Assembly of a plurality of insulating substrates

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H01L23/5385

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/5385Assembly of a plurality of insulating substrates

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package having interposer substrate
- Patent number 12,272,628
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Yanggyoo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous nested interposer package for IC chips
- Patent number 12,272,656
- Issue date Apr 8, 2025
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having interconnections between die...
- Patent number 12,272,651
- Issue date Apr 8, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,272,652
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Jiwon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,266,638
- Issue date Apr 1, 2025
- Samsung Electronics Co., Ltd.
- Sangcheon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded direct bonded and interconnected stack
- Patent number 12,266,640
- Issue date Apr 1, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including antenna pattern
- Patent number 12,261,135
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Se Ho You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an encapulant comprising conductive fi...
- Patent number 12,261,095
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,261,105
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Myungsam Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly having multiple substrate segments
- Patent number 12,261,110
- Issue date Mar 25, 2025
- Tesla, Inc.
- Mengzhi Pang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded dies in semiconductor packages and methods of forming same
- Patent number 12,261,163
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Secure semiconductor integration and method for making thereof
- Patent number 12,255,189
- Issue date Mar 18, 2025
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SIP package structure
- Patent number 12,249,582
- Issue date Mar 11, 2025
- JCET GROUP CO., LTD.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure, RDL structure comprising redistribution layer ha...
- Patent number 12,249,564
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures including bridges
- Patent number 12,243,792
- Issue date Mar 4, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wirebondable interposer for flip chip packaged integrated circuit die
- Patent number 12,243,840
- Issue date Mar 4, 2025
- Samtec, Inc.
- Edwin Loy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D stack of split graphics processing logic dies
- Patent number 12,243,797
- Issue date Mar 4, 2025
- Kepler Computing Inc.
- Amrita Mathuriya
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board with bridge chiplets
- Patent number 12,238,872
- Issue date Feb 25, 2025
- Advanced Micro Devices, Inc.
- Robert N. McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and methods of manufacturing the same
- Patent number 12,237,277
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier structure including pockets for accommodating semiconductor...
- Patent number 12,230,575
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Hyeongmun Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chiplet device
- Patent number 12,230,578
- Issue date Feb 18, 2025
- Global Unichip Corporation
- Sheng-Fan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate z-disaggregation with liquid metal interconnects
- Patent number 12,230,564
- Issue date Feb 18, 2025
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-film package and display apparatus including the same
- Patent number 12,230,576
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Jaemin Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including power management die in a stack and...
- Patent number 12,230,607
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Double-sided substrate with cavities for direct die-to-die intercon...
- Patent number 12,230,610
- Issue date Feb 18, 2025
- Intel Corporation
- Pooya Tadayon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to enable 30 microns pitch EMIB or below
- Patent number 12,230,563
- Issue date Feb 18, 2025
- Intel Corporation
- Hongxia Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 12,230,606
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package, and semiconductor pa...
- Patent number 12,230,580
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Junghoon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die interconnect substrates, a semiconductor device and a method fo...
- Patent number 12,224,264
- Issue date Feb 11, 2025
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including passive devices and methods of for...
- Patent number 12,224,266
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Modular Package of Quantum Hardware
- Publication number 20250118675
- Publication date Apr 10, 2025
- International Business Machines Corporation
- Jae-Woong NAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTROMECHANICAL SYSTEMS (MEMS) AND RELATED PACKAGES
- Publication number 20250118715
- Publication date Apr 10, 2025
- Analog Devices, Inc.
- Xin Zhang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEM AND METHODS FOR AN EMBEDDED BRIDGE ARCHITECTURE
- Publication number 20250118720
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE SUBSTRATE PACKAGE SYSTEMS AND RELATED METHODS
- Publication number 20250118640
- Publication date Apr 10, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HONEYCOMB PATTERN FOR CONDUCTIVE FEATURES
- Publication number 20250118694
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shenggao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND POWER CONVERTER INCLUDING SAME
- Publication number 20250116700
- Publication date Apr 10, 2025
- Mitsubishi Heavy Industries, Ltd.
- Norihito Yanagita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND MANUFACTURING METHOD THEREFOR
- Publication number 20250118617
- Publication date Apr 10, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Huibin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING SUBSTRATE BUMP HEIGHT
- Publication number 20250112164
- Publication date Apr 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE CONNECTIONS FOR INTERCONNECT BRIDGES AND REL...
- Publication number 20250112165
- Publication date Apr 3, 2025
- Intel Corporation
- Brandon Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20250105161
- Publication date Mar 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Hao-Chih HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION MODULE SUBSTRATE FOR SEMICONDUCTOR PACKAGE, SEMICON...
- Publication number 20250105160
- Publication date Mar 27, 2025
- SILICON BOX PTE. LTD.
- Byung Joon HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250105116
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- JU-IL CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES
- Publication number 20250105136
- Publication date Mar 27, 2025
- Intel Corporation
- Kimin Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250105158
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Sung Min MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT LEVEL SEMICONDUCTOR PACKAGE
- Publication number 20250105159
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Pyunghwa Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILIC...
- Publication number 20250105222
- Publication date Mar 27, 2025
- Intel Corporation
- Gang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A BRIDGE LOCATED BETWEEN METALLIZATION PORTIONS
- Publication number 20250096207
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Yue LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGING STRUCTURE
- Publication number 20250096145
- Publication date Mar 20, 2025
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE OVER A GLASS PATCH
- Publication number 20250096053
- Publication date Mar 20, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCALABLE EMBEDDED SILICON BRIDGE VIA PILLARS IN LITHOGRAPHICALLY DE...
- Publication number 20250096197
- Publication date Mar 20, 2025
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20250096196
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250087590
- Publication date Mar 13, 2025
- Shinko Electric Industries Co., Ltd.
- Hisashi KANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250087596
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Jaesun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20250087641
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE
- Publication number 20250079420
- Publication date Mar 6, 2025
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20250079322
- Publication date Mar 6, 2025
- Shinko Electric Industries Co., Ltd.
- Kosuke TSUKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250079326
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20250079382
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Jaeean Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vertically Oriented Component Stack And Assembly
- Publication number 20250079419
- Publication date Mar 6, 2025
- KYOCERA AVX Components Corporation
- Jonathan Herr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package
- Publication number 20250079425
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Eunsil Kang
- H01 - BASIC ELECTRIC ELEMENTS

Assembly of a plurality of insulating substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package having interposer substrate

Heterogeneous nested interposer package for IC chips

Semiconductor package structure having interconnections between die...

Semiconductor package

Semiconductor package

Molded direct bonded and interconnected stack

Semiconductor packages including antenna pattern

Semiconductor package having an encapulant comprising conductive fi...

Semiconductor package

Electronic assembly having multiple substrate segments

Molded dies in semiconductor packages and methods of forming same

Secure semiconductor integration and method for making thereof

SIP package structure

Package structure, RDL structure comprising redistribution layer ha...

Microelectronic structures including bridges

Wirebondable interposer for flip chip packaged integrated circuit die

3D stack of split graphics processing logic dies

Circuit board with bridge chiplets

Package structure and methods of manufacturing the same

Carrier structure including pockets for accommodating semiconductor...

Semiconductor chiplet device

Package substrate z-disaggregation with liquid metal interconnects

Chip-on-film package and display apparatus including the same

Semiconductor device including power management die in a stack and...

Double-sided substrate with cavities for direct die-to-die intercon...

Method to enable 30 microns pitch EMIB or below

Semiconductor package and related methods

Method of manufacturing semiconductor package, and semiconductor pa...

Die interconnect substrates, a semiconductor device and a method fo...

Semiconductor packages including passive devices and methods of for...

Patents Applicationslast 30 patents

Modular Package of Quantum Hardware

MICROELECTROMECHANICAL SYSTEMS (MEMS) AND RELATED PACKAGES

SYSTEM AND METHODS FOR AN EMBEDDED BRIDGE ARCHITECTURE

MULTIPLE SUBSTRATE PACKAGE SYSTEMS AND RELATED METHODS

HONEYCOMB PATTERN FOR CONDUCTIVE FEATURES

POWER MODULE AND POWER CONVERTER INCLUDING SAME

POWER MODULE AND MANUFACTURING METHOD THEREFOR

CONTROLLING SUBSTRATE BUMP HEIGHT

ANISOTROPIC CONDUCTIVE CONNECTIONS FOR INTERCONNECT BRIDGES AND REL...

SEMICONDUCTOR DEVICE PACKAGE

INTERCONNECTION MODULE SUBSTRATE FOR SEMICONDUCTOR PACKAGE, SEMICON...

SEMICONDUCTOR PACKAGE

CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES

SEMICONDUCTOR PACKAGE

FAN-OUT LEVEL SEMICONDUCTOR PACKAGE

HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILIC...

PACKAGE COMPRISING A BRIDGE LOCATED BETWEEN METALLIZATION PORTIONS

ELECTRONIC PACKAGING STRUCTURE

MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE OVER A GLASS PATCH

SCALABLE EMBEDDED SILICON BRIDGE VIA PILLARS IN LITHOGRAPHICALLY DE...

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

Semiconductor Device and Method of Manufacture

MODULE

STACKED WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

Vertically Oriented Component Stack And Assembly

Semiconductor Package