Arrangements of power or ground buses

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H01L23/5286

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/5286Arrangements of power or ground buses

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 11,967,593
- Issue date Apr 23, 2024
- SOCIONEXT INC.
- Kazuya Okubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package having a main die and a dummy die
- Patent number 11,967,563
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yan-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SRAM memory cell for stacked transistors with different channel width
- Patent number 11,968,818
- Issue date Apr 23, 2024
- Samsung Electronics Co., Ltd.
- Inchan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC including capacitor having segmented bottom plate
- Patent number 11,961,879
- Issue date Apr 16, 2024
- Texas Instruments Incorporated
- Jeffrey West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and fabricating method thereof
- Patent number 11,961,867
- Issue date Apr 16, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Young Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power-tap pass-through to connect a buried power rail to front-side...
- Patent number 11,961,802
- Issue date Apr 16, 2024
- Tokyo Electron Limited
- Lars Liebmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit read only memory (ROM) structure
- Patent number 11,963,348
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Geng-Cing Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit semiconductor device including through silicon via
- Patent number 11,955,408
- Issue date Apr 9, 2024
- Samsung Electronics Co., Ltd.
- Sohye Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Static random access memory using vertical transport field effect t...
- Patent number 11,956,939
- Issue date Apr 9, 2024
- International Business Machines Corporation
- Tsung-Sheng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,955,508
- Issue date Apr 9, 2024
- SOCIONEXT INC.
- Isaya Sobue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned backside source contact structure
- Patent number 11,948,987
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Lung-Kun Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of manufacturing same
- Patent number 11,948,886
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Guo-Huei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupling capacitors with back side power rails
- Patent number 11,942,413
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kam-Tou Sio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal dissipation in semiconductor devices
- Patent number 11,942,390
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Sheh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure, method, layout, and system
- Patent number 11,935,825
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kam-Tou Sio
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of forming power grid structures
- Patent number 11,935,833
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hiranmay Biswas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High aspect ratio shared contacts
- Patent number 11,935,929
- Issue date Mar 19, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed pitch track pattern
- Patent number 11,929,325
- Issue date Mar 12, 2024
- QUALCOMM Incorporated
- Luca Mattii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Parasitic capacitance reduction in GaN devices
- Patent number 11,929,364
- Issue date Mar 12, 2024
- MACOM Technology Solutions Holdings, Inc.
- Gabriel R. Cueva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-dimensional (2D) metal structure
- Patent number 11,923,300
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 11,923,374
- Issue date Mar 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,923,302
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Fong-yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 11,923,354
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Dayeon Cho
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Gate contact inside gate cut trench
- Patent number 11,916,014
- Issue date Feb 27, 2024
- International Business Machines Corporation
- Reinaldo Vega
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for routing local interconnect structure at same level as re...
- Patent number 11,916,077
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming spacers for semiconductor devices including back...
- Patent number 11,915,972
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 11,916,057
- Issue date Feb 27, 2024
- SOCIONEXT INC.
- Yoko Shiraki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside power rail integration
- Patent number 11,915,966
- Issue date Feb 27, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 11,908,799
- Issue date Feb 20, 2024
- SOCIONEXT INC.
- Hideyuki Komuro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having fin structure
- Patent number 11,908,851
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shun-Li Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240136290
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Jee Woong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOURCE/DRAIN CONTACT AT TIGHT CELL BOUNDARY
- Publication number 20240136414
- Publication date Apr 25, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Traces in Semiconductor Devices and Methods of Forming Same
- Publication number 20240136280
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Wen Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Power Rail Formation in Dielectric Isolation for Semiconduct...
- Publication number 20240136288
- Publication date Apr 25, 2024
- International Business Machines Corporation
- Nikhil Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR INTERCONNECTING A BURIED WIRING LINE AND A SOURCE/DRAIN...
- Publication number 20240136225
- Publication date Apr 25, 2024
- IMEC vzw
- Boon Teik Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Local VDD And VSS Power Supply Through Dummy Gates with Gate Tie-Do...
- Publication number 20240136287
- Publication date Apr 25, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIRTUAL POWER SUPPLY THROUGH WAFER BACKSIDE
- Publication number 20240136289
- Publication date Apr 25, 2024
- International Business Machines Corporation
- Rajiv Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE VIA
- Publication number 20240136330
- Publication date Apr 25, 2024
- ZINITE CORPORATION
- Douglas W. BARLAGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INCLUDING THROUGH-SILICON VIA AND METHOD OF DESI...
- Publication number 20240128164
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Youngrok Park
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DIRECT BACKSIDE SELF-ALIGNED CONTACT
- Publication number 20240128333
- Publication date Apr 18, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DISTRIBUTION NETWORK WITH BACKSIDE POWER RAIL
- Publication number 20240128191
- Publication date Apr 18, 2024
- International Business Machines Corporation
- Tsung-Sheng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE POWER WITH ON-DIE POWER SWITCHES
- Publication number 20240128192
- Publication date Apr 18, 2024
- ADVANCED MICRO DEVICES, INC.
- Suphachai Sutanthavibul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT
- Publication number 20240128186
- Publication date Apr 18, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240128220
- Publication date Apr 18, 2024
- Sony Semiconductor Solutions Corporation
- Akihiko MURASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE FOR ENHANCED COOLING
- Publication number 20240128146
- Publication date Apr 18, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240120278
- Publication date Apr 11, 2024
- Samsung Electronics Co., Ltd.
- Bo Ram LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240120279
- Publication date Apr 11, 2024
- Samsung Electronics Co., Ltd.
- Jeong Hyuk YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD EFFECT TRANSISTOR WITH BACKSIDE SOURCE/DRAIN
- Publication number 20240113176
- Publication date Apr 4, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL-TRANSPORT FIELD-EFFECT TRANSISTOR WITH BACKSIDE SOURCE/DRA...
- Publication number 20240113219
- Publication date Apr 4, 2024
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL-TRANSPORT FIELD-EFFECT TRANSISTORS WITH SHARED BACKSIDE PO...
- Publication number 20240113021
- Publication date Apr 4, 2024
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER VIA WITH REDUCED RESISTANCE
- Publication number 20240113022
- Publication date Apr 4, 2024
- ADVANCED MICRO DEVICES, INC.
- Richard T. Schultz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-Aligned Wafer Backside Gate Signal with Airgap
- Publication number 20240113023
- Publication date Apr 4, 2024
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER GATING DUMMY POWER TRANSISTORS FOR BACK SIDE POWER DELIVERY N...
- Publication number 20240113125
- Publication date Apr 4, 2024
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT WITH SHALLOW PLACEHOLDER AND EASY BACKSIDE SEMICON...
- Publication number 20240113193
- Publication date Apr 4, 2024
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH INCREASED DECOUPLING CAPACITANCE
- Publication number 20240105583
- Publication date Mar 28, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FIELD EFFECT TRANSISTOR WITH INTEGRATED SERIES CAPACITANCE
- Publication number 20240105712
- Publication date Mar 28, 2024
- Wolfspeed, Inc.
- Jeremy Fisher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE POWER DEVICES INTEGRATED WITH SILICON LOGIC DEVICES
- Publication number 20240105700
- Publication date Mar 28, 2024
- Intel Corporation
- Abhishek Anil Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIE OFF DEVICE
- Publication number 20240105726
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Lun Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYERS, AND RELATED METHODS AND DEVICES
- Publication number 20240105574
- Publication date Mar 28, 2024
- Micron Technology, Inc.
- M. Ataul Karim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED FET CONTACT FORMATION
- Publication number 20240105590
- Publication date Mar 28, 2024
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS

Arrangements of power or ground buses

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Fan-out package having a main die and a dummy die

SRAM memory cell for stacked transistors with different channel width

IC including capacitor having segmented bottom plate

Electronic device package and fabricating method thereof

Power-tap pass-through to connect a buried power rail to front-side...

Integrated circuit read only memory (ROM) structure

Integrated circuit semiconductor device including through silicon via

Static random access memory using vertical transport field effect t...

Semiconductor device

Self-aligned backside source contact structure

Semiconductor device and methods of manufacturing same

Decoupling capacitors with back side power rails

Thermal dissipation in semiconductor devices

Contact structure, method, layout, and system

Method of forming power grid structures

High aspect ratio shared contacts

Mixed pitch track pattern

Parasitic capacitance reduction in GaN devices

Two-dimensional (2D) metal structure

3D semiconductor device and structure with metal layers

Semiconductor device and method of manufacture

Semiconductor devices

Gate contact inside gate cut trench

Method for routing local interconnect structure at same level as re...

Methods of forming spacers for semiconductor devices including back...

Semiconductor integrated circuit device

Backside power rail integration

Semiconductor integrated circuit device

Semiconductor device having fin structure

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SOURCE/DRAIN CONTACT AT TIGHT CELL BOUNDARY

Conductive Traces in Semiconductor Devices and Methods of Forming Same

Hybrid Power Rail Formation in Dielectric Isolation for Semiconduct...

METHOD FOR INTERCONNECTING A BURIED WIRING LINE AND A SOURCE/DRAIN...

Local VDD And VSS Power Supply Through Dummy Gates with Gate Tie-Do...

VIRTUAL POWER SUPPLY THROUGH WAFER BACKSIDE

ACTIVE VIA

INTEGRATED CIRCUIT INCLUDING THROUGH-SILICON VIA AND METHOD OF DESI...

DIRECT BACKSIDE SELF-ALIGNED CONTACT

POWER DISTRIBUTION NETWORK WITH BACKSIDE POWER RAIL

BACKSIDE POWER WITH ON-DIE POWER SWITCHES

BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE FOR ENHANCED COOLING

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

FIELD EFFECT TRANSISTOR WITH BACKSIDE SOURCE/DRAIN

VERTICAL-TRANSPORT FIELD-EFFECT TRANSISTOR WITH BACKSIDE SOURCE/DRA...

VERTICAL-TRANSPORT FIELD-EFFECT TRANSISTORS WITH SHARED BACKSIDE PO...

POWER VIA WITH REDUCED RESISTANCE

Self-Aligned Wafer Backside Gate Signal with Airgap

POWER GATING DUMMY POWER TRANSISTORS FOR BACK SIDE POWER DELIVERY N...

BACKSIDE CONTACT WITH SHALLOW PLACEHOLDER AND EASY BACKSIDE SEMICON...

INTERCONNECT STRUCTURE WITH INCREASED DECOUPLING CAPACITANCE

FIELD EFFECT TRANSISTOR WITH INTEGRATED SERIES CAPACITANCE

SILICON CARBIDE POWER DEVICES INTEGRATED WITH SILICON LOGIC DEVICES

TIE OFF DEVICE

REDISTRIBUTION LAYERS, AND RELATED METHODS AND DEVICES

STACKED FET CONTACT FORMATION