Assembly of a plurality of insulating substrates

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H01L23/5385

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/5385Assembly of a plurality of insulating substrates

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,362,282
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Parameter exchange for a die-to-die interconnect
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- Issue date Jul 15, 2025
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- Debendra Das Sharma
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Composite interposer structure and method of providing same
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- Issue date Jul 15, 2025
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated circuit
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with redistribution structure and method for f...
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- Issue date Jul 8, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
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Information Patent Grant
Package comprising a substrate and a high-density interconnect inte...
- Patent number 12,355,000
- Issue date Jul 8, 2025
- QUALCOMM Incorporated
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lithographic cavity formation to enable EMIB bump pitch scaling
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- Issue date Jul 8, 2025
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive based on chip scale package comprising standardized com...
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- G11 - INFORMATION STORAGE
Information Patent Grant
Reconstituted substrate structure and fabrication methods for heter...
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Information Patent Grant
Logic die in a multi-chip package having a configurable physical in...
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- Narasimha Lanka
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Information Patent Grant
Semiconductor devices having penetration vias
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Information Patent Grant
Integrated circuit package with decoupling capacitors
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Information Patent Grant
Interconnection structure and semiconductor package including the same
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Information Patent Grant
Interconnect architecture with silicon interposer and EMIB
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- Md Altaf Hossain
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Information Patent Grant
Microelectronic assemblies with direct attach to circuit boards
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Information Patent Grant
Microelectronic assemblies having a hybrid bonded interposer for di...
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Information Patent Grant
Bare-die smart bridge connected with copper pillars for system-in-p...
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- Issue date Jun 24, 2025
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- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
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- Kenichi Koi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrateless double-sided embedded multi-die interconnect bridge
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- Issue date Jun 24, 2025
- Intel Corporation
- Biancun Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,334,452
- Issue date Jun 17, 2025
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- Chao-Chiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated package including device dies connected via interconne...
- Patent number 12,334,464
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lithographic cavity formation to enable EMIB bump pitch scaling
- Patent number 12,334,443
- Issue date Jun 17, 2025
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die coupling using a substrate with a glass core
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- Issue date Jun 10, 2025
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ASIC package with photonics and vertical power delivery
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- Issue date Jun 10, 2025
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- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including redistribution substrate
- Patent number 12,327,824
- Issue date Jun 10, 2025
- Samsung Electronics Co., Ltd.
- Dongkyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Eccentric via structures for stress reduction
- Patent number 12,322,703
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with underfill
- Patent number 12,322,704
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,315,831
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic wafer communication systems and related packages
- Patent number 12,306,434
- Issue date May 20, 2025
- Lightmatter, Inc.
- Sukeshwar Kannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures to increase substrate routing density and methods of for...
- Patent number 12,308,321
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY WITH EDGE...
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COMMUNICATION SYSTEM BETWEEN DIES AND OPERATION METHOD THEREOF
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- G06 - COMPUTING CALCULATING COUNTING
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ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
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SEMICONDUCTOR PACKAGE ASSEMBLY WITH AN INTERLAYER COOLING PATHWAY
- Publication number 20250226288
- Publication date Jul 10, 2025
- STATS ChipPAC Pte Ltd.
- JiSeon LEE
- H01 - BASIC ELECTRIC ELEMENTS
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COMMUNICATION SYSTEM BETWEEN DIES AND OPERATION METHOD THEREOF
- Publication number 20250225101
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- GLOBAL UNICHIP CORPORATION
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PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250226325
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- Chung W. Ho
- H01 - BASIC ELECTRIC ELEMENTS
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PHOTOELECTRIC DEVICE, OPTICAL TRANSCEIVER, AND METHOD OF OPERATING...
- Publication number 20250226373
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- H01 - BASIC ELECTRIC ELEMENTS
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ELECTROLESS NICKEL-ELECTROLESS PALLADIUM-IMMERSION GOLD (ENEPIG) AS...
- Publication number 20250218924
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- Prithwish Chatterjee
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SEMICONDUCTOR PACKAGE
- Publication number 20250218969
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Hongwon KIM
- H01 - BASIC ELECTRIC ELEMENTS
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HYBRID BONDING STRUCTURE AND DISPLAY PANEL
- Publication number 20250219033
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- Industrial Technology Research Institute
- Jui-Wen Yang
- H01 - BASIC ELECTRIC ELEMENTS
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POWER MODULES
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- Hyundai Motor Company
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ELECTROLESS NICKEL-ELECTROLESS PALLADIUM-IMMERSION GOLD (ENEPIG) WI...
- Publication number 20250218925
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- Shruti Sharma
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SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME
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PACKAGE AND METHOD FOR MANUFACTURING PACKAGE
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SEMICONDUCTOR PACKAGE
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- Samsung Electronics Co., Ltd.
- JIWON SHIN
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- Takumi Yumoto
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Information Patent Application
STACKED PACKAGE DEVICE WITH INTERCONNECTED SUBSTRATES
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- HUNG HSIN HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
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- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Sang Ho SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20250210531
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Kyungkyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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- ROHM CO., LTD.
- Oji SATO
- H01 - BASIC ELECTRIC ELEMENTS
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INTEGRATED CIRCUIT PACKAGES WITH THERMAL RESERVOIR DIES AND METHODS...
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- Lipu Kris Chuang
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Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
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- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Minjin Kim
- H01 - BASIC ELECTRIC ELEMENTS
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INTEGRATED CIRCUIT PACKAGES WITH STIFFENERS CONTAINING SEMICONDUCTO...
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- Publication date Jun 26, 2025
- Intel Corporation
- Jackson Chung Peng Kong
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STACKED PACKAGE DEVICE WITH INTERCONNECTED CONDUCTIVE BUMPS
- Publication number 20250210482
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- Powertech Technology Inc.
- HUNG HSIN HSU
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SEMICONDUCTOR DEVICE
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- Kabushiki Kaisha Toshiba
- Masashi ISHII
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FI...
- Publication number 20250210452
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210481
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Eunsu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Package and Manufacturing Method Thereof
- Publication number 20250210527
- Publication date Jun 26, 2025
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20250210534
- Publication date Jun 26, 2025
- Shinko Electric Industries Co., Ltd.
- Yoichi NISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS

Assembly of a plurality of insulating substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structure and manufacturing method thereof

Parameter exchange for a die-to-die interconnect

Composite interposer structure and method of providing same

Three-dimensional integrated circuit

Semiconductor device with redistribution structure and method for f...

Package comprising a substrate and a high-density interconnect inte...

Lithographic cavity formation to enable EMIB bump pitch scaling

Logic drive based on chip scale package comprising standardized com...

Reconstituted substrate structure and fabrication methods for heter...

Logic die in a multi-chip package having a configurable physical in...

Semiconductor devices having penetration vias

Integrated circuit package with decoupling capacitors

Interconnection structure and semiconductor package including the same

Interconnect architecture with silicon interposer and EMIB

Microelectronic assemblies with direct attach to circuit boards

Microelectronic assemblies having a hybrid bonded interposer for di...

Bare-die smart bridge connected with copper pillars for system-in-p...

Semiconductor device

Substrateless double-sided embedded multi-die interconnect bridge

Electronic package and manufacturing method thereof

Encapsulated package including device dies connected via interconne...

Lithographic cavity formation to enable EMIB bump pitch scaling

Die coupling using a substrate with a glass core

ASIC package with photonics and vertical power delivery

Semiconductor package including redistribution substrate

Eccentric via structures for stress reduction

Package structure with underfill

Package structure and manufacturing method thereof

Photonic wafer communication systems and related packages

Structures to increase substrate routing density and methods of for...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY WITH EDGE...

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY WITH EDGE...

COMMUNICATION SYSTEM BETWEEN DIES AND OPERATION METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE ASSEMBLY WITH AN INTERLAYER COOLING PATHWAY

COMMUNICATION SYSTEM BETWEEN DIES AND OPERATION METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PHOTOELECTRIC DEVICE, OPTICAL TRANSCEIVER, AND METHOD OF OPERATING...

ELECTROLESS NICKEL-ELECTROLESS PALLADIUM-IMMERSION GOLD (ENEPIG) AS...

SEMICONDUCTOR PACKAGE

HYBRID BONDING STRUCTURE AND DISPLAY PANEL

POWER MODULES

ELECTROLESS NICKEL-ELECTROLESS PALLADIUM-IMMERSION GOLD (ENEPIG) WI...

SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME

PACKAGE AND METHOD FOR MANUFACTURING PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

STACKED PACKAGE DEVICE WITH INTERCONNECTED SUBSTRATES

SEMICONDUCTOR PACKAGE

DISPLAY DEVICE

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT PACKAGES WITH THERMAL RESERVOIR DIES AND METHODS...

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

INTEGRATED CIRCUIT PACKAGES WITH STIFFENERS CONTAINING SEMICONDUCTO...

STACKED PACKAGE DEVICE WITH INTERCONNECTED CONDUCTIVE BUMPS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FI...

SEMICONDUCTOR PACKAGE

Electronic Package and Manufacturing Method Thereof

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE