Assembling printed circuits with electric components

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CPC
H05K3/30

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/30Assembling printed circuits with electric components

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Interlaced crosstalk controlled traces, vias, and capacitors
- Patent number 12,225,658
- Issue date Feb 11, 2025
- Cisco Technology, Inc.
- Shadi Ebrahimi Asl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit system and method of manufacturing a printed circuit board
- Patent number 12,225,665
- Issue date Feb 11, 2025
- NVIDIA Corp.
- MingYi Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power system and method for controlling power modules
- Patent number 12,225,657
- Issue date Feb 11, 2025
- Transportation IP Holdings, LLC
- Alvaro Jorge Mari Curbelo
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Surface-mounted heat sink and power module using same
- Patent number 12,225,694
- Issue date Feb 11, 2025
- Delta Electronics (Shanghai) Co., Ltd.
- Mingjuan Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacture for embedded IC chip directly connected to PCB
- Patent number 12,213,258
- Issue date Jan 28, 2025
- AVERATEK CORPORATION
- Haris Basit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pin-fin cooling for printed circuit boards (PCBs)
- Patent number 12,213,240
- Issue date Jan 28, 2025
- Hamilton Sundstrand Corporation
- Yongduk Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component with metallic cap
- Patent number 12,205,857
- Issue date Jan 21, 2025
- Murata Manufacturing Co., Ltd.
- Kimmo Kaija
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board configured for waveguide coupling a diplexer...
- Patent number 12,206,150
- Issue date Jan 21, 2025
- Vubiq Networks, Inc.
- Michael Gregory Pettus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embeddable electrically insulating thermal connector and circuit bo...
- Patent number 12,200,853
- Issue date Jan 14, 2025
- KYOCERA AVX Components Corporation
- Cory Nelson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressurizing device and electronic device including pressurizing de...
- Patent number 12,200,874
- Issue date Jan 14, 2025
- Tyco Electronics (Shanghai) Co., Ltd.
- Wei (David) Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing an electronic device
- Patent number 12,193,167
- Issue date Jan 7, 2025
- INNOLUX CORPORATION
- Kai Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead frame and method for stacking discrete components to be embedd...
- Patent number 12,185,469
- Issue date Dec 31, 2024
- SARAS MICRO DEVICES, INC.
- Richard Sheridan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light board, method for manufacturing the same, and LED backlight m...
- Patent number 12,177,966
- Issue date Dec 24, 2024
- FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
- Xinghan He
- F21 - LIGHTING
Information Patent Grant
Modular electronic prototyping platforms
- Patent number 12,177,969
- Issue date Dec 24, 2024
- Microsoft Technology Licensing, LLC
- Stephen Edward Hodges
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of parallel transfer of micro-devices using treatment
- Patent number 12,176,384
- Issue date Dec 24, 2024
- Applied Materials, Inc.
- Manivannan Thothadri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and manufacturing method thereof
- Patent number 12,176,615
- Issue date Dec 24, 2024
- Kore Semiconductor Co., Ltd.
- Ying-Chieh Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency and high power thin film component
- Patent number 12,177,960
- Issue date Dec 24, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component and method for manufacturing a component
- Patent number 12,177,986
- Issue date Dec 24, 2024
- TDK ELECTRONICS AG
- Jan Ihle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plug-in connector device and method for producing a plug-in connect...
- Patent number 12,170,415
- Issue date Dec 17, 2024
- Vitesco Technologies GmbH
- Gregory Drew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly and method for thermal balancing of surfacemoun...
- Patent number 12,171,056
- Issue date Dec 17, 2024
- MELLANOX TECHNOLOGIES LTD.
- Igor Loiferman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing substrate with sensor
- Patent number 12,167,542
- Issue date Dec 10, 2024
- Tokyo Electron Limited
- Manabu Nakagawasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and method for manufacturing wiring board
- Patent number 12,156,337
- Issue date Nov 26, 2024
- Dai Nippon Printing Co., Ltd.
- Seiji Take
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED circuit board structure and LED testing and packaging method
- Patent number 12,150,242
- Issue date Nov 19, 2024
- Ingentec Corporation
- Yi-Chuan Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Camera module having a soldering portion coupling a driving device...
- Patent number 12,149,811
- Issue date Nov 19, 2024
- LG Innotek Co., Ltd
- Jong Ho Chung
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electromagnetic interference shielding and thermal management syste...
- Patent number 12,137,515
- Issue date Nov 5, 2024
- Aptiv Technologies AG
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interface assembly and method for manufacturing interface assembly
- Patent number 12,137,523
- Issue date Nov 5, 2024
- TACTOTEK OY
- Mikko Heikkinen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electronic device including interface terminal having outer shell a...
- Patent number 12,126,122
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Juho Yi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semi-flex component carrier with dielectric material surrounding an...
- Patent number 12,127,338
- Issue date Oct 22, 2024
- AT&S(China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Press-fit power module and related methods
- Patent number 12,119,576
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jie Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal wearable battery and system
- Patent number 12,114,426
- Issue date Oct 8, 2024
- Inventus Power, Inc.
- Elijah Brett Goldin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONNECTION STRUCTURE FOR YARN WIRE AND CIRCUIT BOARD
- Publication number 20250056736
- Publication date Feb 13, 2025
- NEXTRONICS ENGINEERING CORP.
- HOU-AN SU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE
- Publication number 20250056729
- Publication date Feb 13, 2025
- MURATA MANUFACTURING CO., LTD.
- Ryuichi KUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BREAKAGE FEATURES PROVIDED FOR CIRCUIT BOARDS
- Publication number 20250048543
- Publication date Feb 6, 2025
- Hewlett-Packard Development Company, L.P.
- Gabriel Scott MCDANIEL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELF CORRECTING OVEN TECHNOLOGY
- Publication number 20250033131
- Publication date Jan 30, 2025
- Jabil Inc.
- Charles Santhakumar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAMERA MODULE
- Publication number 20250039529
- Publication date Jan 30, 2025
- LG Innotek Co., Ltd.
- JONG HO CHUNG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD FOR PRODUCING AN ANGULAR POSITION SENSOR
- Publication number 20250040057
- Publication date Jan 30, 2025
- BAUMUELLER NUERNBERG GMBH
- Johannes PIRLING
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND METHOD
- Publication number 20250029887
- Publication date Jan 23, 2025
- Vitesco Technologies GMBH
- Andreas Mühlbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-Level Poling of Electro-Optic Phase Modulators
- Publication number 20250028195
- Publication date Jan 23, 2025
- Lightwave Logic, Inc.
- Jasper Altman Drisko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER BOARD DESIGN TO ACCOMMODATE UNIVERSAL PLUG TYPES VIA BRIDGE S...
- Publication number 20250024603
- Publication date Jan 16, 2025
- Plume Design, Inc.
- Ming-Tsung SU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MOUNTING AT LEAST ONE SEMICOND...
- Publication number 20250016918
- Publication date Jan 9, 2025
- INFINEON TECHNOLOGIES AG
- Martin Richard NIEßNER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conformal Wearable Battery and System
- Publication number 20250016924
- Publication date Jan 9, 2025
- Inventus Power, Inc.
- Elijah Brett Goldin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF FABRICATING ELECTRONIC DEVICE
- Publication number 20250016926
- Publication date Jan 9, 2025
- BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Huiying Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20250016928
- Publication date Jan 9, 2025
- DAI NIPPON PRINTING CO., LTD.
- Seiji TAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOISE CANCELLATION IN LOW-SPEED SIGNALS
- Publication number 20250008638
- Publication date Jan 2, 2025
- Dell Products L.P.
- Sandor FARKAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LATERALLY PLACED CAPACITOR PACKAGE ASSEMBLY AND ASSEMBLY METHOD THE...
- Publication number 20240431032
- Publication date Dec 26, 2024
- APAQ TECHNOLOGY CO., LTD.
- CHING-FENG LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...
- Publication number 20240422914
- Publication date Dec 19, 2024
- Mitsubishi Electric Corporation
- Yosuke NAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CIRCUIT FORMING METHOD AND ELECTRICAL CIRCUIT FORMING AP...
- Publication number 20240422917
- Publication date Dec 19, 2024
- FUJI CORPORATION
- Kenji TSUKADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT-FORMING METHOD AND CIRCUIT-FORMING APPARATUS
- Publication number 20240422916
- Publication date Dec 19, 2024
- FUJI CORPORATION
- Kenji TSUKADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING MODULE AND A BONDING DEVICE
- Publication number 20240409355
- Publication date Dec 12, 2024
- ALL RING TECH CO., LTD.
- Chuen-Fa SHIH
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
BONDING METHOD AND A BONDING APPARATUS FOR IMPLEMENTING THE BONDING...
- Publication number 20240409354
- Publication date Dec 12, 2024
- ALL RING TECH CO., LTD.
- Chuen-Fa SHIH
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
TOOL AND PROCESSES FOR PICK-AND-PLACE ASSEMBLY
- Publication number 20240407148
- Publication date Dec 5, 2024
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MEMORY SYSTEM
- Publication number 20240405010
- Publication date Dec 5, 2024
- KIOXIA Corporation
- Hayato MASUBUCHI
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD OF SEGMENTED ELECTROPLATING GOLD FINGER
- Publication number 20240397631
- Publication date Nov 28, 2024
- Gold Circuit Electronics Ltd.
- Chen-Tse Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240397633
- Publication date Nov 28, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- YU-HSIANG LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATELESS HYBRID POWER MODULE ASSEMBLY AND METHOD FOR FABRICATI...
- Publication number 20240389237
- Publication date Nov 21, 2024
- IndiaVPSemiconductor Pvt Ltd.
- VIJAY BOLLOJU BOLLOJU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH SPEED, EFFICIENT SIC POWER MODULE
- Publication number 20240380320
- Publication date Nov 14, 2024
- Wolfspeed, Inc.
- Mrinal K. DAS
- B60 - VEHICLES IN GENERAL
Information Patent Application
MODULAR ROUTABLE CIRCUIT BOARD CONDUCTOR BLOCKS
- Publication number 20240381541
- Publication date Nov 14, 2024
- Microsoft Technology Licensing, LLC
- Jason HARRIGAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERFACE ASSEMBLY AND METHOD FOR MANUFACTURING INTERFACE ASSEMBLY
- Publication number 20240373559
- Publication date Nov 7, 2024
- TactoTek Oy
- Mikko HEIKKINEN
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
PACKAGING DESIGN FOR A FLOW SENSOR AND METHODS OF MANUFACTURING THE...
- Publication number 20240369389
- Publication date Nov 7, 2024
- Applied Materials, Inc.
- Srikanth Krishnamurthy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CIRCUIT BOARD, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING CIRCU...
- Publication number 20240365464
- Publication date Oct 31, 2024
- Canon Kabushiki Kaisha
- HIROYUKI YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS

Assembling printed circuits with electric components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Interlaced crosstalk controlled traces, vias, and capacitors

Circuit system and method of manufacturing a printed circuit board

Power system and method for controlling power modules

Surface-mounted heat sink and power module using same

Method of manufacture for embedded IC chip directly connected to PCB

Pin-fin cooling for printed circuit boards (PCBs)

Electronic component with metallic cap

Printed circuit board configured for waveguide coupling a diplexer...

Embeddable electrically insulating thermal connector and circuit bo...

Pressurizing device and electronic device including pressurizing de...

Method of manufacturing an electronic device

Lead frame and method for stacking discrete components to be embedd...

Light board, method for manufacturing the same, and LED backlight m...

Modular electronic prototyping platforms

Methods of parallel transfer of micro-devices using treatment

Electronic device and manufacturing method thereof

High frequency and high power thin film component

Component and method for manufacturing a component

Plug-in connector device and method for producing a plug-in connect...

Electronic assembly and method for thermal balancing of surfacemoun...

Method for manufacturing substrate with sensor

Wiring board and method for manufacturing wiring board

LED circuit board structure and LED testing and packaging method

Camera module having a soldering portion coupling a driving device...

Electromagnetic interference shielding and thermal management syste...

Interface assembly and method for manufacturing interface assembly

Electronic device including interface terminal having outer shell a...

Semi-flex component carrier with dielectric material surrounding an...

Press-fit power module and related methods

Conformal wearable battery and system

Patents Applicationslast 30 patents

CONNECTION STRUCTURE FOR YARN WIRE AND CIRCUIT BOARD

SUBSTRATE

BREAKAGE FEATURES PROVIDED FOR CIRCUIT BOARDS

SELF CORRECTING OVEN TECHNOLOGY

CAMERA MODULE

METHOD FOR PRODUCING AN ANGULAR POSITION SENSOR

CIRCUIT BOARD ASSEMBLY AND METHOD

Wafer-Level Poling of Electro-Optic Phase Modulators

POWER BOARD DESIGN TO ACCOMMODATE UNIVERSAL PLUG TYPES VIA BRIDGE S...

PRINTED CIRCUIT BOARD AND METHOD FOR MOUNTING AT LEAST ONE SEMICOND...

Conformal Wearable Battery and System

ELECTRONIC DEVICE AND METHOD OF FABRICATING ELECTRONIC DEVICE

WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

NOISE CANCELLATION IN LOW-SPEED SIGNALS

LATERALLY PLACED CAPACITOR PACKAGE ASSEMBLY AND ASSEMBLY METHOD THE...

SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...

ELECTRICAL CIRCUIT FORMING METHOD AND ELECTRICAL CIRCUIT FORMING AP...

CIRCUIT-FORMING METHOD AND CIRCUIT-FORMING APPARATUS

BONDING MODULE AND A BONDING DEVICE

BONDING METHOD AND A BONDING APPARATUS FOR IMPLEMENTING THE BONDING...

TOOL AND PROCESSES FOR PICK-AND-PLACE ASSEMBLY

SEMICONDUCTOR MEMORY SYSTEM

METHOD OF SEGMENTED ELECTROPLATING GOLD FINGER

SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SUBSTRATELESS HYBRID POWER MODULE ASSEMBLY AND METHOD FOR FABRICATI...

HIGH SPEED, EFFICIENT SIC POWER MODULE

MODULAR ROUTABLE CIRCUIT BOARD CONDUCTOR BLOCKS

INTERFACE ASSEMBLY AND METHOD FOR MANUFACTURING INTERFACE ASSEMBLY

PACKAGING DESIGN FOR A FLOW SENSOR AND METHODS OF MANUFACTURING THE...

CIRCUIT BOARD, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING CIRCU...