Aspects relating to the layout of the pattern or to the size of vias or trenches

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H01L21/76816

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76816Aspects relating to the layout of the pattern or to the size of vias or trenches

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Via configurable edge-combiner with duty cycle correction
- Patent number 12,316,328
- Issue date May 27, 2025
- Altera Corporation
- Chooi Pei Lim
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory device and fabrication method thereof
- Patent number 12,315,802
- Issue date May 27, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package comprising a package-on-package (POP) arch...
- Patent number 12,315,777
- Issue date May 27, 2025
- Intel Corporation
- Elizabeth Nofen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 12,315,734
- Issue date May 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Li-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Skip level vias in metallization layers for integrated circuit devices
- Patent number 12,315,794
- Issue date May 27, 2025
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device including porous dielect...
- Patent number 12,308,245
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Jongcheon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming interconnect structure
- Patent number 12,308,283
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Kai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing fine metal lines with high aspect ratio
- Patent number 12,308,285
- Issue date May 20, 2025
- NANYA TECHNOLOGY CORPORATION
- Chih-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating semiconductor device
- Patent number 12,308,320
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Sung Jin Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and method for manufacturing the same
- Patent number 12,308,328
- Issue date May 20, 2025
- Kioxia Corporation
- Kyosuke Nanami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plug and trench architectures for integrated circuits and methods o...
- Patent number 12,308,284
- Issue date May 20, 2025
- Intel Corporation
- Charles H. Wallace
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 12,300,608
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shih-Wei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure
- Patent number 12,300,601
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Lin-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,300,593
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Ching Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-dimensional (2D) metal structure and method of forming the same
- Patent number 12,300,609
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device including staircase structure having conductive pads
- Patent number 12,300,616
- Issue date May 13, 2025
- Micron Technology, Inc.
- Alyssa N. Scarbrough
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and method for preparing the same
- Patent number 12,293,914
- Issue date May 6, 2025
- NANYA TECHNOLOGY CORPORATION
- Cheng-Hsiang Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface oxidation control of metal gates using capping layer
- Patent number 12,293,916
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,293,969
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chi-Ta Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor device
- Patent number 12,293,967
- Issue date May 6, 2025
- SK hynix Inc.
- Sung Lae Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reworking process of a failed hard mask for fabricating a semicondu...
- Patent number 12,293,922
- Issue date May 6, 2025
- NANYA TECHNOLOGY CORPORATION
- Wei-Chen Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Skip level vias in metallization layers for integrated circuit devices
- Patent number 12,288,746
- Issue date Apr 29, 2025
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film deposition apparatus for fine pattern forming
- Patent number 12,288,671
- Issue date Apr 29, 2025
- Tokyo Electron Limited
- Kazuhide Hasebe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Through via structure
- Patent number 12,288,735
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and manufacturing method thereof
- Patent number 12,283,590
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xin-Yong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with multi-carbon-concentration dielectrics
- Patent number 12,278,183
- Issue date Apr 15, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer interconnect structure and method for integrated circuits
- Patent number RE50384
- Issue date Apr 15, 2025
- Tessera Advanced Technologies, Inc.
- Ryoung-Han Kim
Information Patent Grant
Method of manufacturing semiconductor devices
- Patent number 12,272,596
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Junghyuck Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective metal removal with flowable polymer
- Patent number 12,272,551
- Issue date Apr 8, 2025
- Applied Materials, Inc.
- Liqi Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,274,053
- Issue date Apr 8, 2025
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Yaoguang Xu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC DEVICES INCLUDING ACTIVE CONTACTS AND SUPPORT CONTACTS
- Publication number 20250174558
- Publication date May 29, 2025
- Micron Technology, Inc.
- S M Istiaque Hossain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor layout pattern and semiconductor stack structure suit...
- Publication number 20250174491
- Publication date May 29, 2025
- UNITED MICROELECTRONICS CORP.
- Wei Lun Oo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH STACKED SEMICONDUCTOR DIES
- Publication number 20250174578
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Chao Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTANCE VIA STRUCTURE
- Publication number 20250167103
- Publication date May 22, 2025
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIAS WITH SELECTED GRAIN DISTRIBUTION
- Publication number 20250167046
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20250167111
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Jisoo OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE LINE STRUCTURES AND METHOD OF FORMING SAME
- Publication number 20250167120
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hiranmay BISWAS
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DEPOSITION PROCESS FOR PATTERNING EDGE PLACEMENT ERROR IMPROVEMENT
- Publication number 20250166994
- Publication date May 22, 2025
- Applied Materials, Inc.
- Zhiyu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUTTING STRUCTURE, SEMICONDUCTOR DEVICE COMPRISING THE SAME, AND ME...
- Publication number 20250157923
- Publication date May 15, 2025
- NANYA TECHNOLOGY CORPORATION
- CHUN-YEN WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUTTING STRUCTURE, SEMICONDUCTOR DEVICE COMPRISING THE SAME, AND ME...
- Publication number 20250157924
- Publication date May 15, 2025
- NANYA TECHNOLOGY CORPORATION
- CHUN-YEN WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES INCLUDING STADIUM STRUCTURES, AND RELATED ELECTRONIC...
- Publication number 20250157926
- Publication date May 15, 2025
- Micron Technology, Inc.
- Paolo Tessariol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING THROUGH-GLASS VIAS
- Publication number 20250157812
- Publication date May 15, 2025
- Corning Incorporated
- Jason Roy Grenier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALLIUM INTRODUCTION FOR CAVITY SHAPING ENGINEERING FOR CMOS DEVICES
- Publication number 20250149381
- Publication date May 8, 2025
- Applied Materials, Inc.
- Nicolas Louis BREIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE
- Publication number 20250149437
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chen CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL METAL SILICIDE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRU...
- Publication number 20250142939
- Publication date May 1, 2025
- Intel Corporation
- Jeffrey S. LEIB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250140685
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chrong Jung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INCLUDING SUPPORT STRUCTURES
- Publication number 20250132267
- Publication date Apr 24, 2025
- Micron Technology, Inc.
- Andrew Zhe Wei Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250132198
- Publication date Apr 24, 2025
- Samsung Electronics Co., LTD
- Yunho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE
- Publication number 20250132247
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Lin TENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND FORMULATIONS FOR SACRIFICIAL BRACING, SURFACE PROTECTIO...
- Publication number 20250132195
- Publication date Apr 24, 2025
- LAM RESEARCH CORPORATION
- Stephen M. SIRARD
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
STRUCTURE AND METHOD TO IMPROVE FAV RIE PROCESS MARGIN AND ELECTROM...
- Publication number 20250132199
- Publication date Apr 24, 2025
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA-DAMAGE-RESISTANT INTERCONNECT STRUCTURE AND METHODS FOR MANU...
- Publication number 20250132258
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250133755
- Publication date Apr 24, 2025
- United Microelectronics Corp.
- Shin-Hung LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED VIA FORMATION USING SPACERS
- Publication number 20250132204
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL SOURCE OR DRAIN STRUCTURES FOR ADVANCED INTEGRATED CIRCUI...
- Publication number 20250126869
- Publication date Apr 17, 2025
- Intel Corporation
- Subhash JOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH REDUCED CRITICAL DIMENSION AND...
- Publication number 20250125190
- Publication date Apr 17, 2025
- NANYA TECHNOLOGY CORPORATION
- KUO-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH REDUCED CRITICAL DIMENSION AND...
- Publication number 20250125191
- Publication date Apr 17, 2025
- NANYA TECHNOLOGY CORPORATION
- KUO-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THICKENING LAYER AND METHOD FOR FABRICATI...
- Publication number 20250118664
- Publication date Apr 10, 2025
- NANYA TECHNOLOGY CORPORATION
- CHUN-HENG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250118594
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STANDARD-CELL LAYOUT STRUCTURE WITH HORN POWER AND SMART METAL CUT
- Publication number 20250118674
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ni-Wan Fan
- H01 - BASIC ELECTRIC ELEMENTS

Aspects relating to the layout of the pattern or to the size of vias or trenches

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Via configurable edge-combiner with duty cycle correction

Memory device and fabrication method thereof

Microelectronics package comprising a package-on-package (POP) arch...

Method for manufacturing semiconductor device

Skip level vias in metallization layers for integrated circuit devices

Method of fabricating semiconductor device including porous dielect...

Method for forming interconnect structure

Method for preparing fine metal lines with high aspect ratio

Semiconductor device and method for fabricating semiconductor device

Semiconductor memory device and method for manufacturing the same

Plug and trench architectures for integrated circuits and methods o...

Method of manufacturing semiconductor device

Interconnect structure

Semiconductor device and method of manufacture

Two-dimensional (2D) metal structure and method of forming the same

Memory device including staircase structure having conductive pads

Semiconductor device structure and method for preparing the same

Surface oxidation control of metal gates using capping layer

Semiconductor structure and manufacturing method thereof

Three-dimensional semiconductor device

Reworking process of a failed hard mask for fabricating a semicondu...

Skip level vias in metallization layers for integrated circuit devices

Film deposition apparatus for fine pattern forming

Through via structure

Integrated circuit and manufacturing method thereof

Semiconductor device with multi-carbon-concentration dielectrics

Multilayer interconnect structure and method for integrated circuits

Method of manufacturing semiconductor devices

Selective metal removal with flowable polymer

Semiconductor structure and method for forming the same

Patents Applicationslast 30 patents

MICROELECTRONIC DEVICES INCLUDING ACTIVE CONTACTS AND SUPPORT CONTACTS

Semiconductor layout pattern and semiconductor stack structure suit...

PACKAGE STRUCTURE WITH STACKED SEMICONDUCTOR DIES

LOW RESISTANCE VIA STRUCTURE

VIAS WITH SELECTED GRAIN DISTRIBUTION

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

CONDUCTIVE LINE STRUCTURES AND METHOD OF FORMING SAME

DEPOSITION PROCESS FOR PATTERNING EDGE PLACEMENT ERROR IMPROVEMENT

CUTTING STRUCTURE, SEMICONDUCTOR DEVICE COMPRISING THE SAME, AND ME...

CUTTING STRUCTURE, SEMICONDUCTOR DEVICE COMPRISING THE SAME, AND ME...

MEMORY DEVICES INCLUDING STADIUM STRUCTURES, AND RELATED ELECTRONIC...

METHODS FOR FORMING THROUGH-GLASS VIAS

GALLIUM INTRODUCTION FOR CAVITY SHAPING ENGINEERING FOR CMOS DEVICES

INTERCONNECTION STRUCTURE

DUAL METAL SILICIDE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRU...

INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING THE SAME

MEMORY DEVICE INCLUDING SUPPORT STRUCTURES

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

INTERCONNECTION STRUCTURE

METHODS AND FORMULATIONS FOR SACRIFICIAL BRACING, SURFACE PROTECTIO...

STRUCTURE AND METHOD TO IMPROVE FAV RIE PROCESS MARGIN AND ELECTROM...

PLASMA-DAMAGE-RESISTANT INTERCONNECT STRUCTURE AND METHODS FOR MANU...

CAPACITOR DEVICE AND MANUFACTURING METHOD THEREOF

SELF-ALIGNED VIA FORMATION USING SPACERS

EPITAXIAL SOURCE OR DRAIN STRUCTURES FOR ADVANCED INTEGRATED CIRCUI...

SEMICONDUCTOR DEVICE STRUCTURE WITH REDUCED CRITICAL DIMENSION AND...

SEMICONDUCTOR DEVICE STRUCTURE WITH REDUCED CRITICAL DIMENSION AND...

SEMICONDUCTOR DEVICE WITH THICKENING LAYER AND METHOD FOR FABRICATI...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

STANDARD-CELL LAYOUT STRUCTURE WITH HORN POWER AND SMART METAL CUT