Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections

Industries

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Patents Grantslast 30 patents

Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 12,368,138
- Issue date Jul 22, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-substrate composite semiconductor device
- Patent number 12,368,052
- Issue date Jul 22, 2025
- Infineon Technologies Austria AG
- Christian Fachmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor structure comprising a gap an...
- Patent number 12,368,074
- Issue date Jul 22, 2025
- CHANGXI MEMORY TECHNOLOGIES, INC.
- Ting Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices with through-substrate interconnects and as...
- Patent number 12,368,096
- Issue date Jul 22, 2025
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic system including the same
- Patent number 12,368,099
- Issue date Jul 22, 2025
- Samsung Electronics Co., Ltd.
- Junhyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion barrier layer for conductive via to decrease contact resi...
- Patent number 12,368,103
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor device
- Patent number 12,368,098
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses including interconnect structures including dielectric...
- Patent number 12,368,101
- Issue date Jul 22, 2025
- Battelle Energy Alliance, LLC
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory cell and semiconductor memory device with the same
- Patent number 12,369,306
- Issue date Jul 22, 2025
- SK Hynix Inc.
- Seung Hwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices having a support stack comprising...
- Patent number 12,369,317
- Issue date Jul 22, 2025
- Yangtze Memory Technologies Co., Ltd.
- Kun Zhang
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device having air gap and method for manufacturing th...
- Patent number 12,368,073
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Yu Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package comprising conductive layer connected electrode...
- Patent number 12,368,081
- Issue date Jul 22, 2025
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid integrated circuit packages
- Patent number 12,368,146
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with etched landing pad surface and manufactur...
- Patent number 12,369,298
- Issue date Jul 22, 2025
- NANYA TECHNOLOGY CORPORATION
- Yen-Ho Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects, inductors, transformers, and power architectures for...
- Patent number 12,368,100
- Issue date Jul 22, 2025
- Synopsys, Inc.
- Jamil Kawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device
- Patent number 12,369,292
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Hsin Nien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing dual-depth drain-select-...
- Patent number 12,369,319
- Issue date Jul 22, 2025
- SanDisk Technologies, Inc.
- Akihiro Tobioka
- G11 - INFORMATION STORAGE
Information Patent Grant
IGBT chip integrating temperature sensor
- Patent number 12,368,082
- Issue date Jul 22, 2025
- Huawei Technologies Co., Ltd.
- Boning Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures and methods of forming the same
- Patent number 12,368,094
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mao-Nan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simultaneous filling of variable aspect ratio single damascene cont...
- Patent number 12,368,095
- Issue date Jul 22, 2025
- Intel Corporation
- AKM Shaestagir Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structures for reducing electrical shorts and methods of fo...
- Patent number 12,368,097
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Tung-Jiun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor devices with shared electrode and methods of fabrication
- Patent number 12,369,326
- Issue date Jul 22, 2025
- Kepler Computing Inc.
- Noriyuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory array structure
- Patent number 12,362,015
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Gerben Doornbos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anti-fuse address decoding circuit, operation method, and memory
- Patent number 12,362,025
- Issue date Jul 15, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Rumin Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan out package with integrated peripheral devices and methods
- Patent number 12,362,251
- Issue date Jul 15, 2025
- Intel Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a semiconductor device bonded to a cir...
- Patent number 12,362,276
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Partial barrier free vias for cobalt-based interconnects and method...
- Patent number 12,362,281
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Ling Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,362,282
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source/drain contacts and methods of forming same
- Patent number 12,363,946
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-volatile memory elements with one-time or multiple-time program...
- Patent number 12,363,892
- Issue date Jul 15, 2025
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Desmond Jia Jun Loy
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LAMINATION STRUCTURE MANUFACTURED BY LASER PATTERNING
- Publication number 20250239500
- Publication date Jul 24, 2025
- PANJIT INTERNATIONAL INC.
- Chung Hsiung HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE WITH EMBEDDED CAPACITOR PACKAGE HAVING REDISTRIBU...
- Publication number 20250239518
- Publication date Jul 24, 2025
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING METAL STRUCTURE HAVING FUNNEL-SHAPED INTERC...
- Publication number 20250239519
- Publication date Jul 24, 2025
- NANYA TECHNOLOGY CORPORATION
- MIN-CHUNG CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20250239526
- Publication date Jul 24, 2025
- KIOXIA Corporation
- Hikaru ARAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD OF ELECTRONIC PACKAGE
- Publication number 20250239530
- Publication date Jul 24, 2025
- VIA TECHNOLOGIES, INC.
- Yeh-Chi Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND SYSTEM INCLUDING THE SAME
- Publication number 20250240963
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Junhyoung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250241002
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Doohyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING CONTACT FEATURES IN FIELD-EFFECT TRANSISTORS
- Publication number 20250241052
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Hsiung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250241057
- Publication date Jul 24, 2025
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE
- Publication number 20250240965
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED CONTACTS
- Publication number 20250239486
- Publication date Jul 24, 2025
- Intel Corporation
- Mark T. BOHR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY ARRAYS AND METHODS USED IN FORMING A MEMORY ARRAY
- Publication number 20250239520
- Publication date Jul 24, 2025
- Lodestar Licensing Group LLC
- Harsh Narendrakumar Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE POWER SCHEME WITH FRONT-SIDE POWER INPUT
- Publication number 20250239523
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250239525
- Publication date Jul 24, 2025
- SK HYNIX INC.
- Se Ra HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CAPACITOR ARCHITECTURE USING CHIPPING D...
- Publication number 20250239539
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Minsu JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT MEMORY DEVICES THAT SUPPORT CHIP-SCALE PACKAGING
- Publication number 20250240966
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Kohji Kanamori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL THIN-FILM TRANSISTOR AND APPLICATION AS BIT-LINE CONNECTOR...
- Publication number 20250240970
- Publication date Jul 24, 2025
- Sunrise Memory Corporation
- Tianhong Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM RESISTOR AND METHODS OF FORMING THE SAME
- Publication number 20250240982
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chi CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250241012
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Sang Hee LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES HAVING ENHANCED POWER DELIVERY NETWORKS...
- Publication number 20250241060
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Seowoo Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INCLUDING SELF-ALIGNED CONDUCTIVE CONTACTS
- Publication number 20250239485
- Publication date Jul 24, 2025
- Micron Technology, Inc.
- Kar Wui Thong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE HAVING DIFFERENT SHAPE SUPPORT PILL...
- Publication number 20250239305
- Publication date Jul 24, 2025
- SANDISK TECHNOLOGIES LLC
- Akira TAKAHASHI
- G11 - INFORMATION STORAGE
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE WITH EMBEDDED POWER MANAGEMENT INTE...
- Publication number 20250239522
- Publication date Jul 24, 2025
- QUALCOMM Incorporated
- Xia LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-VOLTAGE SEMICONDUCTOR DEVICE
- Publication number 20250241000
- Publication date Jul 24, 2025
- Vanguard International Semiconductor Corporation
- Cheng-Tsung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED FET STRUCTURE WITH IMPROVED CELL HEIGHT
- Publication number 20250241059
- Publication date Jul 24, 2025
- International Business Machines Corporation
- Sagarika Mukesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PROVIDING POWER GATING AND METHOD OF DESIGNING T...
- Publication number 20250239524
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Jianfeng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250239449
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kun-Yen Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SELF-ALIGNED VIAS
- Publication number 20250239487
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250239298
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhon Jhy Liaw
- G11 - INFORMATION STORAGE
Information Patent Application
MEMORY DEVICE, METHOD OF MANUFACTURING, AND INTEGRATED CIRCUIT DEVICE
- Publication number 20250239304
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Huai-Ying HUANG
- G11 - INFORMATION STORAGE

Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

3D semiconductor device and structure with metal layers

Chip-substrate composite semiconductor device

Manufacturing method of semiconductor structure comprising a gap an...

Microelectronic devices with through-substrate interconnects and as...

Semiconductor device and electronic system including the same

Diffusion barrier layer for conductive via to decrease contact resi...

Methods of forming semiconductor device

Apparatuses including interconnect structures including dielectric...

Memory cell and semiconductor memory device with the same

Three-dimensional memory devices having a support stack comprising...

Semiconductor device having air gap and method for manufacturing th...

Electronic package comprising conductive layer connected electrode...

Hybrid integrated circuit packages

Semiconductor device with etched landing pad surface and manufactur...

Interconnects, inductors, transformers, and power architectures for...

Memory device

Three-dimensional memory device containing dual-depth drain-select-...

IGBT chip integrating temperature sensor

Semiconductor structures and methods of forming the same

Simultaneous filling of variable aspect ratio single damascene cont...

Contact structures for reducing electrical shorts and methods of fo...

Capacitor devices with shared electrode and methods of fabrication

Memory array structure

Anti-fuse address decoding circuit, operation method, and memory

Fan out package with integrated peripheral devices and methods

Semiconductor package having a semiconductor device bonded to a cir...

Partial barrier free vias for cobalt-based interconnects and method...

Semiconductor structure and manufacturing method thereof

Source/drain contacts and methods of forming same

Non-volatile memory elements with one-time or multiple-time program...

Patents Applicationslast 30 patents

LAMINATION STRUCTURE MANUFACTURED BY LASER PATTERNING

PACKAGE SUBSTRATE WITH EMBEDDED CAPACITOR PACKAGE HAVING REDISTRIBU...

METHOD OF MANUFACTURING METAL STRUCTURE HAVING FUNNEL-SHAPED INTERC...

SEMICONDUCTOR MEMORY DEVICE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD OF ELECTRONIC PACKAGE

MEMORY DEVICE AND SYSTEM INCLUDING THE SAME

SEMICONDUCTOR DEVICE

METHODS OF FORMING CONTACT FEATURES IN FIELD-EFFECT TRANSISTORS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

MEMORY DEVICE

SELF-ALIGNED CONTACTS

MEMORY ARRAYS AND METHODS USED IN FORMING A MEMORY ARRAY

BACKSIDE POWER SCHEME WITH FRONT-SIDE POWER INPUT

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE HAVING CAPACITOR ARCHITECTURE USING CHIPPING D...

INTEGRATED CIRCUIT MEMORY DEVICES THAT SUPPORT CHIP-SCALE PACKAGING

VERTICAL THIN-FILM TRANSISTOR AND APPLICATION AS BIT-LINE CONNECTOR...

THIN FILM RESISTOR AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT DEVICES HAVING ENHANCED POWER DELIVERY NETWORKS...

MEMORY DEVICE INCLUDING SELF-ALIGNED CONDUCTIVE CONTACTS

THREE-DIMENSIONAL MEMORY DEVICE HAVING DIFFERENT SHAPE SUPPORT PILL...

INTEGRATED CIRCUIT (IC) PACKAGE WITH EMBEDDED POWER MANAGEMENT INTE...

HIGH-VOLTAGE SEMICONDUCTOR DEVICE

STACKED FET STRUCTURE WITH IMPROVED CELL HEIGHT

INTEGRATED CIRCUIT PROVIDING POWER GATING AND METHOD OF DESIGNING T...

SEMICONDUCTOR DEVICE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH SELF-ALIGNED VIAS

INTEGRATED CIRCUIT STRUCTURE AND METHOD FOR FABRICATING THE SAME

MEMORY DEVICE, METHOD OF MANUFACTURING, AND INTEGRATED CIRCUIT DEVICE