Arrangements of planar printed circuit boards in the same plane

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H05K1/142

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

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H05K1/142Arrangements of planar printed circuit boards in the same plane

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Display module, display apparatus, and method of manufacturing the...
- Patent number 12,278,225
- Issue date Apr 15, 2025
- Samsung Electronics Co., Ltd.
- Jongsu Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of driving the same
- Patent number 12,266,292
- Issue date Apr 1, 2025
- Samsung Display Co., Ltd.
- Won Jin Seo
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Dual-sided expansion card with offset slot alignment
- Patent number 12,262,471
- Issue date Mar 25, 2025
- Liqid Inc.
- Andrew Rudolph Heyd
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with bridge chiplets
- Patent number 12,238,872
- Issue date Feb 25, 2025
- Advanced Micro Devices, Inc.
- Robert N. McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including high-frequency transmission circuit
- Patent number 12,218,410
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Han-Min Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular capacitor subassembly for backup power
- Patent number 12,207,409
- Issue date Jan 21, 2025
- Intel Corporation
- John Hung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display module and display apparatus
- Patent number 12,185,465
- Issue date Dec 31, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Guangran Guo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3D chip package based on vertical-through-via connector
- Patent number 12,176,278
- Issue date Dec 24, 2024
- iCometrue Company Ltd.
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board unit, detachable unit, and image forming apparatus
- Patent number 12,167,537
- Issue date Dec 10, 2024
- Ricoh Company, Ltd.
- Yuki Oshikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring circuit board, producing method thereof, and wiring circuit...
- Patent number 12,167,544
- Issue date Dec 10, 2024
- Nitto Denko Corporation
- Ryosuke Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Medical apparatus with galvanic isolator
- Patent number 12,114,957
- Issue date Oct 15, 2024
- Richard Wolf GmbH
- Bernd Neurohr
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Composite circuit board and method of manufacturing the same
- Patent number 12,114,436
- Issue date Oct 8, 2024
- SHENNAN CIRCUITS CO., LTD.
- Zhicheng Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with embedded bridge
- Patent number 12,108,532
- Issue date Oct 1, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Moon Seok Heo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board, circuit board assembly and electronic device
- Patent number 12,096,559
- Issue date Sep 17, 2024
- BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
- Ning Hao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module having an elevated power plane with an integrated sign...
- Patent number 12,087,680
- Issue date Sep 10, 2024
- Wolfspeed, Inc.
- Zach Cole
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and display device
- Patent number 12,089,334
- Issue date Sep 10, 2024
- TCL China Star Optoelectronics Technology Co., Ltd.
- Jinfeng Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 12,089,349
- Issue date Sep 10, 2024
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device
- Patent number 12,086,350
- Issue date Sep 10, 2024
- Samsung Display Co., Ltd.
- Hyun-Wook Cho
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Powertrain system with wireless communication nodes and integrated...
- Patent number 12,027,676
- Issue date Jul 2, 2024
- GM Global Technology Operations LLC
- Fiona E. Meyer-Teruel
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Interconnectable circuit boards adapted for three-dimensional const...
- Patent number 12,016,121
- Issue date Jun 18, 2024
- Metrospec Technology, LLC
- Henry V. Holec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Header and package with integrated cooler for electronic components
- Patent number 12,009,634
- Issue date Jun 11, 2024
- Schott AG
- Andreas Krause
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density organic bridge device and method
- Patent number 12,002,762
- Issue date Jun 4, 2024
- Intel Corporation
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interfaces for coupling a memory module to a circuit board, and ass...
- Patent number 12,004,314
- Issue date Jun 4, 2024
- Micron Technology, Inc.
- Anthony D. Veches
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device comprising array antenna
- Patent number 11,929,546
- Issue date Mar 12, 2024
- Samsung Electronics Co., Ltd.
- Jaehyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device coupled to circuit board with coupling film
- Patent number 11,924,969
- Issue date Mar 5, 2024
- Samsung Display Co., Ltd.
- Kyung-hwa Lim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Display device and method for manufacturing the same
- Patent number 11,894,627
- Issue date Feb 6, 2024
- Samsung Display Co., Ltd.
- Myonghoon Roh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manufacturing method of package structure
- Patent number 11,895,780
- Issue date Feb 6, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless board-to-board interconnect for high-rate wireless data tr...
- Patent number 11,870,507
- Issue date Jan 9, 2024
- Samsung Electronics Co., Ltd.
- Anton Sergeevich Lukyanov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including interposer
- Patent number 11,856,696
- Issue date Dec 26, 2023
- Samsung Electronics Co., Ltd.
- Sangwon Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,825,591
- Issue date Nov 21, 2023
- Fuji Electric Co., Ltd.
- Yushi Sato
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER METHOD FOR HIGHER CURRENT ASIC POWER DELIVERY
- Publication number 20250151198
- Publication date May 8, 2025
- Cisco Technology, Inc.
- Joel Richard Goergen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
3D CHIP PACKAGE BASED ON VERTICAL-THROUGH-VIA CONNECTOR
- Publication number 20250125241
- Publication date Apr 17, 2025
- iCometrue Company Ltd.
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFORMATION PROCESSING APPARATUS
- Publication number 20250098069
- Publication date Mar 20, 2025
- Toshiba Tec Kabushiki Kaisha
- Takahiro OGISU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY APPARATUS
- Publication number 20250093702
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Ajeong KANG
- F21 - LIGHTING
Information Patent Application
FLEXIBLE WIRING BOARD UNIT AND LIGHT CONTROL UNIT
- Publication number 20250087918
- Publication date Mar 13, 2025
- TOPPAN Holdings Inc.
- Masaki TSUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE PRINTED CIRCUIT BOARD EMBEDDED WITHIN ANOTHER PRINTED CIRCUI...
- Publication number 20250081348
- Publication date Mar 6, 2025
- Intel Corporation
- Arumanayagam RAJASEKAR
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD HAVING AN EDGE CONTAINING CONDUCTIVE REGIONS
- Publication number 20250063664
- Publication date Feb 20, 2025
- Teradyne, Inc.
- Daniel L. Engel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250062272
- Publication date Feb 20, 2025
- Fuji Electric Co., Ltd.
- Tsubasa WATAKABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250048553
- Publication date Feb 6, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Tae Hong MIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECTABLE CIRCUIT BOARDS ADAPTED FOR THREE-DIMENSIONAL CONST...
- Publication number 20250008653
- Publication date Jan 2, 2025
- METROSPEC TECHNOLOGY, LLC
- Henry V. Holec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Display Panel and Display Device
- Publication number 20250008657
- Publication date Jan 2, 2025
- Mianyang HKC Optoelectronics Technology Co., Ltd.
- Rong TANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ALUMINUM FLEXIBLE PRINTED CIRCUIT BOARD ASSEMBLY AND PREPARATION ME...
- Publication number 20240422910
- Publication date Dec 19, 2024
- Taicang Manaflex Technology Co., Ltd.
- Robert C. LANE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING BRIDGE PRINTED CIRCUIT BOARD
- Publication number 20240422954
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Bongkyu MIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICALLY COUPLING PRINTED CIRCUIT BOARDS USING A SNAP-FIT CONNE...
- Publication number 20240397624
- Publication date Nov 28, 2024
- Western Digital Technologies, Inc.
- Tew Wei Hong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240389232
- Publication date Nov 21, 2024
- Unimicron Technology Corp.
- Chun Hung KUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NETWORK DEVICE WITH ELEVATED TEMPERATURE SENSOR
- Publication number 20240389233
- Publication date Nov 21, 2024
- Arista Networks, Inc.
- Eric Jau Heng Tse
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD
- Publication number 20240321762
- Publication date Sep 26, 2024
- Intel Corporation
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERFACES FOR COUPLING A MEMORY MODULE TO A CIRCUIT BOARD, AND ASS...
- Publication number 20240306331
- Publication date Sep 12, 2024
- Micron Technology, Inc.
- Anthony D. Veches
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND DISPLAY DEVICE
- Publication number 20240284596
- Publication date Aug 22, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Liang GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD MODULE AND ELECTRONIC APPARATUS COMPRISING SAME
- Publication number 20240244748
- Publication date Jul 18, 2024
- Samsung Electronics Co., Ltd.
- Jinhwan JEON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240237214
- Publication date Jul 11, 2024
- CARUX TECHNOLOGY PTE. LTD.
- You-Ren LIOU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE AND METHOD OF DRIVING THE SAME
- Publication number 20240233616
- Publication date Jul 11, 2024
- SAMSUNG DISPLAY CO., LTD.
- Won Jin SEO
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240206068
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Yang LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Display Apparatus
- Publication number 20240196536
- Publication date Jun 13, 2024
- Minwoo Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY MODULE AND DISPLAY APPARATUS
- Publication number 20240172363
- Publication date May 23, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Guangran Guo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE AND METHOD OF DRIVING THE SAME
- Publication number 20240135863
- Publication date Apr 25, 2024
- SAMSUNG DISPLAY CO., LTD.
- Won Jin SEO
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
DUAL-SIDED EXPANSION CARD WITH OFFSET SLOT ALIGNMENT
- Publication number 20240107671
- Publication date Mar 28, 2024
- Liqid Inc.
- Andrew Rudolph Heyd
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RF CONNECTOR AND COMMUNICATION APPARATUS INCLUDING SAME
- Publication number 20240098885
- Publication date Mar 21, 2024
- KMW Inc.
- Bae Mook JEONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240074068
- Publication date Feb 29, 2024
- InnoLux Corporation
- Yuan-Cheng LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE
- Publication number 20240032188
- Publication date Jan 25, 2024
- Samsung Electronics Co.,Ltd.
- Sun Jun KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Arrangements of planar printed circuit boards in the same plane

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display module, display apparatus, and method of manufacturing the...

Display device and method of driving the same

Dual-sided expansion card with offset slot alignment

Circuit board with bridge chiplets

Electronic device including high-frequency transmission circuit

Modular capacitor subassembly for backup power

Display module and display apparatus

3D chip package based on vertical-through-via connector

Circuit board unit, detachable unit, and image forming apparatus

Wiring circuit board, producing method thereof, and wiring circuit...

Medical apparatus with galvanic isolator

Composite circuit board and method of manufacturing the same

Printed circuit board with embedded bridge

Circuit board, circuit board assembly and electronic device

Power module having an elevated power plane with an integrated sign...

Display panel and display device

Semiconductor device package and method of manufacturing the same

Display device

Powertrain system with wireless communication nodes and integrated...

Interconnectable circuit boards adapted for three-dimensional const...

Header and package with integrated cooler for electronic components

High density organic bridge device and method

Interfaces for coupling a memory module to a circuit board, and ass...

Electronic device comprising array antenna

Display device coupled to circuit board with coupling film

Display device and method for manufacturing the same

Manufacturing method of package structure

Wireless board-to-board interconnect for high-rate wireless data tr...

Electronic device including interposer

Semiconductor module

Patents Applicationslast 30 patents

POWER METHOD FOR HIGHER CURRENT ASIC POWER DELIVERY

3D CHIP PACKAGE BASED ON VERTICAL-THROUGH-VIA CONNECTOR

INFORMATION PROCESSING APPARATUS

DISPLAY APPARATUS

FLEXIBLE WIRING BOARD UNIT AND LIGHT CONTROL UNIT

BRIDGE PRINTED CIRCUIT BOARD EMBEDDED WITHIN ANOTHER PRINTED CIRCUI...

CIRCUIT BOARD HAVING AN EDGE CONTAINING CONDUCTIVE REGIONS

SEMICONDUCTOR MODULE

PRINTED CIRCUIT BOARD

INTERCONNECTABLE CIRCUIT BOARDS ADAPTED FOR THREE-DIMENSIONAL CONST...

Display Panel and Display Device

ALUMINUM FLEXIBLE PRINTED CIRCUIT BOARD ASSEMBLY AND PREPARATION ME...

ELECTRONIC DEVICE INCLUDING BRIDGE PRINTED CIRCUIT BOARD

ELECTRICALLY COUPLING PRINTED CIRCUIT BOARDS USING A SNAP-FIT CONNE...

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

NETWORK DEVICE WITH ELEVATED TEMPERATURE SENSOR

HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD

INTERFACES FOR COUPLING A MEMORY MODULE TO A CIRCUIT BOARD, AND ASS...

CIRCUIT BOARD STRUCTURE AND DISPLAY DEVICE

PRINTED CIRCUIT BOARD MODULE AND ELECTRONIC APPARATUS COMPRISING SAME

ELECTRONIC DEVICE

DISPLAY DEVICE AND METHOD OF DRIVING THE SAME

PRINTED CIRCUIT BOARD

Display Apparatus

DISPLAY MODULE AND DISPLAY APPARATUS

DISPLAY DEVICE AND METHOD OF DRIVING THE SAME

DUAL-SIDED EXPANSION CARD WITH OFFSET SLOT ALIGNMENT

RF CONNECTOR AND COMMUNICATION APPARATUS INCLUDING SAME

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

SUBSTRATE