Aspects relating to the layout of the pattern or to the size of vias or trenches

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H01L21/76816

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76816Aspects relating to the layout of the pattern or to the size of vias or trenches

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Three-dimensional semiconductor device
- Patent number 12,183,677
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with ring-like structure
- Patent number 12,183,709
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor structure
- Patent number 12,176,344
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device including support structures
- Patent number 12,176,300
- Issue date Dec 24, 2024
- Micron Technology, Inc.
- Andrew Zhe Wei Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact features and methods of fabricating the same in Fin field-e...
- Patent number 12,170,245
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer film device and method
- Patent number 12,166,128
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical memory devices
- Patent number 12,167,605
- Issue date Dec 10, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zhong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing conductive lines in a circuit
- Patent number 12,165,972
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hui Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Three-dimensional semiconductor device including a through-via stru...
- Patent number 12,165,976
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Junhyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,159,839
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite word line structure and method...
- Patent number 12,160,988
- Issue date Dec 3, 2024
- NANYA TECHNOLOGY CORPORATION
- Chun-Chi Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with damascene structur...
- Patent number 12,159,790
- Issue date Dec 3, 2024
- NANYA TECHNOLOGY CORPORATION
- Wei-Chen Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices including different tier pitches, and related electr...
- Patent number 12,160,993
- Issue date Dec 3, 2024
- Yifen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure and manufacturing method thereof
- Patent number 12,154,852
- Issue date Nov 26, 2024
- United Microelectronics Corp.
- Min-Shiang Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing via structures on source/drain contacts
- Patent number 12,154,856
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Chiang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method and plasma processing apparatus
- Patent number 12,154,790
- Issue date Nov 26, 2024
- Tokyo Electron Limited
- Seiichi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tiered-profile contact for semiconductor
- Patent number 12,148,663
- Issue date Nov 19, 2024
- International Business Machines Corporation
- Kisik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including a trench having a high aspect rat...
- Patent number 12,148,654
- Issue date Nov 19, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yong Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,148,657
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming large chips through stitching
- Patent number 12,148,719
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming stairs in three-dimensional memory devices
- Patent number 12,148,655
- Issue date Nov 19, 2024
- Yangtze Memory Technologies Co., Ltd.
- Xiangning Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,142,560
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with damascene structur...
- Patent number 12,142,518
- Issue date Nov 12, 2024
- NANYA TECHNOLOGY CORPORATION
- Wei-Chen Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligning spacer tight pitch via
- Patent number 12,142,525
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact over active gate structures for advanced integrated circuit...
- Patent number 12,142,667
- Issue date Nov 12, 2024
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staircase structure for memory device
- Patent number 12,137,558
- Issue date Nov 5, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and method of manufacturing the same
- Patent number 12,136,594
- Issue date Nov 5, 2024
- Kioxia Corporation
- Shota Niihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming recesses in source/drain regions and devices fo...
- Patent number 12,132,089
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,131,986
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tuan-Yu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor package
- Patent number 12,132,021
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMAL BUDGET ENHANCED BURIED POWER RAIL AND METHOD OF MANUFACTURI...
- Publication number 20240429169
- Publication date Dec 26, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- Saehan PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT LEVELS WITH MULTIPLE LINE TYPES
- Publication number 20240421079
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240413010
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen Ju Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER LAYERS FOR WORD LINE CONTACTS IN A THREE-DIMENSIONAL NAND M...
- Publication number 20240413009
- Publication date Dec 12, 2024
- Yangtze Memory Technologies Co., Ltd.
- Ling XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZATION LINES ON INTEGRATED CIRCUIT PRODUCTS
- Publication number 20240413082
- Publication date Dec 12, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20240413012
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240395721
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240395701
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CONNECTING STRUCTURE HAVING A DOPED LAYER...
- Publication number 20240395606
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for FinFET Device with Asymmetric Contact
- Publication number 20240395935
- Publication date Nov 28, 2024
- Parabellum Strategic Opportunities Fund LLC
- Jhon Jhy LIAW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER FILM DEVICE AND METHOD
- Publication number 20240395939
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF
- Publication number 20240387372
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Chih Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM STACK SIMPLIFICATION FOR HIGH ASPECT RATIO PATTERNING AND VERT...
- Publication number 20240387258
- Publication date Nov 21, 2024
- LAM RESEARCH CORPORATION
- Hui-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE OXIDATION CONTROL OF METAL GATES USING CAPPING LAYER
- Publication number 20240387179
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pei-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240387248
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240387254
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED COPPER INTERCONNECTS WITH HYBRID MICROSTRUCTURE
- Publication number 20240387264
- Publication date Nov 21, 2024
- Adeia Semiconductor Solutions LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240379852
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lin-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379519
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tuan-Yu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE FOR FIN-LIKE FIELD EFFECT TRANSISTOR
- Publication number 20240379460
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Jhon Jhy Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL MIM STRUCTURE
- Publication number 20240379532
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-huan WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT FORMATION METHOD AND RELATED STRUCTURE
- Publication number 20240379432
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Che LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GUARD RING AND MANUFACTURING METHOD THEREOF
- Publication number 20240379586
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240379431
- Publication date Nov 14, 2024
- Parabellum Strategic Opportunities Fund LLC
- Chia-Hao CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Via Structures
- Publication number 20240379546
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhon Jhy Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
- Publication number 20240379535
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240371686
- Publication date Nov 7, 2024
- NANYA TECHNOLOGY CORPORATION
- MIN-CHUNG CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA-FIRST PROCESS FOR CONNECTING A CONTACT AND A GATE ELECTRODE
- Publication number 20240371687
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE FABRICATING METHOD
- Publication number 20240371784
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- Ji Soo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING VERTICAL ROUTING STRUCTURE AND METHO...
- Publication number 20240371861
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih WEN
- H01 - BASIC ELECTRIC ELEMENTS

Aspects relating to the layout of the pattern or to the size of vias or trenches

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Three-dimensional semiconductor device

Chip package structure with ring-like structure

Methods of forming semiconductor structure

Memory device including support structures

Contact features and methods of fabricating the same in Fin field-e...

Multi-layer film device and method

Vertical memory devices

Method of manufacturing conductive lines in a circuit

Three-dimensional semiconductor device including a through-via stru...

Semiconductor packages

Semiconductor device with composite word line structure and method...

Method for fabricating semiconductor device with damascene structur...

Memory devices including different tier pitches, and related electr...

Interconnection structure and manufacturing method thereof

Methods of manufacturing via structures on source/drain contacts

Etching method and plasma processing apparatus

Tiered-profile contact for semiconductor

Semiconductor structure including a trench having a high aspect rat...

Semiconductor structure and method for forming the same

Forming large chips through stitching

Methods for forming stairs in three-dimensional memory devices

Semiconductor packages and methods of forming same

Method for fabricating semiconductor device with damascene structur...

Self-aligning spacer tight pitch via

Contact over active gate structures for advanced integrated circuit...

Staircase structure for memory device

Semiconductor memory device and method of manufacturing the same

Methods for forming recesses in source/drain regions and devices fo...

Semiconductor package and manufacturing method thereof

Method for fabricating semiconductor package

Patents Applicationslast 30 patents

THERMAL BUDGET ENHANCED BURIED POWER RAIL AND METHOD OF MANUFACTURI...

INTERCONNECT LEVELS WITH MULTIPLE LINE TYPES

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

BARRIER LAYERS FOR WORD LINE CONTACTS IN A THREE-DIMENSIONAL NAND M...

METALLIZATION LINES ON INTEGRATED CIRCUIT PRODUCTS

Semiconductor Device and Method

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH CONNECTING STRUCTURE HAVING A DOPED LAYER...

Structure and Method for FinFET Device with Asymmetric Contact

MULTI-LAYER FILM DEVICE AND METHOD

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF

FILM STACK SIMPLIFICATION FOR HIGH ASPECT RATIO PATTERNING AND VERT...

SURFACE OXIDATION CONTROL OF METAL GATES USING CAPPING LAYER

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

ADVANCED COPPER INTERCONNECTS WITH HYBRID MICROSTRUCTURE

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

INTERCONNECT STRUCTURE FOR FIN-LIKE FIELD EFFECT TRANSISTOR

NOVEL MIM STRUCTURE

CONTACT FORMATION METHOD AND RELATED STRUCTURE

GUARD RING AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

Via Structures

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

VIA-FIRST PROCESS FOR CONNECTING A CONTACT AND A GATE ELECTRODE

SEMICONDUCTOR DEVICE FABRICATING METHOD

SEMICONDUCTOR DEVICE INCLUDING VERTICAL ROUTING STRUCTURE AND METHO...