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Arrangements for connecting external electrical signals to mechanical structures inside the package

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  • CPC
  • B81B2207/091
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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B2207/00Micro-structural systems or auxiliary parts thereof

Current Industry

B81B2207/091Arrangements for connecting external electrical signals to mechanical structures inside the package
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    ENVIRONMENTAL SYSTEM-IN-PACKAGE FOR HARSH ENVIRONMENTS
    • Publication number 20230235664
    • Publication date Jul 27, 2023
    • SCHLUMBERGER TECHNOLOGY CORPORATION
    • Remi Robutel
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    MEMS Spacer Assembly
    • Publication number 20230192474
    • Publication date Jun 22, 2023
    • MEMS DRIVE (NANJING) CO., LTD.
    • Matthew Ng
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    MICROELECTRONICS H-FRAME DEVICE
    • Publication number 20220289559
    • Publication date Sep 15, 2022
    • Northrop Grumman Systems Corporation
    • Dah-Weih Duan
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    MEMS-Sensor
    • Publication number 20210323813
    • Publication date Oct 21, 2021
    • INFINEON TECHNOLOGIES AG
    • Gunar Lorenz
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    MEMS-Sensor
    • Publication number 20190270639
    • Publication date Sep 5, 2019
    • INFINEON TECHNOLOGIES AG
    • Gunar Lorenz
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    PRESSURE SENSOR STRUCTURE CONFIGURED FOR WAFER-LEVEL CALIBRATION
    • Publication number 20190194014
    • Publication date Jun 27, 2019
    • CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
    • Wlodzimierz Czarnocki
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    FLUID EJECTION DEVICE
    • Publication number 20180194614
    • Publication date Jul 12, 2018
    • STMicroelectronics Asia Pacific Pte. Ltd.
    • Teck Khim Neo
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    PACKAGE FOR MEMS DEVICE AND PROCESS
    • Publication number 20180127265
    • Publication date May 10, 2018
    • Cirrus Logic International Semiconductor Ltd.
    • Roberto BRIOSCHI
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    FLUID EJECTION DEVICE
    • Publication number 20180050901
    • Publication date Feb 22, 2018
    • STMicroelectronics Asia Pacific Pte. Ltd.
    • Teck Khim Neo
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    MICROELECTROMECHANICAL SYSTEMS SENSOR CONTROL INTERFACE
    • Publication number 20150362362
    • Publication date Dec 17, 2015
    • InvenSense, Inc.
    • Yang Pan
    • B81 - MICRO-STRUCTURAL TECHNOLOGY