stadler
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING DEEP TRENCH CAPACITOR AND METHOD OF...
- Publication number 20240170584
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-HSUAN TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFRARED DEBOND DAMAGE MITIGATION BY COPPER FILL PATTERN
- Publication number 20240170288
- Publication date May 23, 2024
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INTERCONNECT LEVEL COMPRISING MULTI-HEIGHT LINES...
- Publication number 20240170394
- Publication date May 23, 2024
- Intel Corporation
- Elijah Karpov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAGGERED SIGNAL LINE INTERCONNECT STRUCTURE
- Publication number 20240170395
- Publication date May 23, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING AIR GAPS AND METHOD FOR MANUFACTURIN...
- Publication number 20240170403
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVE SKIP VIA
- Publication number 20240170404
- Publication date May 23, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240170463
- Publication date May 23, 2024
- RENESAS ELECTRONICS CORPORATION
- Takayuki IGARASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE...
- Publication number 20240170475
- Publication date May 23, 2024
- Resonac Corporation
- Shizu FUKUZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240168084
- Publication date May 23, 2024
- United Microelectronics Corp.
- Jih-Shun Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE CAPABLE OF SWITCHING OPERATION VOLTAGE
- Publication number 20240170040
- Publication date May 23, 2024
- Micron Technology, Inc.
- YUKI MIURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240170382
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- Juhyeon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND SYSTEM HAVING THE SAME
- Publication number 20240170389
- Publication date May 23, 2024
- Yangtze Memory Technologies Co., Ltd.
- Jiajia Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL METAL-INSULATOR-METAL (MIM) CAPACITORS AND TRENCHES
- Publication number 20240170390
- Publication date May 23, 2024
- MICROCHIP TECHNOLOGY INCORPORATED
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH INTERPOSER ENCAPSULATED BY AN ENCAPSULANT
- Publication number 20240170396
- Publication date May 23, 2024
- Advanced Semiconductor Engineering, Inc.
- Yung-Shun CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH LINES AND VIAS WITH VARIABLE HEIGHT FOR L...
- Publication number 20240170399
- Publication date May 23, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20240170483
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- Gunho Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240170490
- Publication date May 23, 2024
- UNITED MICROELECTRONICS CORP.
- BO TAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20240172417
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- Sohyeon BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR FABRIC...
- Publication number 20240172444
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- Sang-Yong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY
- Publication number 20240170319
- Publication date May 23, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-TRANSFORMER FOR ISOLATORS
- Publication number 20240170205
- Publication date May 23, 2024
- Renesas Electronics America Inc.
- Tetsuo SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND MANUFACTURING METHOD OF THE MEMORY DEVICE
- Publication number 20240170400
- Publication date May 23, 2024
- SK HYNIX INC.
- Jae Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MEMORY DEVI...
- Publication number 20240170405
- Publication date May 23, 2024
- Micron Technology, Inc.
- Sidhartha Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PROVIDING GALVANIC ISOLATION AND DEVICE INCLUDIN...
- Publication number 20240170476
- Publication date May 23, 2024
- WELLANG CO., LTD.
- Jong Tae HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE WITH ALTERNATING METAL LINES
- Publication number 20240172409
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Hao Pao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, AND ELECTRON...
- Publication number 20240172445
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- Dongyoung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE MODULE, MANUFACTURING METHOD THEREFOR, AND INDUCTOR-CAPACITO...
- Publication number 20240170391
- Publication date May 23, 2024
- SG MICRO CORP
- Lei Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WRAP AROUND METAL VIA STRUCTURE
- Publication number 20240170392
- Publication date May 23, 2024
- International Business Machines Corporation
- Reinaldo Vega
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240170401
- Publication date May 23, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Yichao WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED INTERCONNECTION FOR WAFER ON WAFER PACKAGING
- Publication number 20240170426
- Publication date May 23, 2024
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS

Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Stack for fabricating an integrated circuit intended to perform an...

Semiconductor device and method for manufacturing the same, and ele...

Amplifier modules with power transistor die and peripheral ground c...

Semiconductor structure

Capping layer overlying dielectric structure to increase reliability

Back-end-of-line passive device structure

Dielectric helmet-based approaches for back end of line (BEOL) inte...

Buried power rails located in a base layer including first, second,...

Three-dimensional memory device including aluminum alloy word lines...

Semiconductor device and method for forming the same

Device including first structure having peripheral circuit and seco...

Vertical memory device

Semiconductor device with buffer layer

Semiconductor device with fine metal lines for BEOL structure and m...

Top via interconnect having a line with a reduced bottom dimension

Semiconductor package including under bump metallization pad

Power amplifier modules including topside cooling interfaces and me...

Variable capacitor bank

Three-dimensional memory

Voltage regulator with power rail tracking

Capacitor with MIM

Methods for forming conductive vias, and associated devices and sys...

Device chip scale package including a protective layer

Heat dissipation for semiconductor devices and methods of manufacture

Manufacturing method of a semiconductor device and method for creat...

WLCSP reliability improvement for package edges including package s...

BEOL alternative metal interconnects: integration and process

3D semiconductor device and structure with logic and memory

Semiconductor apparatus and equipment

Semiconductor arrangement and method for producing a semiconductor...

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE HAVING DEEP TRENCH CAPACITOR AND METHOD OF...

INFRARED DEBOND DAMAGE MITIGATION BY COPPER FILL PATTERN

INTEGRATED CIRCUIT INTERCONNECT LEVEL COMPRISING MULTI-HEIGHT LINES...

STAGGERED SIGNAL LINE INTERCONNECT STRUCTURE

SEMICONDUCTOR STRUCTURE HAVING AIR GAPS AND METHOD FOR MANUFACTURIN...

SUBTRACTIVE SKIP VIA

ELECTRONIC DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE...

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE CAPABLE OF SWITCHING OPERATION VOLTAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

THREE-DIMENSIONAL MEMORY DEVICES AND SYSTEM HAVING THE SAME

THREE-DIMENSIONAL METAL-INSULATOR-METAL (MIM) CAPACITORS AND TRENCHES

PACKAGE STRUCTURE WITH INTERPOSER ENCAPSULATED BY AN ENCAPSULANT

SEMICONDUCTOR DEVICE WITH LINES AND VIAS WITH VARIABLE HEIGHT FOR L...

INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICES

THREE DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR FABRIC...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY

MICRO-TRANSFORMER FOR ISOLATORS

MEMORY DEVICE AND MANUFACTURING METHOD OF THE MEMORY DEVICE

METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MEMORY DEVI...

INTEGRATED CIRCUIT PROVIDING GALVANIC ISOLATION AND DEVICE INCLUDIN...

MEMORY DEVICE WITH ALTERNATING METAL LINES

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, AND ELECTRON...

DEVICE MODULE, MANUFACTURING METHOD THEREFOR, AND INDUCTOR-CAPACITO...

WRAP AROUND METAL VIA STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

ADVANCED INTERCONNECTION FOR WAFER ON WAFER PACKAGING