Arrangements not provided for in groups B81B2207/092 - B81B2207/097

Industry

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B81B2207/098

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B2207/00Micro-structural systems or auxiliary parts thereof

Current Industry

B81B2207/098Arrangements not provided for in groups B81B2207/092 - B81B2207/097

Industries

Patents Grantslast 30 patents

Information Patent Grant
Microelectronics package with vertically stacked MEMS device and co...
- Patent number 12,129,168
- Issue date Oct 29, 2024
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor and package assembly thereof
- Patent number 12,091,312
- Issue date Sep 17, 2024
- Robert Bosch GmbH
- Ken Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing a sensor device and moulding support structure
- Patent number 12,024,418
- Issue date Jul 2, 2024
- Melexis Technologies NV
- Appolonius Jacobus Van Der Wiel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS package with shock and vibration protection
- Patent number 11,975,961
- Issue date May 7, 2024
- BEIJING VOYAGER TECHNOLOGY CO., LTD.
- Youmin Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 11,973,048
- Issue date Apr 30, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Nong Wen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Ovenized MEMS
- Patent number 11,909,354
- Issue date Feb 20, 2024
- SiTime Corporation
- Carl Arft
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical sensor device having an ASIC chip integrated into a...
- Patent number 11,906,383
- Issue date Feb 20, 2024
- Robert Bosch GmbH
- Stefan Pinter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package with built-in vibration isolation, thermal st...
- Patent number 11,834,328
- Issue date Dec 5, 2023
- Invensense, Inc.
- Hamid Eslampour
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated ultrasonic transducers
- Patent number 11,730,451
- Issue date Aug 22, 2023
- EXO IMAGING, INC.
- Janusz Bryzek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing a sensor device and moulding support structure
- Patent number 11,655,142
- Issue date May 23, 2023
- Melexis Technologies NV
- Appolonius Jacobus Van Der Wiel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged die and assembling method
- Patent number 11,597,647
- Issue date Mar 7, 2023
- TDK Corporation
- Andreas Barbul
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reducing delamination in sensor package
- Patent number 11,584,638
- Issue date Feb 21, 2023
- Invensense, Inc.
- Efren Lacap
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package structures and methods of manufacturing the same
- Patent number 11,565,934
- Issue date Jan 31, 2023
- Advanced Semiconductor Engineering, Inc.
- Yu-Hsuan Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,535,509
- Issue date Dec 27, 2022
- Advanced Semiconductor Engineering, Inc.
- Wei-Wei Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of making ohmic contact on low doped bulk silicon for optica...
- Patent number 11,530,130
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device packages and methods of manufacturing the same
- Patent number 11,524,890
- Issue date Dec 13, 2022
- Advanced Semiconductor Engineering, Inc.
- Yung-Hsing Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of making ohmic contact on low doped bulk silicon for optica...
- Patent number 11,485,631
- Issue date Nov 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,427,466
- Issue date Aug 30, 2022
- Advanced Semiconductor Engineering, Inc.
- Wei-Wei Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonding pad layer system, gas sensor and method for manufacturing a...
- Patent number 11,407,635
- Issue date Aug 9, 2022
- Robert Bosch GmbH
- Andreas Scheurle
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sound producing package structure and method for packaging sound pr...
- Patent number 11,395,073
- Issue date Jul 19, 2022
- xMEMS Labs, Inc.
- Hai-Hung Wen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method of forming microelectromechanical s...
- Patent number 11,370,655
- Issue date Jun 28, 2022
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Ovenized MEMS
- Patent number 11,374,535
- Issue date Jun 28, 2022
- SiTime Corporation
- Carl Arft
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Optical scanner module and method for fabricating optical scanner m...
- Patent number 11,365,116
- Issue date Jun 21, 2022
- Mitsumi Electric Co., Ltd.
- Tsukasa Yamada
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bottom package exposed die MEMS pressure sensor integrated circuit...
- Patent number 11,355,423
- Issue date Jun 7, 2022
- STMicroelectronics, Inc.
- Aaron Cadag
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor systems and methods for providing sensor systems
- Patent number 11,289,444
- Issue date Mar 29, 2022
- General Electric Company
- David Richard Esler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical device and method for manufacturing a micromechanic...
- Patent number 11,261,082
- Issue date Mar 1, 2022
- Robert Bosch GmbH
- Eckhard Graf
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electric component with sensitive component structures and method f...
- Patent number 11,245,977
- Issue date Feb 8, 2022
- Snaptrack, Inc.
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 11,171,108
- Issue date Nov 9, 2021
- An-Nong Wen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS devices including MEMS dies and connectors thereto
- Patent number 11,117,796
- Issue date Sep 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Through-substrate conductor support
- Patent number 11,084,717
- Issue date Aug 10, 2021
- Texas Instruments Incorporated
- Virgil Cotoco Ararao
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SENSOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240109768
- Publication date Apr 4, 2024
- Advanced Semiconductor Engineering, Inc.
- Chieh-An YEH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Element and Vibration-Driven Energy Harvesting Device
- Publication number 20240083740
- Publication date Mar 14, 2024
- Saginomiya Seisakusho, Inc.
- Hisayuki Ashizawa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED ULTRASONIC TRANSDUCERS
- Publication number 20230389897
- Publication date Dec 7, 2023
- Exo Imaging, Inc.
- Janusz Bryzek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FLIP CHIP MICROMIRROR TECHNOLOGY
- Publication number 20230375822
- Publication date Nov 23, 2023
- Microsoft Technology Licensing, LLC
- Xiao Chuan ONG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING A SENSOR DEVICE AND MOULDING SUPPORT STRUCTURE
- Publication number 20230249962
- Publication date Aug 10, 2023
- MELEXIS TECHNOLOGIES NV
- Appolonius Jacobus VAN DER WIEL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH WARPAGE CONTROL USING CAVITY FORMED...
- Publication number 20230046645
- Publication date Feb 16, 2023
- STMicroelectronics (Malta) Ltd.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE WITH METAL COLUMN MOLD BARRIER
- Publication number 20220396474
- Publication date Dec 15, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares Guevara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE MOUNTED ON A SYSTEM BOARD
- Publication number 20220373783
- Publication date Nov 24, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Paul Lawrence Rancuret
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OVENIZED MEMS
- Publication number 20220360218
- Publication date Nov 10, 2022
- SiTime Corporation
- Carl Arft
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSING DEVICE AND METHOD FOR MANUFACTURING SENSING DEVICE
- Publication number 20220315413
- Publication date Oct 6, 2022
- MITSUMI ELECTRIC CO., LTD.
- Etsuji HAYAKAWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device and Method of Forming Microelectromechanical S...
- Publication number 20220289560
- Publication date Sep 15, 2022
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT...
- Publication number 20220285249
- Publication date Sep 8, 2022
- STMICROELECTRONICS, INC.
- Aaron Cadag
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220068868
- Publication date Mar 3, 2022
- Advanced Semiconductor Engineering, Inc.
- An-Nong WEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
REDUCING DELAMINATION IN SENSOR PACKAGE.
- Publication number 20220033252
- Publication date Feb 3, 2022
- Efren Lacap
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS PACKAGE WITH SHOCK AND VIBRATION PROTECTION
- Publication number 20220033253
- Publication date Feb 3, 2022
- Youmin Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Sensor and Package Assembly Thereof
- Publication number 20220009766
- Publication date Jan 13, 2022
- ROBERT BOSCH GmbH
- Ken Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Package With Built-In Vibration Isolation, Thermal St...
- Publication number 20210403318
- Publication date Dec 30, 2021
- InvenSense, Inc.
- Hamid Eslampour
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL SENSOR DEVICE AND CORRESPONDING MANUFACTURING METHOD
- Publication number 20210348976
- Publication date Nov 11, 2021
- ROBERT BOSCH GmbH
- Stefan Pinter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SOUND PRODUCING PACKAGE STRUCTURE AND METHOD FOR PACKAGING SOUND PR...
- Publication number 20210329386
- Publication date Oct 21, 2021
- xMEMS Labs, Inc.
- Hai-Hung Wen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THROUGH-SUBSTRATE CONDUCTOR SUPPORT
- Publication number 20210323816
- Publication date Oct 21, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Virgil Cotoco Ararao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210246015
- Publication date Aug 12, 2021
- Advanced Semiconductor Engineering, Inc.
- Chieh-An YEH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SELF-CONFIGURING CONTACT ARRAYS FOR INTERFACING WITH ELECTRIC CIRCU...
- Publication number 20210233840
- Publication date Jul 29, 2021
- UNIVERSITY OF LOUISVILLE RESEARCH FOUNDATION, INC.
- Cindy HARNETT
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20210206628
- Publication date Jul 8, 2021
- Advanced Semiconductor Engineering, Inc.
- Yu-Hsuan TSAI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTRONICS PACKAGE WITH VERTICALLY STACKED MEMS DEVICE AND CO...
- Publication number 20210188624
- Publication date Jun 24, 2021
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR SYSTEMS AND METHODS FOR PROVIDING SENSOR SYSTEMS
- Publication number 20210183808
- Publication date Jun 17, 2021
- GENERAL ELECTRIC COMPANY
- David Richard Esler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210147219
- Publication date May 20, 2021
- Advanced Semiconductor Engineering, Inc.
- Wei-Wei LIU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED ULTRASONIC TRANSDUCERS
- Publication number 20210137497
- Publication date May 13, 2021
- eXo Imaging, Inc.
- Janusz Bryzek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20210130165
- Publication date May 6, 2021
- Advanced Semiconductor Engineering, Inc.
- Yung-Hsing CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20210130163
- Publication date May 6, 2021
- Advanced Semiconductor Engineering, Inc.
- Yueh-Ju LIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MAKING OHMIC CONTACT ON LOW DOPED BULK SILICON FOR OPTICA...
- Publication number 20210070611
- Publication date Mar 11, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Arrangements not provided for in groups B81B2207/092 - B81B2207/097

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Microelectronics package with vertically stacked MEMS device and co...

Sensor and package assembly thereof

Method of manufacturing a sensor device and moulding support structure

MEMS package with shock and vibration protection

Semiconductor package and method for manufacturing the same

Ovenized MEMS

Micromechanical sensor device having an ASIC chip integrated into a...

Semiconductor package with built-in vibration isolation, thermal st...

Integrated ultrasonic transducers

Method of manufacturing a sensor device and moulding support structure

Packaged die and assembling method

Reducing delamination in sensor package

Semiconductor package structures and methods of manufacturing the same

Semiconductor package structure and method for manufacturing the same

Method of making ohmic contact on low doped bulk silicon for optica...

Semiconductor device packages and methods of manufacturing the same

Method of making ohmic contact on low doped bulk silicon for optica...

Semiconductor package structure and method for manufacturing the same

Bonding pad layer system, gas sensor and method for manufacturing a...

Sound producing package structure and method for packaging sound pr...

Semiconductor device and method of forming microelectromechanical s...

Ovenized MEMS

Optical scanner module and method for fabricating optical scanner m...

Bottom package exposed die MEMS pressure sensor integrated circuit...

Sensor systems and methods for providing sensor systems

Micromechanical device and method for manufacturing a micromechanic...

Electric component with sensitive component structures and method f...

Semiconductor package and method for manufacturing the same

MEMS devices including MEMS dies and connectors thereto

Through-substrate conductor support

Patents Applicationslast 30 patents

SENSOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

MEMS Element and Vibration-Driven Energy Harvesting Device

INTEGRATED ULTRASONIC TRANSDUCERS

FLIP CHIP MICROMIRROR TECHNOLOGY

METHOD OF MANUFACTURING A SENSOR DEVICE AND MOULDING SUPPORT STRUCTURE

INTEGRATED CIRCUIT PACKAGE WITH WARPAGE CONTROL USING CAVITY FORMED...

SEMICONDUCTOR PACKAGE WITH METAL COLUMN MOLD BARRIER

SEMICONDUCTOR DEVICE MOUNTED ON A SYSTEM BOARD

OVENIZED MEMS

SENSING DEVICE AND METHOD FOR MANUFACTURING SENSING DEVICE

Semiconductor Device and Method of Forming Microelectromechanical S...

BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

REDUCING DELAMINATION IN SENSOR PACKAGE.

MEMS PACKAGE WITH SHOCK AND VIBRATION PROTECTION

Sensor and Package Assembly Thereof

Semiconductor Package With Built-In Vibration Isolation, Thermal St...

MICROMECHANICAL SENSOR DEVICE AND CORRESPONDING MANUFACTURING METHOD

SOUND PRODUCING PACKAGE STRUCTURE AND METHOD FOR PACKAGING SOUND PR...

THROUGH-SUBSTRATE CONDUCTOR SUPPORT

SENSOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SELF-CONFIGURING CONTACT ARRAYS FOR INTERFACING WITH ELECTRIC CIRCU...

SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF MANUFACTURING THE SAME

MICROELECTRONICS PACKAGE WITH VERTICALLY STACKED MEMS DEVICE AND CO...

SENSOR SYSTEMS AND METHODS FOR PROVIDING SENSOR SYSTEMS

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

INTEGRATED ULTRASONIC TRANSDUCERS

SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME

METHOD OF MAKING OHMIC CONTACT ON LOW DOPED BULK SILICON FOR OPTICA...