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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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last 30 patents
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Patent Grant
Memory device
Patent number
12,369,292
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Yi-Hsin Nien
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Contact structures for reducing electrical shorts and methods of fo...
Patent number
12,368,097
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Company Limited
Tung-Jiun Wu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Diagonal vias in semiconductor structures
Patent number
12,368,106
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Shih-Wei Peng
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Partial barrier free vias for cobalt-based interconnects and method...
Patent number
12,362,281
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Tsung-Ling Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
MIM structure
Patent number
12,362,271
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chun huan Wei
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Contact structure for semiconductor device
Patent number
12,362,234
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Hsu-Kai Chang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of manufacturing semiconductor devices
Patent number
12,362,177
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Po-Han Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method for preventing line bending during metal fill process
Patent number
12,362,188
Issue date
Jul 15, 2025
Lam Research Corporation
Adam Jandl
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Wafer structure including probe marked test pads
Patent number
12,354,921
Issue date
Jul 8, 2025
Powerchip Semiconductor Manufacturing Corporation
Chun-Lin Lu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Integrated circuits (ICs) employing multi-pattern metallization to...
Patent number
12,354,952
Issue date
Jul 8, 2025
QUALCOMM Incorporated
Bed Raj Kandel
H01 - BASIC ELECTRIC ELEMENTS
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Via structures
Patent number
12,354,953
Issue date
Jul 8, 2025
Taiwan Semiconductor Manufacturing Company Limited
Jhon Jhy Liaw
H01 - BASIC ELECTRIC ELEMENTS
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Methods of etching metals in semiconductor devices
Patent number
12,354,881
Issue date
Jul 8, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Wei-Hao Liao
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Multilayer stacking wafer bonding structure and method of manufactu...
Patent number
12,354,870
Issue date
Jul 8, 2025
Powerchip Semiconductor Manufacturing Corporation
Shou-Zen Chang
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor devices and methods of manufacturing the same
Patent number
12,354,899
Issue date
Jul 8, 2025
Samsung Electronics Co., Ltd.
Taeyong Kwon
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device structure with a protection cap at an end port...
Patent number
12,347,722
Issue date
Jul 1, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Ting-Li Yang
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device
Patent number
12,347,723
Issue date
Jul 1, 2025
Kioxia Corporation
Yumiko Miyano
H01 - BASIC ELECTRIC ELEMENTS
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Microelectronics package comprising a package-on-package (PoP) arch...
Patent number
12,347,743
Issue date
Jul 1, 2025
Intel Corporation
Elizabeth Nofen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method and structure for cutting dense line patterns using self-ali...
Patent number
12,347,684
Issue date
Jul 1, 2025
Yangtze Memory Technologies Co., Ltd.
Lu Ming Fan
H01 - BASIC ELECTRIC ELEMENTS
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Three-dimensional memory stack structure with source line including...
Patent number
12,349,347
Issue date
Jul 1, 2025
Kioxia Corporation
Daigo Ichinose
H01 - BASIC ELECTRIC ELEMENTS
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Inter block for recessed contacts and methods forming same
Patent number
12,349,395
Issue date
Jul 1, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Te-Chih Hsiung
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device structure and method for preparing the same
Patent number
12,347,686
Issue date
Jul 1, 2025
NANYA TECHNOLOGY CORPORATION
Cheng-Hsiang Fan
H01 - BASIC ELECTRIC ELEMENTS
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Trench plug hardmask for advanced integrated circuit structure fabr...
Patent number
12,349,450
Issue date
Jul 1, 2025
Intel Corporation
Anthony St. Amour
H01 - BASIC ELECTRIC ELEMENTS
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Bottom-up fill dielectric materials for semiconductor structure fab...
Patent number
12,341,061
Issue date
Jun 24, 2025
Intel Corporation
Florian Gstrein
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Planar slab vias for integrated circuit interconnects
Patent number
12,341,092
Issue date
Jun 24, 2025
Intel Corporation
Elijah Karpov
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method for manufacturing through vias using amorphization to adjust...
Patent number
12,341,060
Issue date
Jun 24, 2025
Taiwan Semiconductor Manufacturing Company Ltd.
Ching Kang Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and method of forming patterns for a semicondu...
Patent number
12,341,095
Issue date
Jun 24, 2025
SK hynix Inc.
Dae Sung Eom
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of patterning underlying structure
Patent number
12,341,007
Issue date
Jun 24, 2025
Powerchip Semiconductor Manufacturing Corporation
Yun-An Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor structure and manufacturing method thereof
Patent number
12,334,440
Issue date
Jun 17, 2025
CHANGXIN MEMORY TECHNOLOGIES, INC.
Yongxiang Li
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Multi-height interconnect trenches for resistance and capacitance o...
Patent number
12,334,392
Issue date
Jun 17, 2025
Kevin Lai Lin
H01 - BASIC ELECTRIC ELEMENTS
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Method for fabricating semiconductor device
Patent number
12,327,758
Issue date
Jun 10, 2025
SK Hynix Inc.
Nam Yeal Lee
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Semiconductor structure with a deep trench capacitor structures and...
Publication number
20250240985
Publication date
Jul 24, 2025
UNITED MICROELECTRONICS CORP.
Yi-Fan Li
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Through Via Power Delivery Structure for Stacked Chips
Publication number
20250233054
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Chieh CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20250233071
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing company Ltd.
CHI-TA LU
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
CALABASH-SHAPED MIM CAPACITOR STRUCTURE AND FABRICATING METHOD OF T...
Publication number
20250234569
Publication date
Jul 17, 2025
UNITED MICROELECTRONICS CORP.
Yao-Hsien Chung
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
THREE-DIMENTIONAL SEMICONDUCTOR DEVICE
Publication number
20250233065
Publication date
Jul 17, 2025
SK HYNIX INC.
Sung Lae OH
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20250233084
Publication date
Jul 17, 2025
KIOXIA Corporation
Kyosuke NANAMI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
FILM DEPOSITION APPARATUS FOR FINE PATTERN FORMING
Publication number
20250226177
Publication date
Jul 10, 2025
TOKYO ELECTRON LIMITED
Kazuhide HASEBE
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Application
INTERCONNECT LINES WITH LINE WIDTH PROFILE
Publication number
20250226313
Publication date
Jul 10, 2025
International Business Machines Corporation
James P. Mazza
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT VIA WITH INDUCED ASYMMETRIC PROFILE
Publication number
20250218931
Publication date
Jul 3, 2025
Intel Corporation
Angelo W. Kandas
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
VIA REVEAL PROCESSING AND STRUCTURES
Publication number
20250218903
Publication date
Jul 3, 2025
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF
Publication number
20250221049
Publication date
Jul 3, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Xin-Yong WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH CATALYTIC CONDUCTIVE LAYER AND METHOD FOR...
Publication number
20250218791
Publication date
Jul 3, 2025
NANYA TECHNOLOGY CORPORATION
WEI-YU CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ORTHOGONAL METAL LINES AT THE SAME METAL LEVEL
Publication number
20250218863
Publication date
Jul 3, 2025
International Business Machines Corporation
Nicholas Anthony Lanzillo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20250210523
Publication date
Jun 26, 2025
Samsung Electronics Co., Ltd.
Jongsoon Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING BACK END OF LINE VIA TO METAL LINE MARG...
Publication number
20250210513
Publication date
Jun 26, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Yi-Chun HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES
Publication number
20250201576
Publication date
Jun 19, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Ru-Gun LIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH L-SHAPE CONDUCTIVE FEATURE AND METHODS OF...
Publication number
20250204020
Publication date
Jun 19, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Cheng-Chi Chuang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FRONTSIDE-TO-BACKSIDE CONNECTION WITH CUT FOR STACKED TRANSISTOR
Publication number
20250203974
Publication date
Jun 19, 2025
International Business Machines Corporation
Nicholas Anthony Lanzillo
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...
Publication number
20250194201
Publication date
Jun 12, 2025
Intel Corporation
Subhash M. JOSHI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
RECONFIGURABLE PACKAGE INTEGRATED ELECTRO MAGNETIC INTERFERENCE SHI...
Publication number
20250192068
Publication date
Jun 12, 2025
Applied Materials, Inc.
Ghaleb Saleh Ghaleb Al-Duhni
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
FULLY SELF-ALIGNED VIAS USING A HARDMASK AND ANTISPACERS
Publication number
20250191970
Publication date
Jun 12, 2025
TOKYO ELECTRON LIMITED
David Power
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
MICROELECTRONIC DEVICES WITH A POLYSILICON STRUCTURE ABOVE A STAIRC...
Publication number
20250183196
Publication date
Jun 5, 2025
Lodestar Licensing Group LLC
Jivaan Kishore Jhothiraman
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
MICROELECTRONIC DEVICES INCLUDING ACTIVE CONTACTS AND SUPPORT CONTACTS
Publication number
20250174558
Publication date
May 29, 2025
Micron Technology, Inc.
S M Istiaque Hossain
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Semiconductor layout pattern and semiconductor stack structure suit...
Publication number
20250174491
Publication date
May 29, 2025
UNITED MICROELECTRONICS CORP.
Wei Lun Oo
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
PACKAGE STRUCTURE WITH STACKED SEMICONDUCTOR DIES
Publication number
20250174578
Publication date
May 29, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Yi-Chao Mao
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
LOW RESISTANCE VIA STRUCTURE
Publication number
20250167103
Publication date
May 22, 2025
International Business Machines Corporation
Oscar van der Straten
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
VIAS WITH SELECTED GRAIN DISTRIBUTION
Publication number
20250167046
Publication date
May 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chia-Pang Kuo
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
Publication number
20250167111
Publication date
May 22, 2025
Samsung Electronics Co., Ltd.
Jisoo OH
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
CONDUCTIVE LINE STRUCTURES AND METHOD OF FORMING SAME
Publication number
20250167120
Publication date
May 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Hiranmay BISWAS
G06 - COMPUTING CALCULATING COUNTING
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Patent Application
DEPOSITION PROCESS FOR PATTERNING EDGE PLACEMENT ERROR IMPROVEMENT
Publication number
20250166994
Publication date
May 22, 2025
Applied Materials, Inc.
Zhiyu HUANG
H01 - BASIC ELECTRIC ELEMENTS