Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections

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H01L23/52

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit and manufacturing method of the same
- Patent number 12,170,277
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kam-Tou Sio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uniform layouts for SRAM and register file bit cells
- Patent number 12,171,090
- Issue date Dec 17, 2024
- Intel Corporation
- Zheng Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective passivation and selective deposition
- Patent number 12,170,197
- Issue date Dec 17, 2024
- ASM IP Holding B.V.
- Eva E. Tois
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with contact structure
- Patent number 12,170,246
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating redistribution circuit structure
- Patent number 12,170,223
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-throughput additively manufactured power delivery vias and traces
- Patent number 12,170,244
- Issue date Dec 17, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact features and methods of fabricating the same in Fin field-e...
- Patent number 12,170,245
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 12,170,247
- Issue date Dec 17, 2024
- Kioxia Corporation
- Tadayoshi Watanabe
- G11 - INFORMATION STORAGE
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 12,170,253
- Issue date Dec 17, 2024
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layout of static random access memory periphery circuit
- Patent number 12,171,092
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yangsyu Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
NAND string utilizing floating body memory cell
- Patent number 12,171,093
- Issue date Dec 17, 2024
- Zeno Semiconductor, Inc.
- Benjamin S. Louie
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated high voltage electronic device with high relative permit...
- Patent number 12,170,164
- Issue date Dec 17, 2024
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene BEOL integration interconnection structures
- Patent number 12,170,248
- Issue date Dec 17, 2024
- DESTINATION 2D
- Klaus Schuegraf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphics processing unit and high bandwidth memory integration usin...
- Patent number 12,170,275
- Issue date Dec 17, 2024
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and electronic systems including the same
- Patent number 12,171,097
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Kangmin Kim
- G11 - INFORMATION STORAGE
Information Patent Grant
Embedded metal insulator metal structure
- Patent number 12,170,241
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Feng-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded metal lines
- Patent number 12,170,268
- Issue date Dec 17, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Stephen Morein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assemblies with direct chip attach to circuit bo...
- Patent number 12,170,273
- Issue date Dec 17, 2024
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and method of manufacturing the same
- Patent number 12,165,966
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Che Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with backside power rail and method for formin...
- Patent number 12,165,973
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Chung Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Frame reveals with maskless lithography in the manufacture of integ...
- Patent number 12,165,987
- Issue date Dec 10, 2024
- Intel Corporation
- Grant Kloster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer film device and method
- Patent number 12,166,128
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device including multiple decks of memory cells and pillars...
- Patent number 12,167,599
- Issue date Dec 10, 2024
- Darwin A. Clampitt
- G11 - INFORMATION STORAGE
Information Patent Grant
Efuse with fuse walls and method of manufacturing the same
- Patent number 12,165,865
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Sheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device and semiconductor device
- Patent number 12,165,913
- Issue date Dec 10, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Suli Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air spacer surrounding conductive features and method forming same
- Patent number 12,165,914
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,165,920
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hwei-Jay Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-stacking carrier structure and method for fabricating the same
- Patent number 12,165,968
- Issue date Dec 10, 2024
- NANYA TECHNOLOGY CORPORATION
- Wei-Zhong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package having different metal densities in different regions and m...
- Patent number 12,165,971
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,166,010
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Eunseok Song
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240421207
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Jiho YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING A BACKSIDE POWER DISTRIBUTION...
- Publication number 20240421154
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Jongjin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)
- Publication number 20240421064
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL STRUCTURE AND METHODS THEREOF
- Publication number 20240421065
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Yueh CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20240421071
- Publication date Dec 19, 2024
- KIOXIA Corporation
- Ha HOANG
- G11 - INFORMATION STORAGE
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240421086
- Publication date Dec 19, 2024
- Advanced Semiconductor Engineering, Inc.
- Pao-Nan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR BACKSIDE SIGNAL AND POWER
- Publication number 20240421087
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES AND RELATED METHODS
- Publication number 20240422967
- Publication date Dec 19, 2024
- Lodestar Licensing Group LLC
- Kunal R. Parekh
- G11 - INFORMATION STORAGE
Information Patent Application
METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)
- Publication number 20240421067
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Baozhen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
- Publication number 20240421070
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Sunjung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240421072
- Publication date Dec 19, 2024
- SK HYNIX INC.
- Nam Jae LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM RESISTOR, THERMISTOR AND METHOD OF PRODUCING THE SAME
- Publication number 20240421074
- Publication date Dec 19, 2024
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Qiying WONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH BANDWIDTH MEMORY STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240421080
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240421095
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Singulation Assisted Structures and Methods for Improving Bond...
- Publication number 20240421126
- Publication date Dec 19, 2024
- Apple Inc.
- Chi Nung Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240420961
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Seunghoon CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES INCLUDING SEPARATION...
- Publication number 20240420999
- Publication date Dec 19, 2024
- SK HYNIX INC.
- Myung Ok KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS INCLUDING TSV STRUCTURE
- Publication number 20240421040
- Publication date Dec 19, 2024
- Micron Technology, Inc.
- SEIJI NARUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE FOR ENHANCED COOLING
- Publication number 20240421027
- Publication date Dec 19, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STITCHING FOR STACKING ARCHITECTURE IN SEMICONDUCTOR PACKAGES
- Publication number 20240421077
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF MIDDLE-OF-LINE RESISTANCE AND CAPACITANCE
- Publication number 20240421078
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT LEVELS WITH MULTIPLE LINE TYPES
- Publication number 20240421079
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE COMPUTING DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240421141
- Publication date Dec 19, 2024
- AP MEMORY TECHNOLOGY CORPORATION
- WEN-LIANG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK END DIELECTRIC-BASED MEMORY STRUCTURE IN A SEMICONDUCTOR DEVICE
- Publication number 20240421036
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Feng Kao
- G11 - INFORMATION STORAGE
Information Patent Application
STACKED DEVICES WITH BACKSIDE CONTACTS
- Publication number 20240421038
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240422966
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Yanghee Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240421166
- Publication date Dec 19, 2024
- RENESAS ELECTRONICS CORPORATION
- Makoto KOSHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20240421066
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Liang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING CAPACITOR STRUCTURES AND SEMICONDUCTOR...
- Publication number 20240421068
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Myoungsoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240421075
- Publication date Dec 19, 2024
- LAPIS Semiconductor Co., Ltd.
- Reiji YANO
- H01 - BASIC ELECTRIC ELEMENTS

Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated circuit and manufacturing method of the same

Uniform layouts for SRAM and register file bit cells

Selective passivation and selective deposition

Semiconductor device with contact structure

Method of fabricating redistribution circuit structure

High-throughput additively manufactured power delivery vias and traces

Contact features and methods of fabricating the same in Fin field-e...

Semiconductor memory device

Metal-free frame design for silicon bridges for semiconductor packages

Layout of static random access memory periphery circuit

NAND string utilizing floating body memory cell

Integrated high voltage electronic device with high relative permit...

Graphene BEOL integration interconnection structures

Graphics processing unit and high bandwidth memory integration usin...

Semiconductor devices and electronic systems including the same

Embedded metal insulator metal structure

Embedded metal lines

Integrated circuit assemblies with direct chip attach to circuit bo...

Package and method of manufacturing the same

Semiconductor device with backside power rail and method for formin...

Frame reveals with maskless lithography in the manufacture of integ...

Multi-layer film device and method

Memory device including multiple decks of memory cells and pillars...

Efuse with fuse walls and method of manufacturing the same

Method for manufacturing semiconductor device and semiconductor device

Air spacer surrounding conductive features and method forming same

Semiconductor structure and method for forming the same

Multi-stacking carrier structure and method for fabricating the same

Package having different metal densities in different regions and m...

Semiconductor package and method of manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT DEVICES INCLUDING A BACKSIDE POWER DISTRIBUTION...

METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)

METAL-INSULATOR-METAL STRUCTURE AND METHODS THEREOF

SEMICONDUCTOR MEMORY DEVICE

ELECTRONIC DEVICE

STRUCTURE FOR BACKSIDE SIGNAL AND POWER

MEMORY DEVICES AND RELATED METHODS

METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

THIN FILM RESISTOR, THERMISTOR AND METHOD OF PRODUCING THE SAME

HIGH BANDWIDTH MEMORY STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Chip Singulation Assisted Structures and Methods for Improving Bond...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES INCLUDING SEPARATION...

APPARATUS INCLUDING TSV STRUCTURE

SEMICONDUCTOR PACKAGE STRUCTURE FOR ENHANCED COOLING

DIE STITCHING FOR STACKING ARCHITECTURE IN SEMICONDUCTOR PACKAGES

REDUCTION OF MIDDLE-OF-LINE RESISTANCE AND CAPACITANCE

INTERCONNECT LEVELS WITH MULTIPLE LINE TYPES

HIGH PERFORMANCE COMPUTING DEVICE AND METHOD OF MANUFACTURING THE SAME

BACK END DIELECTRIC-BASED MEMORY STRUCTURE IN A SEMICONDUCTOR DEVICE

STACKED DEVICES WITH BACKSIDE CONTACTS

INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METAL-INSULATOR-METAL STRUCTURES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICES HAVING CAPACITOR STRUCTURES AND SEMICONDUCTOR...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE