Assembling printed circuits with electric components

Industry

CPC
H05K3/30

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/30Assembling printed circuits with electric components

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Plug-in connector device and method for producing a plug-in connect...
- Patent number 12,170,415
- Issue date Dec 17, 2024
- Vitesco Technologies GmbH
- Gregory Drew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly and method for thermal balancing of surfacemoun...
- Patent number 12,171,056
- Issue date Dec 17, 2024
- MELLANOX TECHNOLOGIES LTD.
- Igor Loiferman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing substrate with sensor
- Patent number 12,167,542
- Issue date Dec 10, 2024
- Tokyo Electron Limited
- Manabu Nakagawasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and method for manufacturing wiring board
- Patent number 12,156,337
- Issue date Nov 26, 2024
- Dai Nippon Printing Co., Ltd.
- Seiji Take
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED circuit board structure and LED testing and packaging method
- Patent number 12,150,242
- Issue date Nov 19, 2024
- Ingentec Corporation
- Yi-Chuan Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Camera module having a soldering portion coupling a driving device...
- Patent number 12,149,811
- Issue date Nov 19, 2024
- LG Innotek Co., Ltd
- Jong Ho Chung
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electromagnetic interference shielding and thermal management syste...
- Patent number 12,137,515
- Issue date Nov 5, 2024
- Aptiv Technologies AG
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interface assembly and method for manufacturing interface assembly
- Patent number 12,137,523
- Issue date Nov 5, 2024
- TACTOTEK OY
- Mikko Heikkinen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electronic device including interface terminal having outer shell a...
- Patent number 12,126,122
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Juho Yi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semi-flex component carrier with dielectric material surrounding an...
- Patent number 12,127,338
- Issue date Oct 22, 2024
- AT&S(China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Press-fit power module and related methods
- Patent number 12,119,576
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jie Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal wearable battery and system
- Patent number 12,114,426
- Issue date Oct 8, 2024
- Inventus Power, Inc.
- Elijah Brett Goldin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat removal from silicon photonics chip using a recessed side-by-s...
- Patent number 12,114,416
- Issue date Oct 8, 2024
- Mellanox Technologies, Ltd.
- Elad Mentovich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly of an electronic board and a heat sink, and motor-fan unit...
- Patent number 12,108,519
- Issue date Oct 1, 2024
- Valeo Systemes Thermiques
- Ismaël Franco
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module and manufacturing method of the same
- Patent number 12,108,526
- Issue date Oct 1, 2024
- Japan Aviation Electronics Industry, Limited
- Junya Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor memory system
- Patent number 12,094,866
- Issue date Sep 17, 2024
- Kioxia Corporation
- Hayato Masubuchi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Nanocomposite material for ultraviolet curable direct write semicon...
- Patent number 12,096,561
- Issue date Sep 17, 2024
- Raytheon Company
- Craig A. Armiento
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Integrated electronic device with flexible and stretchable substrate
- Patent number 12,096,553
- Issue date Sep 17, 2024
- Carnegie Mellon University
- Gary K. Fedder
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Interface assembly and method for manufacturing interface assembly
- Patent number 12,096,562
- Issue date Sep 17, 2024
- TACTOTEK OY
- Mikko Heikkinen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Assembly method of electronic device
- Patent number 12,096,568
- Issue date Sep 17, 2024
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- I-Kai Liang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing coil component
- Patent number 12,087,496
- Issue date Sep 10, 2024
- Taiyo Yuden Co., Ltd.
- Hidenori Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,082,349
- Issue date Sep 3, 2024
- HONOR DEVICE CO., LTD.
- Xiaoyong Dong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photosensitive assembly, camera module and manufacturing method the...
- Patent number 12,081,849
- Issue date Sep 3, 2024
- NINGBO SUNNY OPOTECH CO., LTD.
- Zhongyu Luan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Resilient printed circuit board retention arrangement
- Patent number 12,082,360
- Issue date Sep 3, 2024
- Garrett Transportation I Inc.
- Valeriy Fedorikhin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coil component, circuit board, and electronic device
- Patent number 12,080,467
- Issue date Sep 3, 2024
- Taiyo Yuden Co., Ltd.
- Hidenori Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedding component in component carrier by component fixation stru...
- Patent number 12,075,561
- Issue date Aug 27, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Timo Schwarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of constructing a circuitry assembly for heat dispersal usin...
- Patent number 12,068,223
- Issue date Aug 20, 2024
- Elta Systems Ltd.
- Michael Kedem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic component, circuit substrate arrangement, and me...
- Patent number 12,068,115
- Issue date Aug 20, 2024
- Taiyo Yuden Co., Ltd.
- Anju Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser transfer printing device and method
- Patent number 12,064,952
- Issue date Aug 20, 2024
- INSTITUTE OF FLEXIBLE ELECTRONICS TECHNOLOGY OF THU, ZHEJIANG
- Xue Feng
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Packaging design for a flow sensor and methods of manufacturing the...
- Patent number 12,061,103
- Issue date Aug 13, 2024
- Applied Materials, Inc.
- Srikanth Krishnamurthy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...
- Publication number 20240422914
- Publication date Dec 19, 2024
- Mitsubishi Electric Corporation
- Yosuke NAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CIRCUIT FORMING METHOD AND ELECTRICAL CIRCUIT FORMING AP...
- Publication number 20240422917
- Publication date Dec 19, 2024
- FUJI CORPORATION
- Kenji TSUKADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT-FORMING METHOD AND CIRCUIT-FORMING APPARATUS
- Publication number 20240422916
- Publication date Dec 19, 2024
- FUJI CORPORATION
- Kenji TSUKADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING MODULE AND A BONDING DEVICE
- Publication number 20240409355
- Publication date Dec 12, 2024
- ALL RING TECH CO., LTD.
- Chuen-Fa SHIH
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
BONDING METHOD AND A BONDING APPARATUS FOR IMPLEMENTING THE BONDING...
- Publication number 20240409354
- Publication date Dec 12, 2024
- ALL RING TECH CO., LTD.
- Chuen-Fa SHIH
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
TOOL AND PROCESSES FOR PICK-AND-PLACE ASSEMBLY
- Publication number 20240407148
- Publication date Dec 5, 2024
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MEMORY SYSTEM
- Publication number 20240405010
- Publication date Dec 5, 2024
- KIOXIA Corporation
- Hayato MASUBUCHI
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD OF SEGMENTED ELECTROPLATING GOLD FINGER
- Publication number 20240397631
- Publication date Nov 28, 2024
- Gold Circuit Electronics Ltd.
- Chen-Tse Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240397633
- Publication date Nov 28, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- YU-HSIANG LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATELESS HYBRID POWER MODULE ASSEMBLY AND METHOD FOR FABRICATI...
- Publication number 20240389237
- Publication date Nov 21, 2024
- IndiaVPSemiconductor Pvt Ltd.
- VIJAY BOLLOJU BOLLOJU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH SPEED, EFFICIENT SIC POWER MODULE
- Publication number 20240380320
- Publication date Nov 14, 2024
- Wolfspeed, Inc.
- Mrinal K. DAS
- B60 - VEHICLES IN GENERAL
Information Patent Application
MODULAR ROUTABLE CIRCUIT BOARD CONDUCTOR BLOCKS
- Publication number 20240381541
- Publication date Nov 14, 2024
- Microsoft Technology Licensing, LLC
- Jason HARRIGAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERFACE ASSEMBLY AND METHOD FOR MANUFACTURING INTERFACE ASSEMBLY
- Publication number 20240373559
- Publication date Nov 7, 2024
- TactoTek Oy
- Mikko HEIKKINEN
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
PACKAGING DESIGN FOR A FLOW SENSOR AND METHODS OF MANUFACTURING THE...
- Publication number 20240369389
- Publication date Nov 7, 2024
- Applied Materials, Inc.
- Srikanth Krishnamurthy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CIRCUIT BOARD, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING CIRCU...
- Publication number 20240365464
- Publication date Oct 31, 2024
- Canon Kabushiki Kaisha
- HIROYUKI YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID TRANSFORMERS FOR POWER SUPPLIES
- Publication number 20240355534
- Publication date Oct 24, 2024
- AcLeap Power Inc.
- Arturo Silva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTING COMPONENTS TO SUBSTRATE POSTS
- Publication number 20240349431
- Publication date Oct 17, 2024
- X Display Company Technology Limited
- David Gomez
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
REFLOW FURNACE
- Publication number 20240344771
- Publication date Oct 17, 2024
- Illinois Tool Works Inc.
- Yuwei WANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING TH...
- Publication number 20240341043
- Publication date Oct 10, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
BGA Element Self-Alignment Structure and Alignment Method
- Publication number 20240334592
- Publication date Oct 3, 2024
- SHENZHEN SIPTORY TECHNOLOGY CO., LTD
- Dongdong Shao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE WITH MULTI-DIAMETER FEMALE CONTACTS AND RELATED M...
- Publication number 20240334615
- Publication date Oct 3, 2024
- Eagle Technology, LLC
- JOHN VOELKEL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ARCHITECTURES AND METHODS THAT ENABLE A REWORKABLE HEAT MANAGEMENT...
- Publication number 20240324108
- Publication date Sep 26, 2024
- Intel Corporation
- Juha T. Paavola
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHARED APERTURE FOLDED DIPOLE ANTENNA
- Publication number 20240313408
- Publication date Sep 19, 2024
- KING FAHD UNIVERSITY OF PETROLEUM AND MINERALS
- Rifaqat HUSSAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING BOARD AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240298407
- Publication date Sep 5, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Gyumook Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSFER PRINTING HIGH-PRECISION DEVICES
- Publication number 20240292543
- Publication date Aug 29, 2024
- X Display Company Technology Limited
- Matthew Alexander Meitl
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHOD OF MANUFACTURING THE PRINTED CIRCUIT BOARD EMBEDDED WITH WAF...
- Publication number 20240292544
- Publication date Aug 29, 2024
- DAEDUCK ELECTRONICS CO., LTD.
- Seon-Kyu CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC-BASED CIRCUIT BOARD ASSEMBLIES FORMED USING METAL NANOPARTI...
- Publication number 20240292531
- Publication date Aug 29, 2024
- Kuprion Inc.
- Alfred A. ZINN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDI...
- Publication number 20240284594
- Publication date Aug 22, 2024
- SAMSUNG DISPLAY CO., LTD.
- Han-Sung BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERFACE ASSEMBLY AND METHOD FOR MANUFACTURING INTERFACE ASSEMBLY
- Publication number 20240284598
- Publication date Aug 22, 2024
- TactoTek Oy
- Mikko HEIKKINEN
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Electronic Control Unit
- Publication number 20240275091
- Publication date Aug 15, 2024
- ROBERT BOSCH GmbH
- Bernie JIANG
- H01 - BASIC ELECTRIC ELEMENTS

Assembling printed circuits with electric components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Plug-in connector device and method for producing a plug-in connect...

Electronic assembly and method for thermal balancing of surfacemoun...

Method for manufacturing substrate with sensor

Wiring board and method for manufacturing wiring board

LED circuit board structure and LED testing and packaging method

Camera module having a soldering portion coupling a driving device...

Electromagnetic interference shielding and thermal management syste...

Interface assembly and method for manufacturing interface assembly

Electronic device including interface terminal having outer shell a...

Semi-flex component carrier with dielectric material surrounding an...

Press-fit power module and related methods

Conformal wearable battery and system

Heat removal from silicon photonics chip using a recessed side-by-s...

Assembly of an electronic board and a heat sink, and motor-fan unit...

Module and manufacturing method of the same

Semiconductor memory system

Nanocomposite material for ultraviolet curable direct write semicon...

Integrated electronic device with flexible and stretchable substrate

Interface assembly and method for manufacturing interface assembly

Assembly method of electronic device

Method for manufacturing coil component

Electronic device

Photosensitive assembly, camera module and manufacturing method the...

Resilient printed circuit board retention arrangement

Coil component, circuit board, and electronic device

Embedding component in component carrier by component fixation stru...

Method of constructing a circuitry assembly for heat dispersal usin...

Ceramic electronic component, circuit substrate arrangement, and me...

Laser transfer printing device and method

Packaging design for a flow sensor and methods of manufacturing the...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...

ELECTRICAL CIRCUIT FORMING METHOD AND ELECTRICAL CIRCUIT FORMING AP...

CIRCUIT-FORMING METHOD AND CIRCUIT-FORMING APPARATUS

BONDING MODULE AND A BONDING DEVICE

BONDING METHOD AND A BONDING APPARATUS FOR IMPLEMENTING THE BONDING...

TOOL AND PROCESSES FOR PICK-AND-PLACE ASSEMBLY

SEMICONDUCTOR MEMORY SYSTEM

METHOD OF SEGMENTED ELECTROPLATING GOLD FINGER

SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SUBSTRATELESS HYBRID POWER MODULE ASSEMBLY AND METHOD FOR FABRICATI...

HIGH SPEED, EFFICIENT SIC POWER MODULE

MODULAR ROUTABLE CIRCUIT BOARD CONDUCTOR BLOCKS

INTERFACE ASSEMBLY AND METHOD FOR MANUFACTURING INTERFACE ASSEMBLY

PACKAGING DESIGN FOR A FLOW SENSOR AND METHODS OF MANUFACTURING THE...

CIRCUIT BOARD, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING CIRCU...

HYBRID TRANSFORMERS FOR POWER SUPPLIES

PRINTING COMPONENTS TO SUBSTRATE POSTS

REFLOW FURNACE

HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING TH...

BGA Element Self-Alignment Structure and Alignment Method

ELECTRONIC DEVICE WITH MULTI-DIAMETER FEMALE CONTACTS AND RELATED M...

ARCHITECTURES AND METHODS THAT ENABLE A REWORKABLE HEAT MANAGEMENT...

SHARED APERTURE FOLDED DIPOLE ANTENNA

CONNECTING BOARD AND MANUFACTURING METHOD OF THE SAME

TRANSFER PRINTING HIGH-PRECISION DEVICES

METHOD OF MANUFACTURING THE PRINTED CIRCUIT BOARD EMBEDDED WITH WAF...

CERAMIC-BASED CIRCUIT BOARD ASSEMBLIES FORMED USING METAL NANOPARTI...

ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDI...

INTERFACE ASSEMBLY AND METHOD FOR MANUFACTURING INTERFACE ASSEMBLY

Electronic Control Unit