Arrangements to limit the height of the assembly

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H01L2225/1088

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/1088Arrangements to limit the height of the assembly

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 12,211,821
- Issue date Jan 28, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die fine grain integrated voltage regulation
- Patent number 12,068,324
- Issue date Aug 20, 2024
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,021,051
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 11,735,563
- Issue date Aug 22, 2023
- Invensas LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,600,597
- Issue date Mar 7, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor package structure
- Patent number 11,532,569
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jui-Pin Hung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device package including embedded conductive elements
- Patent number 11,282,817
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Feng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contoured package-on-package joint
- Patent number 11,270,990
- Issue date Mar 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module
- Patent number 11,264,366
- Issue date Mar 1, 2022
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices, stacked microelectronic devices, and metho...
- Patent number 11,239,128
- Issue date Feb 1, 2022
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked modules
- Patent number 11,239,170
- Issue date Feb 1, 2022
- Snaptrack, Inc.
- Andreas Franz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 11,189,595
- Issue date Nov 30, 2021
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded underfilling for package on package devices
- Patent number 11,139,281
- Issue date Oct 5, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 11,075,182
- Issue date Jul 27, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die fine grain integrated voltage regulation
- Patent number 11,063,046
- Issue date Jul 13, 2021
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package of package-on-package type
- Patent number 11,004,825
- Issue date May 11, 2021
- Samsung Electronics Co., Ltd.
- Dong-ha Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 10,943,889
- Issue date Mar 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 10,937,771
- Issue date Mar 2, 2021
- Samsung Electronics Co., Ltd.
- Jichul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device packages, stacked microelectronic device pac...
- Patent number 10,861,824
- Issue date Dec 8, 2020
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic random access memory (DRAM) mounts
- Patent number 10,861,839
- Issue date Dec 8, 2020
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 10,854,579
- Issue date Dec 1, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,832,986
- Issue date Nov 10, 2020
- Samsung Electronics Co., Ltd.
- Jung Hyun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method of the same
- Patent number 10,770,437
- Issue date Sep 8, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jui-Pin Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless module with antenna package and cap package
- Patent number 10,756,033
- Issue date Aug 25, 2020
- Intel IP Corporation
- Sidharth Dalmia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 10,756,049
- Issue date Aug 25, 2020
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 10,734,367
- Issue date Aug 4, 2020
- Sansumg Electronics Co., Ltd.
- Seung-Kwan Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,692,805
- Issue date Jun 23, 2020
- Samsung Electronics Co., Ltd.
- Da Hee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contoured package-on-package joint
- Patent number 10,672,751
- Issue date Jun 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 10,658,339
- Issue date May 19, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile integrated package
- Patent number 10,651,160
- Issue date May 12, 2020
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Multi-Die Fine Grain Integrated Voltage Regulation
- Publication number 20250015033
- Publication date Jan 9, 2025
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A RE-DISTRIBUTION LAYER (...
- Publication number 20240243056
- Publication date Jul 18, 2024
- QUALCOMM Incorporated
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY AND MANUFACTURING METHOD
- Publication number 20240014188
- Publication date Jan 11, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Xiaofei SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED TRACE SUBSTRATE (ETS) WITH EMBEDDED METAL TRACES HAVING MU...
- Publication number 20230114404
- Publication date Apr 13, 2023
- QUALCOMM Incorporated
- Seongryul Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230083522
- Publication date Mar 16, 2023
- KIOXIA Corporation
- Takayuki IDE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230014834
- Publication date Jan 19, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Xiaofei SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Fine Grain Integrated Voltage Regulation
- Publication number 20210398980
- Publication date Dec 23, 2021
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20210082882
- Publication date Mar 18, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- FENG-CHENG HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contoured Package-on-Package Joint
- Publication number 20200303365
- Publication date Sep 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE
- Publication number 20200294980
- Publication date Sep 17, 2020
- MURATA MANUFACTURING CO., LTD.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20200279833
- Publication date Sep 3, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20200258849
- Publication date Aug 13, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- JUI-PIN HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC RANDOM ACCESS MEMORY (DRAM) MOUNTS
- Publication number 20200027867
- Publication date Jan 23, 2020
- Intel Corporation
- Eng Huat GOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Fine Grain Integrated Voltage Regulation
- Publication number 20200027881
- Publication date Jan 23, 2020
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...
- Publication number 20190371693
- Publication date Dec 5, 2019
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPUTER MODULES WITH SMALL THICKNESSES AND ASSOCIATED METHODS OF M...
- Publication number 20190279964
- Publication date Sep 12, 2019
- Micron Technology, Inc.
- Kevin Gibbons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20190164863
- Publication date May 30, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Jung Hyun CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE PACKAGES, STACKED MICROELECTRONIC DEVICE PAC...
- Publication number 20190096857
- Publication date Mar 28, 2019
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING EMBEDDED PACKAGE ON PACKAGE (PoP) DEVICE
- Publication number 20190081027
- Publication date Mar 14, 2019
- QUALCOMM Incorporated
- Rajneesh Kumar
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Semiconductor Package and Method of Forming the Same
- Publication number 20190027456
- Publication date Jan 24, 2019
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Fine Grain Integrated Voltage Regulation
- Publication number 20180366466
- Publication date Dec 20, 2018
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20180350786
- Publication date Dec 6, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- JUI-PIN HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20180294237
- Publication date Oct 11, 2018
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- JUI-PIN HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PROFILE INTEGRATED PACKAGE
- Publication number 20180269186
- Publication date Sep 20, 2018
- QUALCOMM Incorporated
- Kuiwon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contoured Package-on-Package Joint
- Publication number 20180261587
- Publication date Sep 13, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC STACK STRUCTURE HAVING PASSIVE ELEMENTS AND METHOD FOR F...
- Publication number 20180047711
- Publication date Feb 15, 2018
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20180025992
- Publication date Jan 25, 2018
- JUI-PIN HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20180026007
- Publication date Jan 25, 2018
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dies-on-Package Devices and Methods Therefor
- Publication number 20180026017
- Publication date Jan 25, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...
- Publication number 20180005909
- Publication date Jan 4, 2018
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS

Arrangements to limit the height of the assembly

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package-on-package assembly with wire bond vias

Multi-die fine grain integrated voltage regulation

Semiconductor package and method of forming the same

Package-on-package assembly with wire bond vias

Semiconductor package structure

Method for manufacturing semiconductor package structure

Semiconductor device package including embedded conductive elements

Contoured package-on-package joint

Module

Microelectronic devices, stacked microelectronic devices, and metho...

Stacked modules

Package-on-package assembly with wire bond vias

Molded underfilling for package on package devices

Semiconductor package and method of forming the same

Multi-die fine grain integrated voltage regulation

Semiconductor package of package-on-package type

Semiconductor device and method of manufacture

Semiconductor packages

Microelectronic device packages, stacked microelectronic device pac...

Dynamic random access memory (DRAM) mounts

Semiconductor package structure

Fan-out semiconductor package

Semiconductor package and manufacturing method of the same

Wireless module with antenna package and cap package

Package-on-package assembly with wire bond vias

Semiconductor package and method of fabricating the same

Semiconductor package

Contoured package-on-package joint

Semiconductor device and method of manufacture

Low profile integrated package

Patents Applicationslast 30 patents

Multi-Die Fine Grain Integrated Voltage Regulation

INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A RE-DISTRIBUTION LAYER (...

SEMICONDUCTOR PACKAGE ASSEMBLY AND MANUFACTURING METHOD

EMBEDDED TRACE SUBSTRATE (ETS) WITH EMBEDDED METAL TRACES HAVING MU...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

Multi-Die Fine Grain Integrated Voltage Regulation

SEMICONDUCTOR PACKAGE STRUCTURE

Contoured Package-on-Package Joint

MODULE

Semiconductor Device and Method of Manufacture

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE

DYNAMIC RANDOM ACCESS MEMORY (DRAM) MOUNTS

Multi-Die Fine Grain Integrated Voltage Regulation

MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...

COMPUTER MODULES WITH SMALL THICKNESSES AND ASSOCIATED METHODS OF M...

FAN-OUT SEMICONDUCTOR PACKAGE

MICROELECTRONIC DEVICE PACKAGES, STACKED MICROELECTRONIC DEVICE PAC...

INTEGRATED DEVICE COMPRISING EMBEDDED PACKAGE ON PACKAGE (PoP) DEVICE

Semiconductor Package and Method of Forming the Same

Multi-Die Fine Grain Integrated Voltage Regulation

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE

LOW PROFILE INTEGRATED PACKAGE

Contoured Package-on-Package Joint

ELECTRONIC STACK STRUCTURE HAVING PASSIVE ELEMENTS AND METHOD FOR F...

SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

Dies-on-Package Devices and Methods Therefor

MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...