Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of preparing semiconductor structure having low dielectric c...
- Patent number 12,205,825
- Issue date Jan 21, 2025
- NANYA TECHNOLOGY CORPORATION
- Yu-Kai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 12,205,888
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing fusible structures
- Patent number 12,205,891
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shao-Ting Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standard cell design architecture for reduced voltage droop utilizi...
- Patent number 12,205,897
- Issue date Jan 21, 2025
- Advanced Micro Devices, Inc.
- Richard T. Schultz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level design and wiring pattern for a semiconductor package
- Patent number 12,205,904
- Issue date Jan 21, 2025
- Nepes Co., Ltd.
- Yong Tae Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV as pad
- Patent number 12,205,926
- Issue date Jan 21, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and method of forming the same
- Patent number 12,205,941
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuang-Ching Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic protection element
- Patent number 12,206,017
- Issue date Jan 21, 2025
- Kabushiki Kaisha Tokai-Rika-Denki-Seisakusho
- Kengo Shima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-oxide-metal (MOM) capacitors for integrated circuit monitoring
- Patent number 12,205,885
- Issue date Jan 21, 2025
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the semiconductor...
- Patent number 12,205,887
- Issue date Jan 21, 2025
- Kioxia Corporation
- Masayuki Kitamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 12,205,889
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hsien Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact via formation
- Patent number 12,205,896
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Lin-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making semiconductor device including buried conductive f...
- Patent number 12,205,899
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Liang Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for forming semiconductor structure and semiconductor structure
- Patent number 12,205,893
- Issue date Jan 21, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Tianlei Mu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MRAM device with wrap-around top electrode
- Patent number 12,207,561
- Issue date Jan 21, 2025
- International Business Machines Corporation
- Shravana Kumar Katakam
- G11 - INFORMATION STORAGE
Information Patent Grant
Sensor packages
- Patent number 12,205,860
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Hsien Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and fabrication method thereof
- Patent number 12,205,883
- Issue date Jan 21, 2025
- Semiconductor Manufacturing International (Shanghai) Corporation
- Zhi Lin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit structure, semiconductor device and method of manufacturing...
- Patent number 12,205,890
- Issue date Jan 21, 2025
- Macronix International Co., Ltd.
- Li-Yen Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,205,892
- Issue date Jan 21, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Akio Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Routing pattern
- Patent number 12,205,894
- Issue date Jan 21, 2025
- Macronix International Co., Ltd.
- Chin-Cheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device having staircase structure and meth...
- Patent number 12,205,895
- Issue date Jan 21, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, circuit board structure and manufacturing met...
- Patent number 12,205,923
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tin-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with chiplets coupled to a memory device
- Patent number 12,205,924
- Issue date Jan 21, 2025
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory array with dual-level peripheral circuits...
- Patent number 12,207,459
- Issue date Jan 21, 2025
- SanDisk Technologies LLC
- Yuki Mizutani
- G11 - INFORMATION STORAGE
Information Patent Grant
Vertical memory devices and methods of manufacturing the same
- Patent number 12,207,469
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Junhyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 12,207,471
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Hae-min Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional memory structure fabrication using channel replac...
- Patent number 12,205,645
- Issue date Jan 21, 2025
- SUNRISE MEMORY CORPORATION
- Shohei Kamisaka
- G11 - INFORMATION STORAGE
Information Patent Grant
Methods of forming microelectronic devices, and related electronic...
- Patent number 12,205,846
- Issue date Jan 21, 2025
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices
- Patent number 12,207,473
- Issue date Jan 21, 2025
- Lodestar Licensing Group LLC
- Umberto Maria Meotto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to create MIMcap designs across changing MIMcap structures
- Patent number 12,205,884
- Issue date Jan 21, 2025
- Advanced Micro Devices, Inc.
- Regina Tien Schmidt
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING HORIZONTAL SEMICONDUCTOR...
- Publication number 20250024672
- Publication date Jan 16, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Takaaki IWAI
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250022788
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- KYOUNG LIM SUK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT, SYSTEM AND METHOD OF FORMING SAME
- Publication number 20250022801
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Hsin CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250022834
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- CHOONGBIN YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250022873
- Publication date Jan 16, 2025
- Murata Manufacturing Co., Ltd.
- Masayuki AOIKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME
- Publication number 20250022876
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Sung Min KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USE OF A PLACEHOLDER FOR BACKSIDE CONTACT FORMATION FOR TRANSISTOR...
- Publication number 20250022878
- Publication date Jan 16, 2025
- Intel Corporation
- Andy Chih-Hung Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE FOR III-NITRIDE TRANSISTORS WITH CAP LAYERS
- Publication number 20250022928
- Publication date Jan 16, 2025
- Finwave Semiconductor, Inc.
- Hal Emmer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assemblies Having Conductive Structures Along Pillars of Semiconduc...
- Publication number 20250022955
- Publication date Jan 16, 2025
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure And Method For Fabricating The Same
- Publication number 20250022749
- Publication date Jan 16, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Jun WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250022794
- Publication date Jan 16, 2025
- RENESAS ELECTRONICS CORPORATION
- Takayuki IGARASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250022796
- Publication date Jan 16, 2025
- ROHM CO., LTD.
- Seigo MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE INCLUDING METAL LINE AND TOP VIA FORMED THRO...
- Publication number 20250022797
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Jaemyung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RING STRUCTURE AND METHOD OF FORMING SAME
- Publication number 20250022825
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Han Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D NAND MEMORY DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20250024679
- Publication date Jan 16, 2025
- Yangtze Memory Technologies Co., Ltd.
- Yali SONG
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE HAVING CONTROLLED LATERAL ISOLATION...
- Publication number 20250024681
- Publication date Jan 16, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Takaaki IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE VIA
- Publication number 20250022961
- Publication date Jan 16, 2025
- ZINITE CORPORATION
- Douglas W. BARLAGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE COMPRISING STACKED THROUGH ENCAPSULATION VIA INTERCONNECTS
- Publication number 20250022858
- Publication date Jan 16, 2025
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE COMPRISING STIFFENER AND SCREW
- Publication number 20250022772
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Insik HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20250024657
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...
- Publication number 20250022939
- Publication date Jan 16, 2025
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250022793
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-I Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE LOCAL INTERCONNECT
- Publication number 20250022795
- Publication date Jan 16, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL CHIP OR WAFER STACK
- Publication number 20250022800
- Publication date Jan 16, 2025
- International Business Machines Corporation
- Timothy J. Chainer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250022844
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING SEMICONDUCTOR...
- Publication number 20250022798
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- HAKSEON KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20250022799
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Yong Jin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING TH...
- Publication number 20250022875
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Sunjung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250022930
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Sunjung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20250024683
- Publication date Jan 16, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS

Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of preparing semiconductor structure having low dielectric c...

Semiconductor packages and methods of forming the same

Methods of manufacturing fusible structures

Standard cell design architecture for reduced voltage droop utilizi...

Wafer-level design and wiring pattern for a semiconductor package

TSV as pad

Integrated circuit and method of forming the same

Electrostatic protection element

Metal-oxide-metal (MOM) capacitors for integrated circuit monitoring

Semiconductor device and method for manufacturing the semiconductor...

Semiconductor device and method of fabricating the same

Contact via formation

Method of making semiconductor device including buried conductive f...

Method for forming semiconductor structure and semiconductor structure

MRAM device with wrap-around top electrode

Sensor packages

Semiconductor structure and fabrication method thereof

Circuit structure, semiconductor device and method of manufacturing...

Semiconductor device

Routing pattern

Three-dimensional memory device having staircase structure and meth...

Semiconductor device, circuit board structure and manufacturing met...

Semiconductor packages with chiplets coupled to a memory device

Three-dimensional memory array with dual-level peripheral circuits...

Vertical memory devices and methods of manufacturing the same

Semiconductor memory device

Three-dimensional memory structure fabrication using channel replac...

Methods of forming microelectronic devices, and related electronic...

Memory devices

Method to create MIMcap designs across changing MIMcap structures

Patents Applicationslast 30 patents

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING HORIZONTAL SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT, SYSTEM AND METHOD OF FORMING SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME

USE OF A PLACEHOLDER FOR BACKSIDE CONTACT FORMATION FOR TRANSISTOR...

CONTACT STRUCTURE FOR III-NITRIDE TRANSISTORS WITH CAP LAYERS

Assemblies Having Conductive Structures Along Pillars of Semiconduc...

Semiconductor Structure And Method For Fabricating The Same

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

INTERCONNECT STRUCTURE INCLUDING METAL LINE AND TOP VIA FORMED THRO...

SEAL RING STRUCTURE AND METHOD OF FORMING SAME

3D NAND MEMORY DEVICE AND METHOD OF FORMING THE SAME

THREE-DIMENSIONAL MEMORY DEVICE HAVING CONTROLLED LATERAL ISOLATION...

ACTIVE VIA

DEVICE COMPRISING STACKED THROUGH ENCAPSULATION VIA INTERCONNECTS

SEMICONDUCTOR PACKAGE COMPRISING STIFFENER AND SCREW

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

BACKSIDE LOCAL INTERCONNECT

THREE-DIMENSIONAL CHIP OR WAFER STACK

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

THREE-DIMENSIONAL SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING TH...

SEMICONDUCTOR DEVICE

HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE