Arrangements of power or ground buses

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/5286Arrangements of power or ground buses

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including frontside power mesh and backside po...
- Patent number 12,176,288
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wan-Yu Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride-based semiconductor bidirectional switching device and meth...
- Patent number 12,176,343
- Issue date Dec 24, 2024
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Qiyue Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective metal removal for conductive interconnects in integrated...
- Patent number 12,176,214
- Issue date Dec 24, 2024
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device design mitigating latch-up
- Patent number 12,176,289
- Issue date Dec 24, 2024
- International Business Machines Corporation
- David Wolpert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and manufacturing method of the same
- Patent number 12,170,277
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kam-Tou Sio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assemblies with direct chip attach to circuit bo...
- Patent number 12,170,273
- Issue date Dec 17, 2024
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with backside power rail and method for formin...
- Patent number 12,165,973
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Chung Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device with increased unit density
- Patent number 12,167,583
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- You-Cheng Xiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with buried power rail, integrated circuit...
- Patent number 12,165,927
- Issue date Dec 10, 2024
- Mediatek Inc.
- Po-Chao Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,165,974
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Won-young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices including backside power rails and m...
- Patent number 12,166,016
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Middle end of line decoupling capacitors for semiconductor devices...
- Patent number 12,159,827
- Issue date Dec 3, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMANY, LTD.
- Chung-Ting Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density 3D interconnect configuration
- Patent number 12,159,835
- Issue date Dec 3, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 12,159,834
- Issue date Dec 3, 2024
- Samsung Electronics Co., Ltd.
- Jungho Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods for forming the same
- Patent number 12,159,814
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shared bit lines for memory cells
- Patent number 12,160,985
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ping-Wei Wang
- G11 - INFORMATION STORAGE
Information Patent Grant
Backside CMOS trench epi with close N2P space
- Patent number 12,154,945
- Issue date Nov 26, 2024
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device with inter-layer vias
- Patent number 12,154,851
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Lin Chuang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit and method of designing the same
- Patent number 12,147,751
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Seungman Lim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor devices
- Patent number 12,148,837
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Bo Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device manufacturing method
- Patent number 12,148,698
- Issue date Nov 19, 2024
- Realtek Semiconductor Corporation
- Chien Cheng Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High aspect ratio buried power rail metallization
- Patent number 12,148,699
- Issue date Nov 19, 2024
- International Business Machines Corporation
- Sagarika Mukesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Co-optimizing power supply voltage in an integrated circuit design
- Patent number 12,147,749
- Issue date Nov 19, 2024
- Synopsys, Inc.
- Qiang Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device, and associated method and system
- Patent number 12,148,700
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shih-Wei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods of local interconnect stitches and power grids
- Patent number 12,148,697
- Issue date Nov 19, 2024
- ARM Limited
- Jean-Luc Pelloie
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Array substrate and display panel
- Patent number 12,148,762
- Issue date Nov 19, 2024
- Hefei Xinsheng Optoelectronics Technology Co., Ltd.
- Xingfeng Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active via
- Patent number 12,148,838
- Issue date Nov 19, 2024
- ZINITE CORPORATION
- Douglas W. Barlage
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip having a back-side power rail
- Patent number 12,142,557
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside power distribution network semiconductor package and metho...
- Patent number 12,142,564
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D chip with shared clock distribution network
- Patent number 12,142,528
- Issue date Nov 12, 2024
- Adeia Semiconductor Inc.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT CELLS HAVING POWER STUBS
- Publication number 20240429167
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Yi CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MERGED SELF-ALIGNED BACKSIDE CONTACT
- Publication number 20240429098
- Publication date Dec 26, 2024
- International Business Machines Corporation
- Albert M. Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INCLUDING BACKSIDE WIRING AND METHOD OF DESIGNIN...
- Publication number 20240429168
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Dalhee LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED BACKSIDE CONTACT
- Publication number 20240429097
- Publication date Dec 26, 2024
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH ISOLATION STRUCTURES FOR BACKSIDE CONTACTS
- Publication number 20240429166
- Publication date Dec 26, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL BUDGET ENHANCED BURIED POWER RAIL AND METHOD OF MANUFACTURI...
- Publication number 20240429169
- Publication date Dec 26, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- Saehan PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT MITIGATING CONTACT TO GATE SHORT
- Publication number 20240429103
- Publication date Dec 26, 2024
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING A BACKSIDE POWER DISTRIBUTION...
- Publication number 20240421154
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Jongjin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240421207
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Jiho YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240421086
- Publication date Dec 19, 2024
- Advanced Semiconductor Engineering, Inc.
- Pao-Nan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR BACKSIDE SIGNAL AND POWER
- Publication number 20240421087
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240420961
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Seunghoon CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE COMPUTING DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240421141
- Publication date Dec 19, 2024
- AP MEMORY TECHNOLOGY CORPORATION
- WEN-LIANG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLACEHOLDER WITH DIELECTRIC LINER PROTECTION TO PREVENT DIRECT BACK...
- Publication number 20240421085
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Tsung-Sheng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20240421089
- Publication date Dec 19, 2024
- SOCIONEXT INC.
- Yoshiki ISHIGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240421122
- Publication date Dec 19, 2024
- KIOXIA Corporation
- Masayuki MIURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DISTRIBUTION WITH BACKSIDE POWER PLANES
- Publication number 20240421088
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACTS FOR GATE, SOURCE, AND DRAIN
- Publication number 20240421003
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Tsung-Sheng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240413158
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- SUNGMIN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED FETs WITH BACKSIDE ANGLE CUT
- Publication number 20240413084
- Publication date Dec 12, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SRAM STRUCTURE WITH DUAL SIDE POWER RAILS
- Publication number 20240414906
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Wei Wang
- G11 - INFORMATION STORAGE
Information Patent Application
STACKED TRANSISTORS WITH METAL VIAS
- Publication number 20240413085
- Publication date Dec 12, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED TRANSISTOR PHYSICALLY UNCLONABLE FUNCTION
- Publication number 20240413100
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Chen LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED BACKSIDE CONTACT WITH PROTRUDING SOURCE/DRAIN
- Publication number 20240413201
- Publication date Dec 12, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL PACKAGING
- Publication number 20240411084
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Stefan Rusu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240413086
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- JINBUM KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INTERCONNECT LAYERS FOR FET ARCHITECTURES
- Publication number 20240404949
- Publication date Dec 5, 2024
- International Business Machines Corporation
- SON NGUYEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP SEMICONDUCTOR-ON-INSULATOR TRANSISTOR LAYOUT
- Publication number 20240404952
- Publication date Dec 5, 2024
- Skyworks Solutions, Inc.
- Yang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEADER LAYOUT DESIGN INCLUDING BACKSIDE POWER RAIL
- Publication number 20240404566
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Haruki MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING BACKSIDE SIGNAL WIRING AND FRONTSIDE...
- Publication number 20240404950
- Publication date Dec 5, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS

Arrangements of power or ground buses

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device including frontside power mesh and backside po...

Nitride-based semiconductor bidirectional switching device and meth...

Selective metal removal for conductive interconnects in integrated...

Semiconductor device design mitigating latch-up

Integrated circuit and manufacturing method of the same

Integrated circuit assemblies with direct chip attach to circuit bo...

Semiconductor device with backside power rail and method for formin...

Method of forming semiconductor device with increased unit density

Semiconductor structure with buried power rail, integrated circuit...

Semiconductor package

Packaged semiconductor devices including backside power rails and m...

Middle end of line decoupling capacitors for semiconductor devices...

High density 3D interconnect configuration

Semiconductor devices

Semiconductor packages and methods for forming the same

Shared bit lines for memory cells

Backside CMOS trench epi with close N2P space

Method of forming a semiconductor device with inter-layer vias

Integrated circuit and method of designing the same

Semiconductor devices

Semiconductor device and semiconductor device manufacturing method

High aspect ratio buried power rail metallization

Co-optimizing power supply voltage in an integrated circuit design

Semiconductor device, and associated method and system

Devices and methods of local interconnect stitches and power grids

Array substrate and display panel

Active via

Integrated chip having a back-side power rail

Backside power distribution network semiconductor package and metho...

3D chip with shared clock distribution network

Patents Applicationslast 30 patents

CIRCUIT CELLS HAVING POWER STUBS

MERGED SELF-ALIGNED BACKSIDE CONTACT

INTEGRATED CIRCUIT INCLUDING BACKSIDE WIRING AND METHOD OF DESIGNIN...

SELF-ALIGNED BACKSIDE CONTACT

TRENCH ISOLATION STRUCTURES FOR BACKSIDE CONTACTS

THERMAL BUDGET ENHANCED BURIED POWER RAIL AND METHOD OF MANUFACTURI...

BACKSIDE CONTACT MITIGATING CONTACT TO GATE SHORT

INTEGRATED CIRCUIT DEVICES INCLUDING A BACKSIDE POWER DISTRIBUTION...

SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE

STRUCTURE FOR BACKSIDE SIGNAL AND POWER

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

HIGH PERFORMANCE COMPUTING DEVICE AND METHOD OF MANUFACTURING THE SAME

PLACEHOLDER WITH DIELECTRIC LINER PROTECTION TO PREVENT DIRECT BACK...

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR DEVICE

POWER DISTRIBUTION WITH BACKSIDE POWER PLANES

BACKSIDE CONTACTS FOR GATE, SOURCE, AND DRAIN

SEMICONDUCTOR DEVICE

STACKED FETs WITH BACKSIDE ANGLE CUT

SRAM STRUCTURE WITH DUAL SIDE POWER RAILS

STACKED TRANSISTORS WITH METAL VIAS

STACKED TRANSISTOR PHYSICALLY UNCLONABLE FUNCTION

SELF-ALIGNED BACKSIDE CONTACT WITH PROTRUDING SOURCE/DRAIN

OPTICAL PACKAGING

SEMICONDUCTOR DEVICE

METAL INTERCONNECT LAYERS FOR FET ARCHITECTURES

FLIP-CHIP SEMICONDUCTOR-ON-INSULATOR TRANSISTOR LAYOUT

HEADER LAYOUT DESIGN INCLUDING BACKSIDE POWER RAIL

SEMICONDUCTOR DEVICE INCLUDING BACKSIDE SIGNAL WIRING AND FRONTSIDE...