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H01L27/1469

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/1469Assemblies

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Package with integrated optical die and method forming same
- Patent number 12,228,776
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device
- Patent number 12,230,660
- Issue date Feb 18, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Hirofumi Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an image sensor having stress releasing structure
- Patent number 12,224,297
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device
- Patent number 12,218,173
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device and electronic device
- Patent number 12,218,167
- Issue date Feb 4, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Kentaro Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-noise image sensor having stacked semiconductor substrates
- Patent number 12,218,171
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Seiji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor and electronic camera
- Patent number 12,211,878
- Issue date Jan 28, 2025
- Nikon Corporation
- Osamu Saruwatari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing process for semiconductor optical device for lidar se...
- Patent number 12,199,132
- Issue date Jan 14, 2025
- AURORA OPERATIONS, INC.
- Lei Wang
- G01 - MEASURING TESTING
Information Patent Grant
Solid-state imaging device with increased bonding strength, and met...
- Patent number 12,199,121
- Issue date Jan 14, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yukihiro Ando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a structure for higher integration
- Patent number 12,199,123
- Issue date Jan 14, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yoshiya Hagimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-side illuminated image sensor
- Patent number 12,199,131
- Issue date Jan 14, 2025
- STMicroelectronics (Crolles 2) SAS
- Laurent Gay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging unit, method for manufacturing the same, and electronic app...
- Patent number 12,191,337
- Issue date Jan 7, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Kenya Nishio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photodetector with reduced dark current sensitivity and methods of...
- Patent number 12,191,328
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yeh-Hsun Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel circuit configured with global shutter ensuring sufficient sa...
- Patent number 12,177,590
- Issue date Dec 24, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yoshiaki Tashiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation-enhanced image sensor and surface-passivation method
- Patent number 12,176,364
- Issue date Dec 24, 2024
- OmniVision Technologies, Inc.
- Shiyu Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light receiving element, ranging module, and electronic apparatus
- Patent number 12,176,373
- Issue date Dec 24, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yoshiki Ebiko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate, semiconductor apparatus, equipment, circuit subs...
- Patent number 12,167,156
- Issue date Dec 10, 2024
- Canon Kabushiki Kaisha
- Hideo Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same, and elec...
- Patent number 12,166,061
- Issue date Dec 10, 2024
- Sony Group Corporation
- Taku Umebayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image pickup device and electronic apparatus
- Patent number 12,166,060
- Issue date Dec 10, 2024
- Sony Group Corporation
- Shinji Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic device having an array of germanium-based diodes wit...
- Patent number 12,166,063
- Issue date Dec 10, 2024
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Jean-Louis Ouvrier-Buffet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiation imaging apparatus and manufacturing method of same
- Patent number 12,158,551
- Issue date Dec 3, 2024
- Canon Kabushiki Kaisha
- Masato Ofuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element
- Patent number 12,154,929
- Issue date Nov 26, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Daisuke Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor and electronic apparatus
- Patent number 12,148,787
- Issue date Nov 19, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yoshihiko Nagahama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating nanoscale structures usable in molecular sen...
- Patent number 12,146,852
- Issue date Nov 19, 2024
- Sungho Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoelectric conversion apparatus and manufacturing method therefor
- Patent number 12,148,848
- Issue date Nov 19, 2024
- Canon Kabushiki Kaisha
- Masashi Kusukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Member for solid-state image pickup device and method for manufactu...
- Patent number 12,142,629
- Issue date Nov 12, 2024
- Canon Kabushiki Kaisha
- Nobuyuki Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation scheme for image sensor substrate
- Patent number 12,136,642
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Yun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detection substrate and flat panel detector
- Patent number 12,125,859
- Issue date Oct 22, 2024
- BEIJING BOE SENSOR TECHNOLOGY CO., LTD.
- Xiangmi Zhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite substrate for fabricating III-V photodetector arrays
- Patent number 12,119,367
- Issue date Oct 15, 2024
- University of Southern California
- Rehan Rashid Kapadia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid state imaging device, solid state imaging device manufacturin...
- Patent number 12,119,366
- Issue date Oct 15, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Naoki Komai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MEMBER FOR SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTU...
- Publication number 20250063832
- Publication date Feb 20, 2025
- Canon Kabushiki Kaisha
- Nobuyuki Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING NANOSCALE STRUCTURES USABLE IN MOLECULAR SEN...
- Publication number 20250060331
- Publication date Feb 20, 2025
- Roswell Biotechnologies, Inc.
- Sungho Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC STRUCTURE AND METHODS OF MANUFACTURING
- Publication number 20250056905
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Yu LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC STRUCTURE AND METHODS OF MANUFACTURING
- Publication number 20250056906
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Yu LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURABLE RESIN COMPOSITION, CURED FILM, LAMINATE, IMAGING DEVICE, SE...
- Publication number 20250051573
- Publication date Feb 13, 2025
- Sekisui Chemical Co., Ltd
- Hayate NOMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR FOR SENSING VISIBLE AND INFRARED IMAGES, AND METHOD FOR PROD...
- Publication number 20250048755
- Publication date Feb 6, 2025
- Commissariat a I'Energie Atomique et aux Energies Alternatives
- Sébastien Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTO DETECTION SUBSTRATE, IMAGE SENSOR, AND ELECTRONIC APPARATUS
- Publication number 20250048756
- Publication date Feb 6, 2025
- BOE TECHNOLOGY GROUP CO., LTD.
- Rui HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND ELECTRONIC APPARATUS
- Publication number 20250040287
- Publication date Jan 30, 2025
- Sony Semiconductor Solutions Corporation
- YOSHIHIKO NAGAHAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC DEVICE INCLUDING A VERTICAL-CAVITY SURFACE EMITTING...
- Publication number 20250038470
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- ChunHao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIATION DETECTORS HAVING SULFIDE-CONTAINING ANODE CONTACTS AND ME...
- Publication number 20250035798
- Publication date Jan 30, 2025
- REDLEN TECHNOLOGIES, INC.
- Thomas TIEDJE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, SOLID-STATE IMAGING DEVICE, AND ELECTRONIC EQUI...
- Publication number 20250031475
- Publication date Jan 23, 2025
- Sony Semiconductor Solutions Corporation
- HITOSHI OKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOELECTRIC SENSOR AND SUBSTRATE
- Publication number 20250031465
- Publication date Jan 23, 2025
- BOE TECHNOLOGY GROUP CO., LTD.
- Pengfei GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING OPTICAL SEMI...
- Publication number 20250022901
- Publication date Jan 16, 2025
- Hamamatsu Photonics K.K.
- Nao INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROTECTING ACTIVE LAYERS OF ELECTRONIC CHIPS
- Publication number 20250014912
- Publication date Jan 9, 2025
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Emilie BOURJOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, APPARATUS, AND MANUFACTURING METHOD OF SEMICO...
- Publication number 20250015116
- Publication date Jan 9, 2025
- Sony Semiconductor Solutions Corporation
- TAKUSHI SHIGETOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSING MODULE MANUFACTURING METHOD
- Publication number 20250006756
- Publication date Jan 2, 2025
- Medimaging Integrated Solution, Inc.
- SHANGYI WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacking Single-Photon Avalanche Diodes and High Voltage Devices
- Publication number 20250006766
- Publication date Jan 2, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jeffrey Peter GAMBINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALENS FOR NEAR INFRARED PHOTODETECTOR
- Publication number 20240429257
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Hsuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-WAY OPTICAL SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME
- Publication number 20240421172
- Publication date Dec 19, 2024
- STATS ChipPAC Pte Ltd.
- BumRyul MAENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20240413187
- Publication date Dec 12, 2024
- Sony Semiconductor Solutions Corporation
- Chihiro ARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING APPARATUS AND METHOD FOR MANUFACTURING THE SOLI...
- Publication number 20240405044
- Publication date Dec 5, 2024
- Canon Kabushiki Kaisha
- Masahiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY SUBSTRATE, DISPLAY PANEL, AND ELECTRONIC DEVICE
- Publication number 20240405033
- Publication date Dec 5, 2024
- Wuhan China Star Optoelectronics Technology Co., Ltd.
- Fei Ai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME
- Publication number 20240405049
- Publication date Dec 5, 2024
- STATS ChipPAC Pte Ltd.
- BumRyul MAENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY...
- Publication number 20240405036
- Publication date Dec 5, 2024
- SAMSUNG DISPLAY CO., LTD.
- Ki June LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR IMAGE SENSOR AND METHOD FOR FORMING THE SAME
- Publication number 20240387587
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JHY-JYI SZE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGE PICKUP DEVICE
- Publication number 20240387592
- Publication date Nov 21, 2024
- Canon Kabushiki Kaisha
- Mineo Shimotsusa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR WITH DIFFUSION BARRIER STRUCTURE
- Publication number 20240379692
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH INTEGRATED OPTICAL DIE AND METHOD FORMING SAME
- Publication number 20240377595
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND METHOD OF FABRICATING THE SAME
- Publication number 20240379717
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Kook Tae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK-SIDE DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR
- Publication number 20240379713
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package with integrated optical die and method forming same

Imaging device

Method of forming an image sensor having stress releasing structure

Image sensor device

Solid-state imaging device and electronic device

Low-noise image sensor having stacked semiconductor substrates

Image sensor and electronic camera

Manufacturing process for semiconductor optical device for lidar se...

Solid-state imaging device with increased bonding strength, and met...

Semiconductor device including a structure for higher integration

Back-side illuminated image sensor

Imaging unit, method for manufacturing the same, and electronic app...

Photodetector with reduced dark current sensitivity and methods of...

Pixel circuit configured with global shutter ensuring sufficient sa...

Passivation-enhanced image sensor and surface-passivation method

Light receiving element, ranging module, and electronic apparatus

Circuit substrate, semiconductor apparatus, equipment, circuit subs...

Semiconductor device and method of manufacturing the same, and elec...

Image pickup device and electronic apparatus

Optoelectronic device having an array of germanium-based diodes wit...

Radiation imaging apparatus and manufacturing method of same

Semiconductor element

Image sensor and electronic apparatus

Methods of fabricating nanoscale structures usable in molecular sen...

Photoelectric conversion apparatus and manufacturing method therefor

Member for solid-state image pickup device and method for manufactu...

Passivation scheme for image sensor substrate

Detection substrate and flat panel detector

Composite substrate for fabricating III-V photodetector arrays

Solid state imaging device, solid state imaging device manufacturin...

Patents Applicationslast 30 patents

MEMBER FOR SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTU...

METHODS OF FABRICATING NANOSCALE STRUCTURES USABLE IN MOLECULAR SEN...

PHOTONIC STRUCTURE AND METHODS OF MANUFACTURING

PHOTONIC STRUCTURE AND METHODS OF MANUFACTURING

CURABLE RESIN COMPOSITION, CURED FILM, LAMINATE, IMAGING DEVICE, SE...

SENSOR FOR SENSING VISIBLE AND INFRARED IMAGES, AND METHOD FOR PROD...

PHOTO DETECTION SUBSTRATE, IMAGE SENSOR, AND ELECTRONIC APPARATUS

IMAGE SENSOR AND ELECTRONIC APPARATUS

OPTOELECTRONIC DEVICE INCLUDING A VERTICAL-CAVITY SURFACE EMITTING...

RADIATION DETECTORS HAVING SULFIDE-CONTAINING ANODE CONTACTS AND ME...

SEMICONDUCTOR CHIP, SOLID-STATE IMAGING DEVICE, AND ELECTRONIC EQUI...

PHOTOELECTRIC SENSOR AND SUBSTRATE

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING OPTICAL SEMI...

METHOD FOR PROTECTING ACTIVE LAYERS OF ELECTRONIC CHIPS

SEMICONDUCTOR DEVICE, APPARATUS, AND MANUFACTURING METHOD OF SEMICO...

IMAGE SENSING MODULE MANUFACTURING METHOD

Stacking Single-Photon Avalanche Diodes and High Voltage Devices

METALENS FOR NEAR INFRARED PHOTODETECTOR

TWO-WAY OPTICAL SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME

SEMICONDUCTOR APPARATUS

SOLID-STATE IMAGING APPARATUS AND METHOD FOR MANUFACTURING THE SOLI...

ARRAY SUBSTRATE, DISPLAY PANEL, AND ELECTRONIC DEVICE

SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME

FINGERPRINT SENSOR, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY...

SEMICONDUCTOR IMAGE SENSOR AND METHOD FOR FORMING THE SAME

SOLID-STATE IMAGE PICKUP DEVICE

IMAGE SENSOR WITH DIFFUSION BARRIER STRUCTURE

PACKAGE WITH INTEGRATED OPTICAL DIE AND METHOD FORMING SAME

IMAGE SENSOR AND METHOD OF FABRICATING THE SAME

BACK-SIDE DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR