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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/5286Arrangements of power or ground buses

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Patents Grantslast 30 patents

Information Patent Grant
System on chip (SOC) current profile model for integrated voltage r...
- Patent number 12,271,667
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Haohua Zhou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
3D stacked chip that shares power rails
- Patent number 12,272,647
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Byounghak Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods for forming the same
- Patent number 12,272,623
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having an anchor-shaped backside via
- Patent number 12,272,634
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices
- Patent number 12,272,596
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Junghyuck Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a backside power rail
- Patent number 12,272,648
- Issue date Apr 8, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,272,649
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hui Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device with backside spacer and methods of forming th...
- Patent number 12,266,606
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buried power rail formation for vertical field effect transistors
- Patent number 12,268,016
- Issue date Apr 1, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Parasitic capacitance reduction in GaN-on-silicon devices
- Patent number 12,266,523
- Issue date Apr 1, 2025
- MACOM Technology Solutions Holdings, Inc.
- Gabriel R. Cueva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid cell-based device, layout, and method
- Patent number 12,266,657
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Xuan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing thereof
- Patent number 12,261,115
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kam-Tou Sio
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Backside signal routing
- Patent number 12,261,116
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit, system and method of forming same
- Patent number 12,255,238
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and method for forming thereof
- Patent number 12,256,529
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including backside contact structure having po...
- Patent number 12,255,248
- Issue date Mar 18, 2025
- Samsung Electronics Co., Ltd.
- Wonhyuk Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power distribution structure and method
- Patent number 12,255,148
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cell structure with intermediate metal layers for power supplies
- Patent number 12,255,142
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Chun Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 12,255,141
- Issue date Mar 18, 2025
- SOCIONEXT INC.
- Hideyuki Komuro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device using different types of through-silicon-vias
- Patent number 12,250,807
- Issue date Mar 11, 2025
- Samsung Electronics Co., Ltd.
- Jaesan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including penetration via structure
- Patent number 12,249,558
- Issue date Mar 11, 2025
- Samsung Electronics Co., Ltd.
- Jubin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive line structures and method of forming same
- Patent number 12,243,821
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hiranmay Biswas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power switch for backside power distribution
- Patent number 12,243,866
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jack Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power switch for backside power distribution
- Patent number 12,243,868
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jack Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of manufacturing integrated circuit
- Patent number 12,243,822
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Yu Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a buried metal line in a semiconductor substrate
- Patent number 12,237,207
- Issue date Feb 25, 2025
- Imec VZW
- Boon Teik Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit semiconductor device
- Patent number 12,237,268
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Jaechoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having fin structure
- Patent number 12,237,322
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shun-Li Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside power rail for physical failure analysis (PFA)
- Patent number 12,237,233
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power wall integration for multiple stacked devices
- Patent number 12,237,333
- Issue date Feb 25, 2025
- Tokyo Electron Limited
- Daniel Chanemougame
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20250113594
- Publication date Apr 3, 2025
- SOCIONEXT INC.
- Hideyuki KOMURO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250113513
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wing YEUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250112152
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNMENT ASSISTED ASSEMBLY ON A STRUCTURAL WAFER FOR HYBRID B...
- Publication number 20250112177
- Publication date Apr 3, 2025
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power, Signaling and Thermal Path Co-optimization
- Publication number 20250112154
- Publication date Apr 3, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIRTUAL GROUND NET FOR PROCESS-INDUCED DAMAGE PREVENTION
- Publication number 20250112153
- Publication date Apr 3, 2025
- Intel Corporation
- Inanc Meric
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING DECOUPLING CAPACITORS
- Publication number 20250105138
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Xuan Huang
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING BACKSIDE POWER DELIVERY
- Publication number 20250105151
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Jin Myoung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING STACKED TRANSISTORS WITH BACKS...
- Publication number 20250107061
- Publication date Mar 27, 2025
- Intel Corporation
- Patrick MORROW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming a Self-aligned Buried Power Rail in a Nanosheet-...
- Publication number 20250107199
- Publication date Mar 27, 2025
- IMEC vzw
- Boon Teik Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES WITH VIAS HAVING WIDENED ENDS FOR POWER...
- Publication number 20250105095
- Publication date Mar 27, 2025
- Intel Corporation
- Bozidar Marinkovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING LOWER INTERCONNECT METAL LAYER...
- Publication number 20250105153
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Jintae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE-TIE-DOWN IN BACKSIDE POWER ARCHITECTURE USING TRENCH-TIE-DOWN...
- Publication number 20250098301
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Deepak SHARMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250096112
- Publication date Mar 20, 2025
- NANYA TECHNOLOGY CORPORATION
- Fang-Wen LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D-STACKED SEMICONDUCTOR DEVICE HAVING DIFFERENT CHANNEL STRUCTURES...
- Publication number 20250098324
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Seungchan YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250096137
- Publication date Mar 20, 2025
- Sumitomo Electric Industries, Ltd.
- Taizo TATSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INCLUDING COMPLEMENTARY FIELD EFFECT TRANSISTOR
- Publication number 20250096138
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Jaeha LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE-ALL-AROUND FIELD EFFECT TRANSISTOR STRUCTURES
- Publication number 20250098217
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Yan SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20250098265
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Dong Hoon Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE BI-DIRECTIONAL INTERCONNECT
- Publication number 20250098267
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Yan SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250098283
- Publication date Mar 20, 2025
- MEDIATEK INC.
- Po-Chao TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOURCE/DRAIN REGIONS FOR NANOSHEET DEVICES
- Publication number 20250098245
- Publication date Mar 20, 2025
- International Business Machines Corporation
- Sagarika Mukesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES, SYSTEMS, AND METHODS FOR A PROGRAMMABLE THREE-DIMENSIONAL...
- Publication number 20250096136
- Publication date Mar 20, 2025
- ADVANCED MICRO DEVICES, INC.
- Divya Madapusi Srinivas Prasad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20250087586
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Jungho DO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A SEMICONDUCTOR DEVICE WITH INTER-LAYER VIAS AND...
- Publication number 20250087580
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Lin CHUANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
VOLTAGE REGULATOR IN SEMICONDUCTOR PACKAGES AND METHODS OF FORMING...
- Publication number 20250087632
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HANDLER WAFER WITH LOW OVERLAY RESIDUAL BACKSIDE PATTERNING
- Publication number 20250087527
- Publication date Mar 13, 2025
- International Business Machines Corporation
- Prabudhya Roy Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE CONTACT AT GATE ENDS THROUGH BACKSIDE GATE CUT
- Publication number 20250089288
- Publication date Mar 13, 2025
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250089297
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- JEEWOONG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING BACKSIDE POWER DELIVERY NETWORK LAYER
- Publication number 20250087646
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS

Arrangements of power or ground buses

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

System on chip (SOC) current profile model for integrated voltage r...

3D stacked chip that shares power rails

Semiconductor packages and methods for forming the same

Semiconductor structure having an anchor-shaped backside via

Method of manufacturing semiconductor devices

Semiconductor device having a backside power rail

Semiconductor device and method

Semiconductor device with backside spacer and methods of forming th...

Buried power rail formation for vertical field effect transistors

Parasitic capacitance reduction in GaN-on-silicon devices

Hybrid cell-based device, layout, and method

Semiconductor devices and methods of manufacturing thereof

Backside signal routing

Integrated circuit, system and method of forming same

Memory device and method for forming thereof

Semiconductor device including backside contact structure having po...

Power distribution structure and method

Cell structure with intermediate metal layers for power supplies

Semiconductor integrated circuit device

Semiconductor device using different types of through-silicon-vias

Semiconductor device including penetration via structure

Conductive line structures and method of forming same

Power switch for backside power distribution

Power switch for backside power distribution

Method of manufacturing integrated circuit

Method for forming a buried metal line in a semiconductor substrate

Integrated circuit semiconductor device

Semiconductor device having fin structure

Backside power rail for physical failure analysis (PFA)

Power wall integration for multiple stacked devices

Patents Applicationslast 30 patents

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SELF-ALIGNMENT ASSISTED ASSEMBLY ON A STRUCTURAL WAFER FOR HYBRID B...

Power, Signaling and Thermal Path Co-optimization

VIRTUAL GROUND NET FOR PROCESS-INDUCED DAMAGE PREVENTION

SEMICONDUCTOR DEVICES INCLUDING DECOUPLING CAPACITORS

SEMICONDUCTOR DEVICES INCLUDING BACKSIDE POWER DELIVERY

INTEGRATED CIRCUIT STRUCTURES HAVING STACKED TRANSISTORS WITH BACKS...

Method for Forming a Self-aligned Buried Power Rail in a Nanosheet-...

INTEGRATED CIRCUIT DEVICES WITH VIAS HAVING WIDENED ENDS FOR POWER...

INTEGRATED CIRCUIT DEVICES INCLUDING LOWER INTERCONNECT METAL LAYER...

GATE-TIE-DOWN IN BACKSIDE POWER ARCHITECTURE USING TRENCH-TIE-DOWN...

SEMICONDUCTOR DEVICE

3D-STACKED SEMICONDUCTOR DEVICE HAVING DIFFERENT CHANNEL STRUCTURES...

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT INCLUDING COMPLEMENTARY FIELD EFFECT TRANSISTOR

GATE-ALL-AROUND FIELD EFFECT TRANSISTOR STRUCTURES

SEMICONDUCTOR DEVICES

BACKSIDE BI-DIRECTIONAL INTERCONNECT

SEMICONDUCTOR STRUCTURE

SOURCE/DRAIN REGIONS FOR NANOSHEET DEVICES

DEVICES, SYSTEMS, AND METHODS FOR A PROGRAMMABLE THREE-DIMENSIONAL...

SEMICONDUCTOR DEVICES

METHOD OF FORMING A SEMICONDUCTOR DEVICE WITH INTER-LAYER VIAS AND...

VOLTAGE REGULATOR IN SEMICONDUCTOR PACKAGES AND METHODS OF FORMING...

HANDLER WAFER WITH LOW OVERLAY RESIDUAL BACKSIDE PATTERNING

GATE CONTACT AT GATE ENDS THROUGH BACKSIDE GATE CUT

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING BACKSIDE POWER DELIVERY NETWORK LAYER