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  • H05K2201/094
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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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H05K2201/094Array of pads or lands differing from one another
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250212327
    • Publication date Jun 26, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Kyeong Yub Jung
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING BOARD
    • Publication number 20250212324
    • Publication date Jun 26, 2025
    • TOPPAN Holdings Inc.
    • Tomoyuki Ishii
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FLEXIBLE PRINTED CIRCUIT, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC DE...
    • Publication number 20250212330
    • Publication date Jun 26, 2025
    • Huawei Technologies Co., Ltd
    • Tong Zhang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20250212334
    • Publication date Jun 26, 2025
    • Mitsubishi Electric Corporation
    • Taketoshi SHIKANO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250212336
    • Publication date Jun 26, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Ki Ran PARK
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
    • Publication number 20250203761
    • Publication date Jun 19, 2025
    • LG Innotek Co., Ltd.
    • Duck Hoon PARK
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Optical Module
    • Publication number 20250203758
    • Publication date Jun 19, 2025
    • Nippon Telegraph and Telephone Corporation
    • Josuke Ozaki
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHODS OF FORMATION
    • Publication number 20250203773
    • Publication date Jun 19, 2025
    • Micron Technology, Inc.
    • Kelvin Aik Boo TAN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MEMORY MODULE AND ELECTRONIC DEVICE ASSEMBLY INCLUDING THE SAME
    • Publication number 20250194006
    • Publication date Jun 12, 2025
    • Samsung Electronics Co., Ltd.
    • DONGYOON SEO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    • Publication number 20250176103
    • Publication date May 29, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Sanghyeok Kim
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20250176111
    • Publication date May 29, 2025
    • Samsung Electronics Co., LTD
    • Kyoungok Jung
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BASE MEMBER
    • Publication number 20250168982
    • Publication date May 22, 2025
    • Canon Kabushiki Kaisha
    • Yoshihiko Fujise
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARDS, AND RELATED ASSEMBLIES AND ELECTRONIC SYSTEMS
    • Publication number 20250159813
    • Publication date May 15, 2025
    • Micron Technology, Inc.
    • Kristopher D. Hamrick
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20250159805
    • Publication date May 15, 2025
    • InnoLux Corporation
    • Shang-Ru WU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE AND ITS MANUFACTURING METHOD
    • Publication number 20250151207
    • Publication date May 8, 2025
    • Shanghai AVIC Optoelectronics Co., Ltd.
    • Akira FUJITA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20250151195
    • Publication date May 8, 2025
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD
    • Publication number 20250142724
    • Publication date May 1, 2025
    • KYOCERA CORPORATION
    • Toshifumi HIGASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PER LAYER ANTI-PAD STRUCTURE FOR BALL GRID ARRAY PRINTED CIRCUIT BO...
    • Publication number 20250142716
    • Publication date May 1, 2025
    • Astera Labs, Inc.
    • Long YANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LIGHTING DEVICE
    • Publication number 20250142723
    • Publication date May 1, 2025
    • Lite-On Technology Corporation
    • SHAN-HUI CHEN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD ASSEMBLY
    • Publication number 20250133652
    • Publication date Apr 24, 2025
    • Cisco Technology, Inc.
    • Yuqing Zhu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20250133656
    • Publication date Apr 24, 2025
    • LG Innotek Co., Ltd.
    • Sang Il KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MEMORY MODULES AND SOCKETS
    • Publication number 20250126714
    • Publication date Apr 17, 2025
    • Xiang Li
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD AND ELECTRONIC COMPONENT PACKAGE
    • Publication number 20250126717
    • Publication date Apr 17, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Cheolmin Shin
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT MODULES WITH ENCAPSULANT-EMBEDDED LEADFRAME TERMINALS, AND...
    • Publication number 20250126716
    • Publication date Apr 17, 2025
    • NXP USA, Inc.
    • Boon Yew Low
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250126710
    • Publication date Apr 17, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Man Gon KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD
    • Publication number 20250120010
    • Publication date Apr 10, 2025
    • Shinko Electric Industries Co., Ltd.
    • Tatsuki Sumi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BUS CONNECTION CABLE REVERSE-WELDING STRUCTURE
    • Publication number 20250118912
    • Publication date Apr 10, 2025
    • JESS-LINK PRODUCTS CO., LTD.
    • Wen-Yu WANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    TERMINAL CONNECTION PORTION FOR ELECTRONIC DEVICE
    • Publication number 20250118340
    • Publication date Apr 10, 2025
    • NHK Spring Co., Ltd.
    • Yukie YAMADA
    • G11 - INFORMATION STORAGE
  • Information Patent Application

    RECEPTACLE ASSEMBLY AND CIRCUIT BOARD
    • Publication number 20250120007
    • Publication date Apr 10, 2025
    • Yamaichi Electronics Co., Ltd.
    • Toshiyasu ITO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20250120009
    • Publication date Apr 10, 2025
    • Samsung Electronics Co., Ltd.
    • Dongwoo KIM
    • H01 - BASIC ELECTRIC ELEMENTS