Aspects relating to the layout of the pattern or to the size of vias or trenches

Industry

CPC
H01L21/76816

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76816Aspects relating to the layout of the pattern or to the size of vias or trenches

Industries

Patents Grantslast 30 patents

Information Patent Grant
Methods for fabricating microelectronic devices with contacts to co...
- Patent number 11,967,556
- Issue date Apr 23, 2024
- Biow Hiem Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inter block for recessed contacts and methods forming same
- Patent number 11,967,622
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source/drain contact having a protruding segment
- Patent number 11,968,817
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jui-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective tungsten deposition at low temperatures
- Patent number 11,967,525
- Issue date Apr 23, 2024
- Applied Materials, Inc.
- Yi Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuitry, memory circuitry comprising strings of memory...
- Patent number 11,961,801
- Issue date Apr 16, 2024
- Micron Technology, Inc.
- Lifang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staircase formation in three-dimensional memory device
- Patent number 11,961,760
- Issue date Apr 16, 2024
- Yangtze Memory Technologies Co., Ltd.
- Yu Ting Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual metal silicide structures for advanced integrated circuit stru...
- Patent number 11,961,767
- Issue date Apr 16, 2024
- Intel Corporation
- Jeffrey S. Leib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including through-electrodes
- Patent number 11,961,788
- Issue date Apr 16, 2024
- Samsung Electronics Co., Ltd.
- Hyoukyung Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual metal gate structure having portions of metal gate layers in c...
- Patent number 11,955,532
- Issue date Apr 9, 2024
- Intel Corporation
- Jeffrey S. Leib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,955,383
- Issue date Apr 9, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jie Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for bonding elements including conductive interface feat...
- Patent number 11,955,393
- Issue date Apr 9, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous metal line compositions for advanced integrated circu...
- Patent number 11,955,534
- Issue date Apr 9, 2024
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-stage bake photoresist with releasable quencher
- Patent number 11,955,343
- Issue date Apr 9, 2024
- Intel Corporation
- Robert L. Bristol
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Package-integrated multi-turn coil embedded in a package magnetic core
- Patent number 11,955,426
- Issue date Apr 9, 2024
- Intel Corporation
- Huong Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device and manufacturing method thereof
- Patent number 11,955,429
- Issue date Apr 9, 2024
- SK hynix Inc.
- Chan Ho Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Differential hardmasks for modulation of electrobucket sensitivity
- Patent number 11,955,377
- Issue date Apr 9, 2024
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition of barrier layer
- Patent number 11,948,834
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for forming dual metal interconnects
- Patent number 11,948,885
- Issue date Apr 2, 2024
- Applied Materials, Inc.
- Suketu A Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench contact structures for advanced integrated circuit structure...
- Patent number 11,948,997
- Issue date Apr 2, 2024
- Intel Corporation
- Subhash M. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device with p-contact and doped insulation bloc...
- Patent number 11,949,006
- Issue date Apr 2, 2024
- Infineon Technologies Dresden GmbH & Co. KG
- Markus Beninger-Bina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 11,948,889
- Issue date Apr 2, 2024
- Kioxia Corporation
- Go Oike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including recessed interconnect structure
- Patent number 11,942,420
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Guo-Huei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming power grid structures
- Patent number 11,935,833
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hiranmay Biswas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit and manufacturing method thereof
- Patent number 11,929,361
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xin-Yong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of high-density pattern forming
- Patent number 11,929,255
- Issue date Mar 12, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chen En Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory and method of manufacturing the semiconductor...
- Patent number 11,929,292
- Issue date Mar 12, 2024
- Kioxia Corporation
- Naoki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor structure and semiconductor stru...
- Patent number 11,929,282
- Issue date Mar 12, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Zhaopei Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming via structure having low interface resistance
- Patent number 11,929,321
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,923,301
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shih-Wei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via CD controllable top via structure
- Patent number 11,923,246
- Issue date Mar 5, 2024
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...
- Publication number 20240128152
- Publication date Apr 18, 2024
- Intel Corporation
- Elizabeth NOFEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH RING-LIKE STRUCTURE
- Publication number 20240120313
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yao YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING HIGH ASPECT RATIO FEATURES
- Publication number 20240120237
- Publication date Apr 11, 2024
- Lodestar Licensing Group LLC
- Ken Tokashiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES OF THREE-DIMENSIONAL MEMORY DEVICES
- Publication number 20240114687
- Publication date Apr 4, 2024
- Yangtze Memory Technologies Co., Ltd.
- Kun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL FILL STRUCTURES FOR ISOLATORS TO MEET METAL DENSITY AND HIGH...
- Publication number 20240112953
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALLY WIDENED PROFILE FOR NANOSCALE WIRING STRUCTURE
- Publication number 20240113018
- Publication date Apr 4, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES WITH STACKED INTERCONNECTS
- Publication number 20240113013
- Publication date Apr 4, 2024
- International Business Machines Corporation
- Huai Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH INCREASED DECOUPLING CAPACITANCE
- Publication number 20240105583
- Publication date Mar 28, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240105507
- Publication date Mar 28, 2024
- SK HYNIX INC.
- Nam Jae LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH PLUG HARDMASK FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABR...
- Publication number 20240105520
- Publication date Mar 28, 2024
- Intel Corporation
- Anthony ST. AMOUR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCAL LINE EXTENSION FOR ENLARGED VIA-TO-LINE CONTACT AREA
- Publication number 20240105506
- Publication date Mar 28, 2024
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFERENTIATED CONDUCTIVE LINES FOR ADVANCED INTEGRATED CIRCUIT STR...
- Publication number 20240105598
- Publication date Mar 28, 2024
- Intel Corporation
- Leonard P. GULER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR DEVICE
- Publication number 20240105604
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Sung-Hun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20240096796
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Yongjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TUNGSTEN CONTACT PLUGS ABOVE GATE AND SOURCE/DRAIN CONTACTS
- Publication number 20240096698
- Publication date Mar 21, 2024
- QUALCOMM Incorporated
- Junjing BAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) DEVICE WITH HYBRID METAL LAYER
- Publication number 20240096785
- Publication date Mar 21, 2024
- Intel Corporation
- June Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN INDIVIDUALIZATION ZONE OF AN INTEGRATED CIR...
- Publication number 20240096668
- Publication date Mar 21, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Stefan LANDIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM DEPOSITION APPARATUS FOR FINE PATTERN FORMING
- Publication number 20240096595
- Publication date Mar 21, 2024
- TOKYO ELECTRON LIMITED
- Kazuhide HASEBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF ALIGNED PATTERN FORMATION POST SPACER ETCHBACK IN TIGHT PITCH...
- Publication number 20240096627
- Publication date Mar 21, 2024
- TESSERA LLC
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REVERSE EMBEDDED POWER STRUCTURE FOR GRAPHICAL PROCESSING UNIT CHIP...
- Publication number 20240096802
- Publication date Mar 21, 2024
- NVIDIA Corporation
- Shawn Xiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID DAMASCENE INTERCONNECT STRUCTURE FOR SIGNAL AND POWER VIA CO...
- Publication number 20240096692
- Publication date Mar 21, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED...
- Publication number 20240088031
- Publication date Mar 14, 2024
- Micron Technology, Inc.
- Lifang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20240088090
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ling-Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR PREPARING THE SAME
- Publication number 20240087895
- Publication date Mar 14, 2024
- NANYA TECHNOLOGY CORPORATION
- Cheng-Hsiang FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays and Methods Used in Forming a Memory Array Comprising...
- Publication number 20240081067
- Publication date Mar 7, 2024
- Micron Technology, Inc.
- Lifang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING CONTACT STRUCTURES, AND RELATED M...
- Publication number 20240079322
- Publication date Mar 7, 2024
- Micron Technology, Inc.
- Darwin A. Clampitt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF THE SEMICON...
- Publication number 20240081066
- Publication date Mar 7, 2024
- SK HYNIX INC.
- Kang Sik CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRCASE FORMATION IN A MEMORY ARRAY
- Publication number 20240071816
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Alyssa N. Scarbrough
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR DEVICE
- Publication number 20240071910
- Publication date Feb 29, 2024
- Sk hynix Inc.
- Sung Lae OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...
- Publication number 20240071919
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Mohad Baboli
- H01 - BASIC ELECTRIC ELEMENTS

Aspects relating to the layout of the pattern or to the size of vias or trenches

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods for fabricating microelectronic devices with contacts to co...

Inter block for recessed contacts and methods forming same

Source/drain contact having a protruding segment

Selective tungsten deposition at low temperatures

Integrated circuitry, memory circuitry comprising strings of memory...

Staircase formation in three-dimensional memory device

Dual metal silicide structures for advanced integrated circuit stru...

Semiconductor device including through-electrodes

Dual metal gate structure having portions of metal gate layers in c...

Semiconductor device and manufacturing method thereof

Structures for bonding elements including conductive interface feat...

Heterogeneous metal line compositions for advanced integrated circu...

Two-stage bake photoresist with releasable quencher

Package-integrated multi-turn coil embedded in a package magnetic core

Three-dimensional memory device and manufacturing method thereof

Differential hardmasks for modulation of electrobucket sensitivity

Selective deposition of barrier layer

Methods and apparatus for forming dual metal interconnects

Trench contact structures for advanced integrated circuit structure...

Power semiconductor device with p-contact and doped insulation bloc...

Semiconductor memory device

Semiconductor device including recessed interconnect structure

Method of forming power grid structures

Integrated circuit and manufacturing method thereof

Method of high-density pattern forming

Semiconductor memory and method of manufacturing the semiconductor...

Method for preparing semiconductor structure and semiconductor stru...

Method for forming via structure having low interface resistance

Method of manufacturing semiconductor device

Via CD controllable top via structure

Patents Applicationslast 30 patents

MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...

CHIP PACKAGE STRUCTURE WITH RING-LIKE STRUCTURE

MICROELECTRONIC DEVICES INCLUDING HIGH ASPECT RATIO FEATURES

INTERCONNECT STRUCTURES OF THREE-DIMENSIONAL MEMORY DEVICES

METAL FILL STRUCTURES FOR ISOLATORS TO MEET METAL DENSITY AND HIGH...

LOCALLY WIDENED PROFILE FOR NANOSCALE WIRING STRUCTURE

SEMICONDUCTOR STRUCTURES WITH STACKED INTERCONNECTS

INTERCONNECT STRUCTURE WITH INCREASED DECOUPLING CAPACITANCE

SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

TRENCH PLUG HARDMASK FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABR...

LOCAL LINE EXTENSION FOR ENLARGED VIA-TO-LINE CONTACT AREA

DIFFERENTIATED CONDUCTIVE LINES FOR ADVANCED INTEGRATED CIRCUIT STR...

THREE-DIMENSIONAL SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT DEVICE

SELECTIVE TUNGSTEN CONTACT PLUGS ABOVE GATE AND SOURCE/DRAIN CONTACTS

INTEGRATED CIRCUIT (IC) DEVICE WITH HYBRID METAL LAYER

METHOD FOR PRODUCING AN INDIVIDUALIZATION ZONE OF AN INTEGRATED CIR...

FILM DEPOSITION APPARATUS FOR FINE PATTERN FORMING

SELF ALIGNED PATTERN FORMATION POST SPACER ETCHBACK IN TIGHT PITCH...

REVERSE EMBEDDED POWER STRUCTURE FOR GRAPHICAL PROCESSING UNIT CHIP...

HYBRID DAMASCENE INTERCONNECT STRUCTURE FOR SIGNAL AND POWER VIA CO...

MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED...

CHIP PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR PREPARING THE SAME

Memory Arrays and Methods Used in Forming a Memory Array Comprising...

MICROELECTRONIC DEVICES INCLUDING CONTACT STRUCTURES, AND RELATED M...

SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF THE SEMICON...

STAIRCASE FORMATION IN A MEMORY ARRAY

THREE-DIMENSIONAL SEMICONDUCTOR DEVICE

METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...