Arrangements of power or ground buses

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H01L23/5286

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/5286Arrangements of power or ground buses

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit structures with gate cuts above buried power rails
- Patent number 12,327,791
- Issue date Jun 10, 2025
- Intel Corporation
- Andy Chih-Hung Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive based on chip scale package comprising standardized com...
- Patent number 12,327,816
- Issue date Jun 10, 2025
- iCometrue Company Ltd.
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with increased unity density
- Patent number 12,328,860
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- You-Cheng Xiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded memory IC's with power supply droop circuitry coupled to f...
- Patent number 12,327,581
- Issue date Jun 10, 2025
- Intel Corporation
- Wilfred Gomes
- G11 - INFORMATION STORAGE
Information Patent Grant
Decoupling capacitors with back side power rails
- Patent number 12,327,786
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kam-Tou Sio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,327,804
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Ying Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-function threshold gate with input based adaptive threshold a...
- Patent number 12,322,743
- Issue date Jun 3, 2025
- Kepler Computing Inc.
- Amrita Mathuriya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit
- Patent number 12,322,693
- Issue date Jun 3, 2025
- Samsung Electronics Co., Ltd.
- Shin Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit, system and method of forming the same
- Patent number 12,321,679
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Peng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,315,784
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Yi Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with guard ring
- Patent number 12,315,798
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chiao-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned lateral contacts
- Patent number 12,315,805
- Issue date May 27, 2025
- Intel Corporation
- Andy Chih-Hung Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-function linear threshold gate with input based adaptive thre...
- Patent number 12,316,319
- Issue date May 27, 2025
- Kepler Computing Inc.
- Amrita Mathuriya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power gating for multiple backside voltage planes
- Patent number 12,316,312
- Issue date May 27, 2025
- Intel Corporation
- Scott A. Olsen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device
- Patent number 12,317,572
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Wonkeun Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and manufacturing method of the same
- Patent number 12,314,650
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit devices including a metal resistor and methods o...
- Patent number 12,317,582
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Byounghak Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Skip level vias in metallization layers for integrated circuit devices
- Patent number 12,315,794
- Issue date May 27, 2025
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back side signal routing in a circuit with a relay cell
- Patent number 12,315,804
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,308,363
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Manho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Middle of line structure with stacked devices
- Patent number 12,310,072
- Issue date May 20, 2025
- International Business Machines Corporation
- Junli Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including backside vias and methods of formin...
- Patent number 12,310,057
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Che-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,300,629
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Youngwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure
- Patent number 12,300,601
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Lin-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for electromigration reduction
- Patent number 12,300,610
- Issue date May 13, 2025
- MACOM Technology Solutions Holdings, Inc.
- Yohan Piccin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-dimensional (2D) metal structure and method of forming the same
- Patent number 12,300,609
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including hard macro
- Patent number 12,293,958
- Issue date May 6, 2025
- Samsung Electronics Co., Ltd.
- Jong Doo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,295,168
- Issue date May 6, 2025
- SOCIONEXT INC.
- Wenzhen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing thereof
- Patent number 12,293,970
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shih-Hsiang Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D chip sharing data bus
- Patent number 12,293,993
- Issue date May 6, 2025
- Adeia Semiconductor Inc.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUITS HAVING STACKED TRANSISTORS AND BACKSIDE POWER N...
- Publication number 20250183173
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yu LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE BONDING PATTERN
- Publication number 20250183098
- Publication date Jun 5, 2025
- SK HYNIX INC.
- Byung Wook BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING VIA STRUCTURE CONNECTED TO BACKSIDE...
- Publication number 20250183158
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Sangeun YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING FRONTSIDE CONTACT WITH BACKSIDE CONTACT OF A SOURCE/DRAIN
- Publication number 20250185315
- Publication date Jun 5, 2025
- International Business Machines Corporation
- Andrew M. Greene
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Package Having a Main Die and a Dummy Die
- Publication number 20250183191
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yan-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A LOWER INSULATING PATTERN
- Publication number 20250185295
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- KI HWAN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING BACKSIDE CONTACT STRUCTURE HAVING PO...
- Publication number 20250185332
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Wonhyuk HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20250183121
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- JUBIN SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183147
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Hongjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transistors with Different Drive Current Characteristics in Semicon...
- Publication number 20250185353
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Sheng-Tsung Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHANNEL ISOLATION FOR A LOW-POWER SEMICONDUCTOR DEVICE
- Publication number 20250183172
- Publication date Jun 5, 2025
- International Business Machines Corporation
- Min Gyu Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250185294
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Hee Sub KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH TWO AIR GAPS ON TWO SIDES OF A TOP SOU...
- Publication number 20250185337
- Publication date Jun 5, 2025
- International Business Machines Corporation
- Liqiao Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20250174562
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH BURIED POWER RAILS AND METHOD OF FABRI...
- Publication number 20250174495
- Publication date May 29, 2025
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Sheng HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED IC STRUCTURE WITH ORTHOGONAL INTERCONNECT LAYERS
- Publication number 20250174561
- Publication date May 29, 2025
- Adeia Semiconductor Inc.
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE POWER RAIL FOR PHYSICAL FAILURE ANALYSIS (PFA)
- Publication number 20250174496
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chao CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATED CIRCUIT PACKAGE AND SUBSTRATE STRUCTURE THEREOF
- Publication number 20250174539
- Publication date May 29, 2025
- nD-HI Technologies Lab, Inc.
- HO-MING TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250174559
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Jung Han LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-STACK SEMICONDUCTOR DEVICE
- Publication number 20250174560
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Jisoo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MERGED BACKSIDE CONTACT ISOLATION
- Publication number 20250169172
- Publication date May 22, 2025
- International Business Machines Corporation
- Lijuan Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRANGEMENTS OF CONDUCTIVE FINGERS AND METHODS OF MAKING THE SAME
- Publication number 20250167121
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Liang CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DIE HAVING A METAL PLATE LAYER
- Publication number 20250167123
- Publication date May 22, 2025
- SK HYNIX INC.
- Jae Jun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICE HAVING FIN STRUCTURE
- Publication number 20250169190
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- SHUN-LI CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUP III NITRIDE TRANSISTOR DEVICE AND METHOD FOR FABRICATING A GR...
- Publication number 20250167116
- Publication date May 22, 2025
- Infineon Technologies Austria AG
- Herbert Gietler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED FIELD-EFFECT TRANSISTOR DEVICE WITH BACKSIDE CUT FOR TOP SO...
- Publication number 20250167118
- Publication date May 22, 2025
- International Business Machines Corporation
- Debarghya Sarkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE USING DIFFERENT TYPES OF THROUGH-SILICON-VIAS
- Publication number 20250169067
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Jaesan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250167119
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- WEI-CHENG TZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE LINE STRUCTURES AND METHOD OF FORMING SAME
- Publication number 20250167120
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hiranmay BISWAS
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METAL-OXIDE-METAL DEVICE AND METHOD
- Publication number 20250167122
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Chieh YANG
- G06 - COMPUTING CALCULATING COUNTING

Arrangements of power or ground buses

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated circuit structures with gate cuts above buried power rails

Logic drive based on chip scale package comprising standardized com...

Semiconductor device with increased unity density

Embedded memory IC's with power supply droop circuitry coupled to f...

Decoupling capacitors with back side power rails

Semiconductor device and manufacturing method thereof

Multi-function threshold gate with input based adaptive threshold a...

Integrated circuit

Integrated circuit, system and method of forming the same

Semiconductor package and manufacturing method thereof

Integrated circuit with guard ring

Self-aligned lateral contacts

Multi-function linear threshold gate with input based adaptive thre...

Power gating for multiple backside voltage planes

Semiconductor device

Integrated circuit device and manufacturing method of the same

Integrated circuit devices including a metal resistor and methods o...

Skip level vias in metallization layers for integrated circuit devices

Back side signal routing in a circuit with a relay cell

Semiconductor package

Middle of line structure with stacked devices

Semiconductor devices including backside vias and methods of formin...

Semiconductor package and method of fabricating the same

Interconnect structure

Method and apparatus for electromigration reduction

Two-dimensional (2D) metal structure and method of forming the same

Semiconductor device including hard macro

Semiconductor device

Semiconductor structure and method for manufacturing thereof

3D chip sharing data bus

Patents Applicationslast 30 patents

INTEGRATED CIRCUITS HAVING STACKED TRANSISTORS AND BACKSIDE POWER N...

SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE BONDING PATTERN

SEMICONDUCTOR DEVICE INCLUDING VIA STRUCTURE CONNECTED TO BACKSIDE...

CONNECTING FRONTSIDE CONTACT WITH BACKSIDE CONTACT OF A SOURCE/DRAIN

Fan-Out Package Having a Main Die and a Dummy Die

SEMICONDUCTOR DEVICE INCLUDING A LOWER INSULATING PATTERN

SEMICONDUCTOR DEVICE INCLUDING BACKSIDE CONTACT STRUCTURE HAVING PO...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

Transistors with Different Drive Current Characteristics in Semicon...

CHANNEL ISOLATION FOR A LOW-POWER SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE WITH TWO AIR GAPS ON TWO SIDES OF A TOP SOU...

MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF

SEMICONDUCTOR STRUCTURE WITH BURIED POWER RAILS AND METHOD OF FABRI...

STACKED IC STRUCTURE WITH ORTHOGONAL INTERCONNECT LAYERS

BACKSIDE POWER RAIL FOR PHYSICAL FAILURE ANALYSIS (PFA)

3D INTEGRATED CIRCUIT PACKAGE AND SUBSTRATE STRUCTURE THEREOF

SEMICONDUCTOR DEVICE

MULTI-STACK SEMICONDUCTOR DEVICE

MERGED BACKSIDE CONTACT ISOLATION

ARRANGEMENTS OF CONDUCTIVE FINGERS AND METHODS OF MAKING THE SAME

SEMICONDUCTOR DIE HAVING A METAL PLATE LAYER

METHOD FOR FORMING SEMICONDUCTOR DEVICE HAVING FIN STRUCTURE

GROUP III NITRIDE TRANSISTOR DEVICE AND METHOD FOR FABRICATING A GR...

STACKED FIELD-EFFECT TRANSISTOR DEVICE WITH BACKSIDE CUT FOR TOP SO...

SEMICONDUCTOR DEVICE USING DIFFERENT TYPES OF THROUGH-SILICON-VIAS

SEMICONDUCTOR STRUCTURE

CONDUCTIVE LINE STRUCTURES AND METHOD OF FORMING SAME

METAL-OXIDE-METAL DEVICE AND METHOD