Arrangements of power or ground buses

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H01L23/5286

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/5286Arrangements of power or ground buses

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Standard-cell layout structure with horn power and smart metal cut
- Patent number 12,211,793
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ni-Wan Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standard cell design architecture for reduced voltage droop utilizi...
- Patent number 12,205,897
- Issue date Jan 21, 2025
- Advanced Micro Devices, Inc.
- Richard T. Schultz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making semiconductor device including buried conductive f...
- Patent number 12,205,899
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Liang Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Metal-oxide-metal cell semiconductor device and method
- Patent number 12,205,898
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Chieh Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device
- Patent number 12,199,089
- Issue date Jan 14, 2025
- SOCIONEXT INC.
- Kazuya Okubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including decoupling capacitors
- Patent number 12,199,030
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Xuan Huang
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device
- Patent number 12,199,040
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Hyeongyu You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,191,345
- Issue date Jan 7, 2025
- SOCIONEXT INC.
- Isaya Sobue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including standard-cell-adapted power grid arr...
- Patent number 12,182,488
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hiranmay Biswas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device
- Patent number 12,183,741
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Sungmin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside power rail structure and methods of forming same
- Patent number 12,183,678
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Cheng Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including frontside power mesh and backside po...
- Patent number 12,176,288
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wan-Yu Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride-based semiconductor bidirectional switching device and meth...
- Patent number 12,176,343
- Issue date Dec 24, 2024
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Qiyue Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective metal removal for conductive interconnects in integrated...
- Patent number 12,176,214
- Issue date Dec 24, 2024
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device design mitigating latch-up
- Patent number 12,176,289
- Issue date Dec 24, 2024
- International Business Machines Corporation
- David Wolpert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and manufacturing method of the same
- Patent number 12,170,277
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kam-Tou Sio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assemblies with direct chip attach to circuit bo...
- Patent number 12,170,273
- Issue date Dec 17, 2024
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with backside power rail and method for formin...
- Patent number 12,165,973
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Chung Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device with increased unit density
- Patent number 12,167,583
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- You-Cheng Xiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with buried power rail, integrated circuit...
- Patent number 12,165,927
- Issue date Dec 10, 2024
- Mediatek Inc.
- Po-Chao Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,165,974
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Won-young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices including backside power rails and m...
- Patent number 12,166,016
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Middle end of line decoupling capacitors for semiconductor devices...
- Patent number 12,159,827
- Issue date Dec 3, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMANY, LTD.
- Chung-Ting Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density 3D interconnect configuration
- Patent number 12,159,835
- Issue date Dec 3, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 12,159,834
- Issue date Dec 3, 2024
- Samsung Electronics Co., Ltd.
- Jungho Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods for forming the same
- Patent number 12,159,814
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shared bit lines for memory cells
- Patent number 12,160,985
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ping-Wei Wang
- G11 - INFORMATION STORAGE
Information Patent Grant
Backside CMOS trench epi with close N2P space
- Patent number 12,154,945
- Issue date Nov 26, 2024
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device with inter-layer vias
- Patent number 12,154,851
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Lin Chuang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit and method of designing the same
- Patent number 12,147,751
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Seungman Lim
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUITS WITH CAPACITORS
- Publication number 20250038104
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D-STACKED SEMICONDUCTOR DEVICE INCLUDING MIDDLE ISOLATION STRUCTUR...
- Publication number 20250040242
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Keumseok Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE
- Publication number 20250037760
- Publication date Jan 30, 2025
- SOCIONEXT INC.
- Masanobu HIROSE
- G11 - INFORMATION STORAGE
Information Patent Application
INTEGRATED CIRCUIT, SYSTEM AND METHOD OF FORMING SAME
- Publication number 20250040224
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250038067
- Publication date Jan 30, 2025
- nD-HI Technologies Lab, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES
- Publication number 20250038110
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Sangjine Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR CHIPLET SYSTEM
- Publication number 20250029971
- Publication date Jan 23, 2025
- Zero ASIC Corporation
- Andreas Olofsson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20250031412
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Hyojin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250029923
- Publication date Jan 23, 2025
- SOCIONEXT INC.
- Masato NAKOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250031442
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Ji Won Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250022788
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- KYOUNG LIM SUK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT, SYSTEM AND METHOD OF FORMING SAME
- Publication number 20250022801
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Hsin CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250022834
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- CHOONGBIN YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE FOR III-NITRIDE TRANSISTORS WITH CAP LAYERS
- Publication number 20250022928
- Publication date Jan 16, 2025
- Finwave Semiconductor, Inc.
- Hal Emmer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE VIA
- Publication number 20250022961
- Publication date Jan 16, 2025
- ZINITE CORPORATION
- Douglas W. BARLAGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE LOCAL INTERCONNECT
- Publication number 20250022795
- Publication date Jan 16, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL CHIP OR WAFER STACK
- Publication number 20250022800
- Publication date Jan 16, 2025
- International Business Machines Corporation
- Timothy J. Chainer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250022844
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250014992
- Publication date Jan 9, 2025
- ROHM CO., LTD.
- Kazumasa NISHIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250014999
- Publication date Jan 9, 2025
- SK HYNIX INC.
- Won Duck JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DESIGN SYSTEM, METHOD AND COMPUTER PROGRAM PRODUCT
- Publication number 20250005255
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai Fai CHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THREE DIMENSIONAL MECHANICALLY BOLTING STAPLE FILL
- Publication number 20250006664
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING VERTICAL-TRANSPORT TRANSISTOR...
- Publication number 20250006837
- Publication date Jan 2, 2025
- Intel Corporation
- Richard GEIGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES INCLUDING BACKSIDE POWER RAILS AND M...
- Publication number 20250006705
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside Via and Dual Side Power Rail For Epitaxial Source/Drain St...
- Publication number 20250006557
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PITCH CHANGE BETWEEN METAL LINES
- Publication number 20250006638
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHASE-CHANGE MEMORY INCLUDING PHASE-CHANGE ELEMENTS IN SERIES WITH...
- Publication number 20250008847
- Publication date Jan 2, 2025
- STMicroelectronics S.r.l
- Giovanni Campardo
- G11 - INFORMATION STORAGE
Information Patent Application
CIRCUIT CELLS HAVING POWER STUBS
- Publication number 20240429167
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Yi CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MERGED SELF-ALIGNED BACKSIDE CONTACT
- Publication number 20240429098
- Publication date Dec 26, 2024
- International Business Machines Corporation
- Albert M. Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INCLUDING BACKSIDE WIRING AND METHOD OF DESIGNIN...
- Publication number 20240429168
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Dalhee LEE
- H01 - BASIC ELECTRIC ELEMENTS

Arrangements of power or ground buses

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Standard-cell layout structure with horn power and smart metal cut

Standard cell design architecture for reduced voltage droop utilizi...

Method of making semiconductor device including buried conductive f...

Metal-oxide-metal cell semiconductor device and method

Semiconductor device

Semiconductor devices including decoupling capacitors

Semiconductor device

Semiconductor device

Semiconductor device including standard-cell-adapted power grid arr...

Semiconductor device

Backside power rail structure and methods of forming same

Semiconductor device including frontside power mesh and backside po...

Nitride-based semiconductor bidirectional switching device and meth...

Selective metal removal for conductive interconnects in integrated...

Semiconductor device design mitigating latch-up

Integrated circuit and manufacturing method of the same

Integrated circuit assemblies with direct chip attach to circuit bo...

Semiconductor device with backside power rail and method for formin...

Method of forming semiconductor device with increased unit density

Semiconductor structure with buried power rail, integrated circuit...

Semiconductor package

Packaged semiconductor devices including backside power rails and m...

Middle end of line decoupling capacitors for semiconductor devices...

High density 3D interconnect configuration

Semiconductor devices

Semiconductor packages and methods for forming the same

Shared bit lines for memory cells

Backside CMOS trench epi with close N2P space

Method of forming a semiconductor device with inter-layer vias

Integrated circuit and method of designing the same

Patents Applicationslast 30 patents

INTEGRATED CIRCUITS WITH CAPACITORS

3D-STACKED SEMICONDUCTOR DEVICE INCLUDING MIDDLE ISOLATION STRUCTUR...

SEMICONDUCTOR STORAGE DEVICE

INTEGRATED CIRCUIT, SYSTEM AND METHOD OF FORMING SAME

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT DEVICES

MODULAR CHIPLET SYSTEM

SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT, SYSTEM AND METHOD OF FORMING SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

CONTACT STRUCTURE FOR III-NITRIDE TRANSISTORS WITH CAP LAYERS

ACTIVE VIA

BACKSIDE LOCAL INTERCONNECT

THREE-DIMENSIONAL CHIP OR WAFER STACK

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGES

INTEGRATED CIRCUIT DESIGN SYSTEM, METHOD AND COMPUTER PROGRAM PRODUCT

THREE DIMENSIONAL MECHANICALLY BOLTING STAPLE FILL

INTEGRATED CIRCUIT STRUCTURES HAVING VERTICAL-TRANSPORT TRANSISTOR...

PACKAGED SEMICONDUCTOR DEVICES INCLUDING BACKSIDE POWER RAILS AND M...

Backside Via and Dual Side Power Rail For Epitaxial Source/Drain St...

PITCH CHANGE BETWEEN METAL LINES

PHASE-CHANGE MEMORY INCLUDING PHASE-CHANGE ELEMENTS IN SERIES WITH...

CIRCUIT CELLS HAVING POWER STUBS

MERGED SELF-ALIGNED BACKSIDE CONTACT

INTEGRATED CIRCUIT INCLUDING BACKSIDE WIRING AND METHOD OF DESIGNIN...