TREA

Micro-structural systems or auxiliary parts thereof

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Industry

  • CPC
  • B81B2207/00
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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS

Current Industry

B81B2207/00Micro-structural systems or auxiliary parts thereof

Sub Industries

B81B2207/01comprising a micromechanical device connected to control or processing electronics B81B2207/012the micromechanical device and the control or processing electronics being separate parts in the same package B81B2207/015the micromechanical device and the control or processing electronics being integrated on the same substrate B81B2207/017Smart-MEMS not provided for in B81B2207/012 - B81B2207/015 B81B2207/03Electronic circuits for micro-mechanical devices which are not application specific B81B2207/05Arrays B81B2207/053of movable structures B81B2207/056of static structures B81B2207/07Interconnects B81B2207/09Packages B81B2207/091Arrangements for connecting external electrical signals to mechanical structures inside the package B81B2207/092Buried interconnects in the substrate or in the lid B81B2207/093Conductive package seal B81B2207/094Feed-through, via B81B2207/095through the lid B81B2207/096through the substrate B81B2207/097Interconnects arranged on the substrate or the lid, and covered by the package seal B81B2207/098Arrangements not provided for in groups B81B2207/092 - B81B2207/097 B81B2207/11Structural features, others than packages, for protecting a device against environmental influences B81B2207/115Protective layers applied directly to the device before packaging B81B2207/99Micro-structural systems or auxiliary parts thereof not provided for in B81B2207/01 - B81B2207/115
Industries