Assembling printed circuits with electric components

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CPC
H05K3/30

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/30Assembling printed circuits with electric components

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Compact thin film surface mountable coupler having wide-band perfor...
- Patent number 12,327,903
- Issue date Jun 10, 2025
- KYOCERA AVX Components Corporation
- Michael Marek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element unit and method of manufacturing thereof, sem...
- Patent number 12,328,928
- Issue date Jun 10, 2025
- Oki Electric Industry Co., Ltd.
- Yuuki Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board assembly and manufacturing method thereof
- Patent number 12,324,100
- Issue date Jun 3, 2025
- Unimicron Technology Corp.
- Yu-Shen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,309,931
- Issue date May 20, 2025
- Innolux Corporation
- Chin-Cheng Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method for manufacturing the same
- Patent number 12,309,923
- Issue date May 20, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sang Hoon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with convex shaped post, light emitting device, and m...
- Patent number 12,309,934
- Issue date May 20, 2025
- Nichia Corporation
- Yosuke Noda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin film-based microfluidic electronic device, method of forming t...
- Patent number 12,302,505
- Issue date May 13, 2025
- Singapore University of Technology and Design
- Kento Yamagishi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Module having a shield film and method of manufacturing the same
- Patent number 12,295,129
- Issue date May 6, 2025
- Murata Manufacturing Co., Ltd.
- Tetsuya Oda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3D printable feedstock inks for signal control or computation
- Patent number 12,293,997
- Issue date May 6, 2025
- Lawrence Livermore National Security, LLC
- Maxwell Murialdo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing circuits of substrate of display device
- Patent number 12,295,106
- Issue date May 6, 2025
- TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Tong Deng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hermetic coating of components
- Patent number 12,289,840
- Issue date Apr 29, 2025
- Heraeus Medevio GmbH & Co. KG
- Ulrich Hausch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus
- Patent number 12,289,841
- Issue date Apr 29, 2025
- Lenovo (Singapore) Pte. Ltd.
- Wenjin Niu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module with housed power semiconductors for controllable elec...
- Patent number 12,284,749
- Issue date Apr 22, 2025
- ZF Friedrichshafen AG
- Thomas Maier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Press-in machine for pressing components into a substrate, in parti...
- Patent number 12,284,768
- Issue date Apr 22, 2025
- ERSA GmbH
- Kevin Friedrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate frame design for three-dimensional stacked electronic ass...
- Patent number 12,278,172
- Issue date Apr 15, 2025
- Applied Materials, Inc.
- Akash Agrawal
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Release film
- Patent number 12,275,228
- Issue date Apr 15, 2025
- Samsung Display Co., Ltd.
- Hun-Tae Kim
- B32 - LAYERED PRODUCTS
Information Patent Grant
Inverter insulator apparatus and method
- Patent number 12,273,044
- Issue date Apr 8, 2025
- Rivian IP Holdings, LLC
- Young Mok Doo
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Thermal connection between printed circuit board and base plate wit...
- Patent number 12,266,874
- Issue date Apr 1, 2025
- Vitesco Technologies USA, LLC.
- Uwe Stephan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module and method for manufacturing electronic...
- Patent number 12,267,964
- Issue date Apr 1, 2025
- Murata Manufacturing Co., Ltd.
- Toru Komatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leadless current sensor package with high isolation
- Patent number 12,265,103
- Issue date Apr 1, 2025
- ALLEGRO MICROSYSTEMS, LLC
- Robert A. Briano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacer element for a printed circuit board assembly
- Patent number 12,267,977
- Issue date Apr 1, 2025
- BorgWarner Inc.
- Kai Homann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Modified internal clearance(s) at connector pin aperture(s) of a ci...
- Patent number 12,256,494
- Issue date Mar 18, 2025
- International Business Machines Corporation
- James D. Bielick
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with embedded electronic component and manufacturing...
- Patent number 12,245,358
- Issue date Mar 4, 2025
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Ying Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three-dimensional patterned module exterior surface for improved he...
- Patent number 12,245,382
- Issue date Mar 4, 2025
- Qorvo US, Inc.
- Loizos Loizou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible pressure sensors and user interfaces
- Patent number 12,232,548
- Issue date Feb 25, 2025
- LOOMIA Technologies, Inc.
- Madison Thea Maxey
- A41 - WEARING APPAREL
Information Patent Grant
Integrated circuit structure
- Patent number 12,238,865
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection method for chip and circuit board, and circuit board ass...
- Patent number 12,232,266
- Issue date Feb 18, 2025
- INTELLIMICRO MEDICAL CO., LTD.
- Yu-chong Tai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Item inventory management apparatus, and a system and method of man...
- Patent number 12,229,715
- Issue date Feb 18, 2025
- HENCHMAN GROUP PTY LTD
- Alisdair John Chambers
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit carrier for an electronic circuit, and method for producing...
- Patent number 12,230,432
- Issue date Feb 18, 2025
- Robert Bosch GmbH
- Felix Stewing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device and method for manufacturing power semic...
- Patent number 12,232,300
- Issue date Feb 18, 2025
- Mitsubishi Electric Corporation
- Noriyuki Besshi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
A PACKAGING ARRANGEMENT FOR A QUANTUM PROCESSOR
- Publication number 20250194015
- Publication date Jun 12, 2025
- SCALINQ AB
- Robert REHAMMAR
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLEXIBLE PRESSURE SENSORS AND USER INTERFACES
- Publication number 20250169555
- Publication date May 29, 2025
- LOOMIA Technologies, Inc.
- Madison Thea Maxey
- A41 - WEARING APPAREL
Information Patent Application
METHOD FOR MANUFACTURING TRIM PANELS FOR VEHICLES HAVING AN ELECTRO...
- Publication number 20250168990
- Publication date May 22, 2025
- GRUPO ANTOLIN-INGENIERIA, S.A.
- Marta Castillo Garcia
- B60 - VEHICLES IN GENERAL
Information Patent Application
Method For Manufacturing Electronic Device
- Publication number 20250155466
- Publication date May 15, 2025
- SEIKO EPSON CORPORATION
- Hitoshi UENO
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE
- Publication number 20250159812
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHODS FOR PROMOTING SELECTIVE COPPER FOIL ADHESION IN A PRINTED C...
- Publication number 20250151205
- Publication date May 8, 2025
- Rockwell Collins, Inc.
- James B. Mayfield
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PORTABLE BAKING ASSEMBLY TO CURE THERMAL INTERFACE MATERIAL FOR PRO...
- Publication number 20250151251
- Publication date May 8, 2025
- ZT Group Int’l, Inc. dba ZT Systems
- Sruti Chigullapalli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-CONFIGURABLE ANTENNA TUNER CIRCUIT BOARD
- Publication number 20250142714
- Publication date May 1, 2025
- Dell Products L.P.
- Changsoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CIRCUIT FORMATION METHOD, AND ELECTRICAL CIRCUIT FORMATI...
- Publication number 20250142734
- Publication date May 1, 2025
- FUJI CORPORATION
- Kenji TSUKADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY HAVING CIRCUIT BOARD WITH ADJACENT CHIPS IMM...
- Publication number 20250125246
- Publication date Apr 17, 2025
- Auradine, Inc.
- Anuya Reddy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250126715
- Publication date Apr 17, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Byung Hak KANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Embeddable Electrically Insulating Thermal Connector and Circuit Bo...
- Publication number 20250106979
- Publication date Mar 27, 2025
- KYOCERA AVX Components Corporation
- Cory Nelson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FILTER, MANUFACTURING METHOD THEREOF AND ELECTRONIC APPARATUS
- Publication number 20250105812
- Publication date Mar 27, 2025
- BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Qichang AN
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20250098075
- Publication date Mar 20, 2025
- LENOVO (SINGAPORE) PTE. LTD.
- Wenjin Niu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE
- Publication number 20250089178
- Publication date Mar 13, 2025
- Innolux Corporation
- Kai Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FILTER COMPONENT AND METHOD FOR PRODUCING A FILTER COMPONENT
- Publication number 20250081352
- Publication date Mar 6, 2025
- TDK Electronics AG
- Karl Niklas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250081354
- Publication date Mar 6, 2025
- InnoLux Corporation
- Cheng-Chi WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION STRUCTURE FOR YARN WIRE AND CIRCUIT BOARD
- Publication number 20250056736
- Publication date Feb 13, 2025
- NEXTRONICS ENGINEERING CORP.
- HOU-AN SU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE
- Publication number 20250056729
- Publication date Feb 13, 2025
- MURATA MANUFACTURING CO., LTD.
- Ryuichi KUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BREAKAGE FEATURES PROVIDED FOR CIRCUIT BOARDS
- Publication number 20250048543
- Publication date Feb 6, 2025
- Hewlett-Packard Development Company, L.P.
- Gabriel Scott MCDANIEL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELF CORRECTING OVEN TECHNOLOGY
- Publication number 20250033131
- Publication date Jan 30, 2025
- Jabil Inc.
- Charles Santhakumar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING AN ANGULAR POSITION SENSOR
- Publication number 20250040057
- Publication date Jan 30, 2025
- BAUMUELLER NUERNBERG GMBH
- Johannes PIRLING
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAMERA MODULE
- Publication number 20250039529
- Publication date Jan 30, 2025
- LG Innotek Co., Ltd.
- JONG HO CHUNG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND METHOD
- Publication number 20250029887
- Publication date Jan 23, 2025
- Vitesco Technologies GMBH
- Andreas Mühlbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-Level Poling of Electro-Optic Phase Modulators
- Publication number 20250028195
- Publication date Jan 23, 2025
- Lightwave Logic, Inc.
- Jasper Altman Drisko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER BOARD DESIGN TO ACCOMMODATE UNIVERSAL PLUG TYPES VIA BRIDGE S...
- Publication number 20250024603
- Publication date Jan 16, 2025
- Plume Design, Inc.
- Ming-Tsung SU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MOUNTING AT LEAST ONE SEMICOND...
- Publication number 20250016918
- Publication date Jan 9, 2025
- INFINEON TECHNOLOGIES AG
- Martin Richard NIEßNER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conformal Wearable Battery and System
- Publication number 20250016924
- Publication date Jan 9, 2025
- Inventus Power, Inc.
- Elijah Brett Goldin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF FABRICATING ELECTRONIC DEVICE
- Publication number 20250016926
- Publication date Jan 9, 2025
- BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Huiying Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20250016928
- Publication date Jan 9, 2025
- DAI NIPPON PRINTING CO., LTD.
- Seiji TAKE
- H01 - BASIC ELECTRIC ELEMENTS

Assembling printed circuits with electric components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Compact thin film surface mountable coupler having wide-band perfor...

Semiconductor element unit and method of manufacturing thereof, sem...

Circuit board assembly and manufacturing method thereof

Electronic device

Printed circuit board and method for manufacturing the same

Circuit board with convex shaped post, light emitting device, and m...

Thin film-based microfluidic electronic device, method of forming t...

Module having a shield film and method of manufacturing the same

3D printable feedstock inks for signal control or computation

Method of producing circuits of substrate of display device

Hermetic coating of components

Electronic apparatus

Power module with housed power semiconductors for controllable elec...

Press-in machine for pressing components into a substrate, in parti...

Substrate frame design for three-dimensional stacked electronic ass...

Release film

Inverter insulator apparatus and method

Thermal connection between printed circuit board and base plate wit...

Electronic component module and method for manufacturing electronic...

Leadless current sensor package with high isolation

Spacer element for a printed circuit board assembly

Modified internal clearance(s) at connector pin aperture(s) of a ci...

Circuit board with embedded electronic component and manufacturing...

Three-dimensional patterned module exterior surface for improved he...

Flexible pressure sensors and user interfaces

Integrated circuit structure

Connection method for chip and circuit board, and circuit board ass...

Item inventory management apparatus, and a system and method of man...

Circuit carrier for an electronic circuit, and method for producing...

Power semiconductor device and method for manufacturing power semic...

Patents Applicationslast 30 patents

A PACKAGING ARRANGEMENT FOR A QUANTUM PROCESSOR

FLEXIBLE PRESSURE SENSORS AND USER INTERFACES

METHOD FOR MANUFACTURING TRIM PANELS FOR VEHICLES HAVING AN ELECTRO...

Method For Manufacturing Electronic Device

INTEGRATED CIRCUIT STRUCTURE

METHODS FOR PROMOTING SELECTIVE COPPER FOIL ADHESION IN A PRINTED C...

PORTABLE BAKING ASSEMBLY TO CURE THERMAL INTERFACE MATERIAL FOR PRO...

MULTI-CONFIGURABLE ANTENNA TUNER CIRCUIT BOARD

ELECTRICAL CIRCUIT FORMATION METHOD, AND ELECTRICAL CIRCUIT FORMATI...

CIRCUIT BOARD ASSEMBLY HAVING CIRCUIT BOARD WITH ADJACENT CHIPS IMM...

PRINTED CIRCUIT BOARD

Embeddable Electrically Insulating Thermal Connector and Circuit Bo...

FILTER, MANUFACTURING METHOD THEREOF AND ELECTRONIC APPARATUS

ELECTRONIC APPARATUS

METHOD OF MANUFACTURING AN ELECTRONIC DEVICE

FILTER COMPONENT AND METHOD FOR PRODUCING A FILTER COMPONENT

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

CONNECTION STRUCTURE FOR YARN WIRE AND CIRCUIT BOARD

SUBSTRATE

BREAKAGE FEATURES PROVIDED FOR CIRCUIT BOARDS

SELF CORRECTING OVEN TECHNOLOGY

METHOD FOR PRODUCING AN ANGULAR POSITION SENSOR

CAMERA MODULE

CIRCUIT BOARD ASSEMBLY AND METHOD

Wafer-Level Poling of Electro-Optic Phase Modulators

POWER BOARD DESIGN TO ACCOMMODATE UNIVERSAL PLUG TYPES VIA BRIDGE S...

PRINTED CIRCUIT BOARD AND METHOD FOR MOUNTING AT LEAST ONE SEMICOND...

Conformal Wearable Battery and System

ELECTRONIC DEVICE AND METHOD OF FABRICATING ELECTRONIC DEVICE

WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD