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CPC
H05K2201/094

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/094Array of pads or lands differing from one another

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board
- Patent number 12,224,235
- Issue date Feb 11, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chan Hoon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 12,219,703
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Jonghyun Seok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transmission module, electronic unit, and electronic device
- Patent number 12,213,244
- Issue date Jan 28, 2025
- Canon Kabushiki Kaisha
- Shoji Matsumoto
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Terminal connection portion for electronic device
- Patent number 12,211,523
- Issue date Jan 28, 2025
- NHK Spring Co., Ltd.
- Yukie Yamada
- G11 - INFORMATION STORAGE
Information Patent Grant
CPU for heatsink based power delivery
- Patent number 12,213,252
- Issue date Jan 28, 2025
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Platform supports the shortest electrical connection between two QS...
- Patent number 12,207,403
- Issue date Jan 21, 2025
- Shuang Jin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Overlap joint flex circuit board interconnection
- Patent number 12,207,407
- Issue date Jan 21, 2025
- Google LLC
- John Martinis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring boards, printed wiring board assemblies, and electro...
- Patent number 12,207,411
- Issue date Jan 21, 2025
- Micron Technology, Inc.
- Kristopher D. Hamrick
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure
- Patent number 12,200,861
- Issue date Jan 14, 2025
- Unimicron Technology Corp.
- Guang-Hwa Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contact arrangement and electronic assembly
- Patent number 12,191,242
- Issue date Jan 7, 2025
- Via Technologies, Inc.
- Nai-Shung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module
- Patent number 12,193,162
- Issue date Jan 7, 2025
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and light-emitting device
- Patent number 12,185,468
- Issue date Dec 31, 2024
- Nichia Corporation
- Soichiro Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed circuit board and method of manufacturing flexible...
- Patent number 12,177,977
- Issue date Dec 24, 2024
- Sumitomo Electric Industries, Ltd.
- Koji Nitta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect and method for manufacturing the same
- Patent number 12,171,064
- Issue date Dec 17, 2024
- Raytheon Company
- Brandon W. Pillans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof, and substrate...
- Patent number 12,154,848
- Issue date Nov 26, 2024
- Siliconware Precision Industries Co., Ltd.
- Chia-Wen Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus
- Patent number 12,153,750
- Issue date Nov 26, 2024
- BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.
- Danyang Bi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic element mounting substrate, electronic device, and elect...
- Patent number 12,144,114
- Issue date Nov 12, 2024
- Kyocera Corporation
- Kanae Horiuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of producing printed circuit board
- Patent number 12,144,111
- Issue date Nov 12, 2024
- Denso Corporation
- Hirokazu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC die, probe and ultrasound system
- Patent number 12,128,443
- Issue date Oct 29, 2024
- Koninklijke Philips N.V.
- Wojtek Sudol
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Printed circuit board PCB assembly and electronic device
- Patent number 12,127,347
- Issue date Oct 22, 2024
- HONOR DEVICE CO., LTD.
- Zhijie Xu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board including terminal, wiring module, a...
- Patent number 12,114,429
- Issue date Oct 8, 2024
- Autonetworks Technologies, Ltd.
- Hideo Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inductor component and inductor component mounting substrate
- Patent number 12,112,881
- Issue date Oct 8, 2024
- Murata Manufacturing Co., Ltd.
- Rikiya Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed circuit board, wiring module, flexible printed cir...
- Patent number 12,101,888
- Issue date Sep 24, 2024
- Autonetworks Technologies, Ltd.
- Hideo Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with stack-stack connection for connecting compon...
- Patent number 12,096,555
- Issue date Sep 17, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die package structure and method for fabricating the same
- Patent number 12,089,346
- Issue date Sep 10, 2024
- Realtek Semiconductor Corp.
- Hai-Tao Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and memory system
- Patent number 12,082,340
- Issue date Sep 3, 2024
- Kioxia Corporation
- Yuta Tsubouchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Communication system including antennas on substrate
- Patent number 12,061,500
- Issue date Aug 13, 2024
- Whoborn, Inc.
- Youngsik Bae
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display device including a pad where a driving chip is mounted
- Patent number 12,055,827
- Issue date Aug 6, 2024
- Samsung Display Co., Ltd.
- Sujeong Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacked-layer board, electronic component module, and method of man...
- Patent number 12,052,821
- Issue date Jul 30, 2024
- Murata Manufacturing Co., Ltd.
- Takuya Goitsuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shielded electronic component package
- Patent number 12,040,305
- Issue date Jul 16, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Ok Chun
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD
- Publication number 20250048557
- Publication date Feb 6, 2025
- LG Innotek Co., Ltd.
- Soo Min LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF, AND SUBSTRATE...
- Publication number 20250038097
- Publication date Jan 30, 2025
- Siliconware Precision Industries Co., Ltd.
- Chia-Wen TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20250031303
- Publication date Jan 23, 2025
- LG Innotek Co., Ltd.
- Dong Keon LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VIA ASSEMBLY FOR PRINTED CIRCUIT BOARD
- Publication number 20250031300
- Publication date Jan 23, 2025
- Cisco Technology, Inc.
- Mike Sapozhnikov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250016921
- Publication date Jan 9, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Sang Ho JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND LIGHT-EMITTING PANEL WITH CIRCUIT BOARD
- Publication number 20250008649
- Publication date Jan 2, 2025
- AUO Corporation
- Chieh-Ming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20240431024
- Publication date Dec 26, 2024
- Murata Manufacturing Co., Ltd.
- Hirofumi OIE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY PANEL, DISPLAY DEVICE, AND DRIVER CHIP
- Publication number 20240422909
- Publication date Dec 19, 2024
- Wuhan China Star Optoelectronics Technology Co., Ltd.
- Yiyu GUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD, WIRING MODULE, FLEXIBLE PRINTED CIR...
- Publication number 20240414848
- Publication date Dec 12, 2024
- AUTONETWORKS TECHNOLOGIES, LTD.
- Hideo TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20240407103
- Publication date Dec 5, 2024
- LG Innotek Co., Ltd.
- Chae Young YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET VOIDING SCHEME FOR VERTICAL INTERCONNECTS
- Publication number 20240397610
- Publication date Nov 28, 2024
- Intel Corporation
- Aik Hong Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240397617
- Publication date Nov 28, 2024
- SAMSUNG DISPLAY CO., LTD.
- JOO-NYUNG JANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE, CIRCUIT BOARD, AND MANUFACTURING METHOD FOR CIRC...
- Publication number 20240373553
- Publication date Nov 7, 2024
- Huawei Technologies Co., Ltd
- Xuanling Liang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE INCLUDING A PAD WHERE A DRIVING CHIP IS MOUNTED
- Publication number 20240361650
- Publication date Oct 31, 2024
- SAMSUNG DISPLAY CO., LTD.
- SUJEONG KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Circuit layout of printed circuit board
- Publication number 20240349421
- Publication date Oct 17, 2024
- REALTEK SEMICONDUCTOR CORPORATION
- CHIA-LUNG WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR NANOPLASMA SWITCHES
- Publication number 20240334584
- Publication date Oct 3, 2024
- Analog Devices International Unlimited Company
- Romulo Maggay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE
- Publication number 20240334603
- Publication date Oct 3, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Ren XIONG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240321715
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- HYEJIN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROCONTROLLER UNIT PLATFORM
- Publication number 20240319694
- Publication date Sep 26, 2024
- Johnson Controls Tyco IP Holdings LLP
- Robert C. Hall
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE
- Publication number 20240314929
- Publication date Sep 19, 2024
- KIOXIA Corporation
- Kiyokazu ISHIZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, ELECTRONIC APPARATUS AND MANUFACTURING METHOD FOR CI...
- Publication number 20240306289
- Publication date Sep 12, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Xiao WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flexible Circuit Board, Circuit Board Assembly, and Electronic Device
- Publication number 20240306300
- Publication date Sep 12, 2024
- Honor Device Co., Ltd.
- Jianqiang Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Dimensional Wired Circuit Board Structure
- Publication number 20240292538
- Publication date Aug 29, 2024
- Guangzhou Kanglong Electronics Co., Ltd.
- Tielong KANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROELECTRONIC DEVICE PACKAGE ASSEMBLIES INCLUDING STIFFENER DEVIC...
- Publication number 20240292522
- Publication date Aug 29, 2024
- Micron Technology, Inc.
- Prasad Nagavenkata Nune
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDI...
- Publication number 20240284594
- Publication date Aug 22, 2024
- SAMSUNG DISPLAY CO., LTD.
- Han-Sung BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD PCB ASSEMBLY AND ELECTRONIC DEVICE
- Publication number 20240268032
- Publication date Aug 8, 2024
- Honor Device Co., Ltd.
- Zhijie XU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SEMICONDUCTOR MODULE WITH VIBRATION DAMPENERS AND POWER ELECT...
- Publication number 20240266300
- Publication date Aug 8, 2024
- INFINEON TECHNOLOGIES AG
- Marco Bäßler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE
- Publication number 20240268025
- Publication date Aug 8, 2024
- Yunnan Invensight Optoelectronics Technology Co., Ltd.
- Xiao BAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS
- Publication number 20240264686
- Publication date Aug 8, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Danyang Bi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240251504
- Publication date Jul 25, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Array of pads or lands differing from one another

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed circuit board

Printed circuit board

Transmission module, electronic unit, and electronic device

Terminal connection portion for electronic device

CPU for heatsink based power delivery

Platform supports the shortest electrical connection between two QS...

Overlap joint flex circuit board interconnection

Printed wiring boards, printed wiring board assemblies, and electro...

Circuit board structure

Contact arrangement and electronic assembly

Module

Wiring board and light-emitting device

Flexible printed circuit board and method of manufacturing flexible...

Interconnect and method for manufacturing the same

Electronic package and manufacturing method thereof, and substrate...

Display apparatus

Electronic element mounting substrate, electronic device, and elect...

Printed circuit board and method of producing printed circuit board

IC die, probe and ultrasound system

Printed circuit board PCB assembly and electronic device

Flexible printed circuit board including terminal, wiring module, a...

Inductor component and inductor component mounting substrate

Flexible printed circuit board, wiring module, flexible printed cir...

Component carrier with stack-stack connection for connecting compon...

Die package structure and method for fabricating the same

Semiconductor device and memory system

Communication system including antennas on substrate

Display device including a pad where a driving chip is mounted

Stacked-layer board, electronic component module, and method of man...

Shielded electronic component package

Patents Applicationslast 30 patents

CIRCUIT BOARD

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF, AND SUBSTRATE...

CIRCUIT BOARD

VIA ASSEMBLY FOR PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

CIRCUIT BOARD AND LIGHT-EMITTING PANEL WITH CIRCUIT BOARD

ELECTRONIC COMPONENT

DISPLAY PANEL, DISPLAY DEVICE, AND DRIVER CHIP

FLEXIBLE PRINTED CIRCUIT BOARD, WIRING MODULE, FLEXIBLE PRINTED CIR...

CIRCUIT BOARD

OFFSET VOIDING SCHEME FOR VERTICAL INTERCONNECTS

DISPLAY DEVICE

ELECTRONIC DEVICE, CIRCUIT BOARD, AND MANUFACTURING METHOD FOR CIRC...

DISPLAY DEVICE INCLUDING A PAD WHERE A DRIVING CHIP IS MOUNTED

Circuit layout of printed circuit board

APPARATUS AND METHODS FOR NANOPLASMA SWITCHES

DISPLAY DEVICE

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

MICROCONTROLLER UNIT PLATFORM

SEMICONDUCTOR STORAGE DEVICE

CIRCUIT BOARD, ELECTRONIC APPARATUS AND MANUFACTURING METHOD FOR CI...

Flexible Circuit Board, Circuit Board Assembly, and Electronic Device

Three-Dimensional Wired Circuit Board Structure

MICROELECTRONIC DEVICE PACKAGE ASSEMBLIES INCLUDING STIFFENER DEVIC...

ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDI...

PRINTED CIRCUIT BOARD PCB ASSEMBLY AND ELECTRONIC DEVICE

POWER SEMICONDUCTOR MODULE WITH VIBRATION DAMPENERS AND POWER ELECT...

DISPLAY MODULE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE

DISPLAY APPARATUS

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF