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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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H05K2201/094Array of pads or lands differing from one another
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR SUBSTRATE, METHOD FOR DESIGNING SEMICONDUCTOR SUBSTRA...
    • Publication number 20240147603
    • Publication date May 2, 2024
    • NEC Corporation
    • Naoki Oshima
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BOARD-TO-BOARD CONNECTOR
    • Publication number 20240145957
    • Publication date May 2, 2024
    • Japan Aviation Electronics Industry, Ltd.
    • Osamu HASHIGUCHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240136294
    • Publication date Apr 25, 2024
    • IBIDEN CO., LTD.
    • Ikuya TERAUCHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FLEXIBLE CONNECTING STRUCTURE
    • Publication number 20240128665
    • Publication date Apr 18, 2024
    • Min Di Consultants Ltd.
    • Chi-Di LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20240114620
    • Publication date Apr 4, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Seung Min LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240107668
    • Publication date Mar 28, 2024
    • LG Innotek Co., Ltd.
    • Jinhak LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20240096378
    • Publication date Mar 21, 2024
    • Kabushiki Kaisha Toshiba
    • Nobuhiro YAMAMOTO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20240098896
    • Publication date Mar 21, 2024
    • PanelSemi Corporation
    • Chin-Tang LI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING CIRCUIT BOARD
    • Publication number 20240090128
    • Publication date Mar 14, 2024
    • Nitto Denko Corporation
    • Yusaku TAMAKI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC CIRCUIT MODULE
    • Publication number 20240090134
    • Publication date Mar 14, 2024
    • MURATA MANUFACTURING CO., LTD.
    • Yoshihito OTSUBO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    • Publication number 20240074050
    • Publication date Feb 29, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Jun Ki Min
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR PACKAGING WITH REDUCED STANDOFF HEIGHT
    • Publication number 20240074048
    • Publication date Feb 29, 2024
    • Micron Technology, Inc.
    • Ling Pan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20240074057
    • Publication date Feb 29, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Man Gon Kim
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20240074051
    • Publication date Feb 29, 2024
    • Samsung Electronics Co., Ltd.
    • Jonghyun SEOK
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARDS, PRINTED WIRING BOARD ASSEMBLIES, AND ELECTRO...
    • Publication number 20240064906
    • Publication date Feb 22, 2024
    • Micron Technology, Inc.
    • Kristopher D. Hamrick
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LEADLESS CURRENT SENSOR PACKAGE WITH HIGH ISOLATION
    • Publication number 20240044946
    • Publication date Feb 8, 2024
    • ALLEGRO MICROSYSTEMS, LLC
    • Robert A. Briano
    • G01 - MEASURING TESTING
  • Information Patent Application

    Overlap Joint Flex Circuit Board Interconnection
    • Publication number 20240049392
    • Publication date Feb 8, 2024
    • Google LLC
    • John Martinis
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20240032192
    • Publication date Jan 25, 2024
    • Innolux Corporation
    • Zhi-Fu Huang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SYSTEM AND METHOD FOR REVERSIBLE CONNECTION OF INTERCHANGABLE COMPO...
    • Publication number 20240032194
    • Publication date Jan 25, 2024
    • Dell Products L.P.
    • EDUARDO ESCAMILLA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING CIRCUIT BOARD
    • Publication number 20240008178
    • Publication date Jan 4, 2024
    • Nitto Denko Corporation
    • Shusaku SHIBATA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRIC DEVICE, ITS CIRCUIT BOARD AND METHOD OF MANUFACTURING THE...
    • Publication number 20230422398
    • Publication date Dec 28, 2023
    • Global Unichip Corporation
    • Chih-Chieh LIAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20230413425
    • Publication date Dec 21, 2023
    • LG Innotek Co., Ltd.
    • Myung Jae KWON
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ARTICLE FOR POWER INVERTER AND POWER INVERTER
    • Publication number 20230413435
    • Publication date Dec 21, 2023
    • Exro Technologies Inc.
    • Eric HUSTEDT
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    DIFFERENTIAL TRANSMISSION BOARD SET AND ASSEMBLY
    • Publication number 20230396006
    • Publication date Dec 7, 2023
    • Japan Aviation Electronics Industry, Ltd.
    • Kenta OONISHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MOUNTING BOARD AND CIRCUIT BOARD
    • Publication number 20230395766
    • Publication date Dec 7, 2023
    • TDK Corporation
    • Tomohisa MITOSE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STORAGE DEVICE AND PRINTED CIRCUIT BOARD FOR SOLID STATE DRIVE
    • Publication number 20230380061
    • Publication date Nov 23, 2023
    • SK HYNIX INC.
    • Byoung Ick Jang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC COMPONENT
    • Publication number 20230371175
    • Publication date Nov 16, 2023
    • TDK Corporation
    • Yu FUKAE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CONNECTION STRUCTURE FOR FLEXIBLE PRINTED BOARD AND METHOD FOR MANU...
    • Publication number 20230361516
    • Publication date Nov 9, 2023
    • AUTONETWORKS TECHNOLOGIES, LTD.
    • Shinji NOZAKI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD AND APPARATUS FOR MOUNTING AND COOLING A CIRCUIT COMPONENT
    • Publication number 20230352903
    • Publication date Nov 2, 2023
    • LANDA LABS (2012) LTD.
    • Ronny COSTI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ADDRESSABLE SWITCH ASSEMBLY FOR WELLBORE SYSTEMS AND METHOD
    • Publication number 20230340862
    • Publication date Oct 26, 2023
    • GeoDynamics, Inc.
    • Phillip PHELPS
    • F42 - AMMUNITION BLASTING