Arrangements of power or ground buses

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/5286Arrangements of power or ground buses

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic package comprising conductive layer connected electrode...
- Patent number 12,368,081
- Issue date Jul 22, 2025
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source/drain contacts and methods of forming same
- Patent number 12,363,946
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistors with dual power and signal lines
- Patent number 12,362,278
- Issue date Jul 15, 2025
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems for fabrication of MMIC and RF devices on engineered substr...
- Patent number 12,362,296
- Issue date Jul 15, 2025
- QROMIS, Inc.
- Ozgur Aktas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sandwich structure power supply module
- Patent number 12,356,550
- Issue date Jul 8, 2025
- Monolithic Power Systems, Inc.
- Daocheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic light emitting diode display device
- Patent number 12,356,819
- Issue date Jul 8, 2025
- Samsung Display Co., Ltd.
- Minsu Lee
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor device including two or more stacked semiconductor st...
- Patent number 12,354,984
- Issue date Jul 8, 2025
- SK Hynix Inc.
- Choung Ki Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device
- Patent number 12,356,688
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Tsung Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Replacement buried power rail in backside power delivery
- Patent number 12,354,991
- Issue date Jul 8, 2025
- Tokyo Electron Limited
- Hoyoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voltage regulator with power rail tracking
- Patent number 12,346,143
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Haruki Mori
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacked FET contact formation
- Patent number 12,347,767
- Issue date Jul 1, 2025
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with backside power rail and methods of fabri...
- Patent number 12,347,775
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Lo-Heng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor backside transistor integration with backside power d...
- Patent number 12,341,099
- Issue date Jun 24, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal patterning for internal cell routing
- Patent number 12,341,098
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Shih-Wei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 12,341,109
- Issue date Jun 24, 2025
- Xintec Inc.
- Chia-Ming Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of failure analysis for semiconduct...
- Patent number 12,339,321
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Peng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and semiconductor layout structure
- Patent number 12,334,441
- Issue date Jun 17, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Li Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through substrate via (TSV) validation structure for an integrated...
- Patent number 12,334,416
- Issue date Jun 17, 2025
- NXP USA, INC.
- Darrell Glenn Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cell having stacked pick-up region
- Patent number 12,334,428
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hui Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dielectric caps for power and signal line routing
- Patent number 12,334,442
- Issue date Jun 17, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structures with gate cuts above buried power rails
- Patent number 12,327,791
- Issue date Jun 10, 2025
- Intel Corporation
- Andy Chih-Hung Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive based on chip scale package comprising standardized com...
- Patent number 12,327,816
- Issue date Jun 10, 2025
- iCometrue Company Ltd.
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with increased unity density
- Patent number 12,328,860
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- You-Cheng Xiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded memory IC's with power supply droop circuitry coupled to f...
- Patent number 12,327,581
- Issue date Jun 10, 2025
- Intel Corporation
- Wilfred Gomes
- G11 - INFORMATION STORAGE
Information Patent Grant
Decoupling capacitors with back side power rails
- Patent number 12,327,786
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kam-Tou Sio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,327,804
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Ying Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-function threshold gate with input based adaptive threshold a...
- Patent number 12,322,743
- Issue date Jun 3, 2025
- Kepler Computing Inc.
- Amrita Mathuriya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit
- Patent number 12,322,693
- Issue date Jun 3, 2025
- Samsung Electronics Co., Ltd.
- Shin Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit, system and method of forming the same
- Patent number 12,321,679
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Peng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-function linear threshold gate with input based adaptive thre...
- Patent number 12,316,319
- Issue date May 27, 2025
- Kepler Computing Inc.
- Amrita Mathuriya
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD OF ELECTRONIC PACKAGE
- Publication number 20250239530
- Publication date Jul 24, 2025
- VIA TECHNOLOGIES, INC.
- Yeh-Chi Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE POWER SCHEME WITH FRONT-SIDE POWER INPUT
- Publication number 20250239523
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES HAVING ENHANCED POWER DELIVERY NETWORKS...
- Publication number 20250241060
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Seowoo Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE WITH EMBEDDED POWER MANAGEMENT INTE...
- Publication number 20250239522
- Publication date Jul 24, 2025
- QUALCOMM Incorporated
- Xia LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED FET STRUCTURE WITH IMPROVED CELL HEIGHT
- Publication number 20250241059
- Publication date Jul 24, 2025
- International Business Machines Corporation
- Sagarika Mukesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PROVIDING POWER GATING AND METHOD OF DESIGNING T...
- Publication number 20250239524
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Jianfeng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250239449
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kun-Yen Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250239298
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhon Jhy Liaw
- G11 - INFORMATION STORAGE
Information Patent Application
STACKED FIELD EFFECT TRANSISTOR WITH EPITAXY CUT FOR SOURCE/DRAIN C...
- Publication number 20250239521
- Publication date Jul 24, 2025
- International Business Machines Corporation
- Shay Reboh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CROSS-POINT MEMORY CELL AND METHOD
- Publication number 20250240976
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jui-Jen WU
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE WITH BACKSIDE SPACER AND METHODS OF FORMING TH...
- Publication number 20250233072
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM SEMICONDUCTOR SWITCHING DEVICE
- Publication number 20250234589
- Publication date Jul 17, 2025
- Zinite Corporation
- Douglas W. BARLAGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250234643
- Publication date Jul 17, 2025
- SOCIONEXT INC.
- Wenzhen WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE ANGLED SOURCE/DRAIN CONTACT STRUCTURE
- Publication number 20250227977
- Publication date Jul 10, 2025
- International Business Machines Corporation
- Min Gyu Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT INTER-DIGITATED VIAS AND LEADS
- Publication number 20250226318
- Publication date Jul 10, 2025
- Micron Technology, Inc.
- Christopher F. Kinney
- G11 - INFORMATION STORAGE
Information Patent Application
Delivering electrical power and data signals from the backside of i...
- Publication number 20250226309
- Publication date Jul 10, 2025
- Marvell Asia Pte Ltd.
- Runzi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME
- Publication number 20250226292
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Yi YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROJUNCTION BIPOLAR TRANSISTOR DEVICE
- Publication number 20250227945
- Publication date Jul 10, 2025
- WIN SEMICONDUCTORS CORP.
- Yu-An LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASYMMETRIC SOURCE/DRAIN SPACER WITH SHIFTED VBPR AND BSPDN
- Publication number 20250218946
- Publication date Jul 3, 2025
- International Business Machines Corporation
- GIDEON OYIBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component
- Publication number 20250218989
- Publication date Jul 3, 2025
- INTELPRO INC.
- Lung-Kun Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250220960
- Publication date Jul 3, 2025
- SAMSUNGELECTRONICSCo.,LTD.
- Dongwoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE CUT PLUG WITH THIN HERMETIC LINER AND LOW-K FILL FOR REDUCED C...
- Publication number 20250220990
- Publication date Jul 3, 2025
- Intel Corporation
- Swapnadip Ghosh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED ACTIVE CHIP WITHIN INTERPOSER
- Publication number 20250219022
- Publication date Jul 3, 2025
- International Business Machines Corporation
- Manasa MEDIKONDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE HAVING DIFFERENT FIRST METALLIZATION LAYER AND FIRST BURIED...
- Publication number 20250218945
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Yen LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIRGAP SPACER WITH BACKSIDE POWER DELIVERY
- Publication number 20250221002
- Publication date Jul 3, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20250218950
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Jongsoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE POWER STRUCTURE
- Publication number 20250218970
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRAP CELLS IN SEMICONDUCTOR MEMORY DEVICES
- Publication number 20250218932
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jui-Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER RAIL LEAD FOR SEMICONDUCTOR STRUCTURES
- Publication number 20250218944
- Publication date Jul 3, 2025
- International Business Machines Corporation
- Min Gyu Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED DEVICE CONTACTS AND THROUGH VIAS FOR PERFORMANCE AND L...
- Publication number 20250221020
- Publication date Jul 3, 2025
- Intel Corporation
- Sanjay Natarajan
- H01 - BASIC ELECTRIC ELEMENTS

Arrangements of power or ground buses

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic package comprising conductive layer connected electrode...

Source/drain contacts and methods of forming same

Transistors with dual power and signal lines

Systems for fabrication of MMIC and RF devices on engineered substr...

Sandwich structure power supply module

Organic light emitting diode display device

Semiconductor device including two or more stacked semiconductor st...

Method for forming semiconductor device

Replacement buried power rail in backside power delivery

Voltage regulator with power rail tracking

Stacked FET contact formation

Semiconductor devices with backside power rail and methods of fabri...

Semiconductor backside transistor integration with backside power d...

Metal patterning for internal cell routing

Chip package and manufacturing method thereof

Semiconductor device and method of failure analysis for semiconduct...

Semiconductor device and semiconductor layout structure

Through substrate via (TSV) validation structure for an integrated...

Cell having stacked pick-up region

Dielectric caps for power and signal line routing

Integrated circuit structures with gate cuts above buried power rails

Logic drive based on chip scale package comprising standardized com...

Semiconductor device with increased unity density

Embedded memory IC's with power supply droop circuitry coupled to f...

Decoupling capacitors with back side power rails

Semiconductor device and manufacturing method thereof

Multi-function threshold gate with input based adaptive threshold a...

Integrated circuit

Integrated circuit, system and method of forming the same

Multi-function linear threshold gate with input based adaptive thre...

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND MANUFACTURING METHOD OF ELECTRONIC PACKAGE

BACKSIDE POWER SCHEME WITH FRONT-SIDE POWER INPUT

INTEGRATED CIRCUIT DEVICES HAVING ENHANCED POWER DELIVERY NETWORKS...

INTEGRATED CIRCUIT (IC) PACKAGE WITH EMBEDDED POWER MANAGEMENT INTE...

STACKED FET STRUCTURE WITH IMPROVED CELL HEIGHT

INTEGRATED CIRCUIT PROVIDING POWER GATING AND METHOD OF DESIGNING T...

SEMICONDUCTOR DEVICE STRUCTURE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT STRUCTURE AND METHOD FOR FABRICATING THE SAME

STACKED FIELD EFFECT TRANSISTOR WITH EPITAXY CUT FOR SOURCE/DRAIN C...

CROSS-POINT MEMORY CELL AND METHOD

SEMICONDUCTOR DEVICE WITH BACKSIDE SPACER AND METHODS OF FORMING TH...

THIN FILM SEMICONDUCTOR SWITCHING DEVICE

SEMICONDUCTOR DEVICE

BACKSIDE ANGLED SOURCE/DRAIN CONTACT STRUCTURE

COMPONENT INTER-DIGITATED VIAS AND LEADS

Delivering electrical power and data signals from the backside of i...

SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME

HETEROJUNCTION BIPOLAR TRANSISTOR DEVICE

ASYMMETRIC SOURCE/DRAIN SPACER WITH SHIFTED VBPR AND BSPDN

Electronic Component

SEMICONDUCTOR DEVICE

GATE CUT PLUG WITH THIN HERMETIC LINER AND LOW-K FILL FOR REDUCED C...

EMBEDDED ACTIVE CHIP WITHIN INTERPOSER

DEVICE HAVING DIFFERENT FIRST METALLIZATION LAYER AND FIRST BURIED...

AIRGAP SPACER WITH BACKSIDE POWER DELIVERY

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

INTEGRATED CIRCUIT PACKAGE POWER STRUCTURE

STRAP CELLS IN SEMICONDUCTOR MEMORY DEVICES

POWER RAIL LEAD FOR SEMICONDUCTOR STRUCTURES

DOUBLE-SIDED DEVICE CONTACTS AND THROUGH VIAS FOR PERFORMANCE AND L...