Assembly of a plurality of insulating substrates

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H01L23/5385

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/5385Assembly of a plurality of insulating substrates

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Die coupling using a substrate with a glass core
- Patent number 12,327,794
- Issue date Jun 10, 2025
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ASIC package with photonics and vertical power delivery
- Patent number 12,327,817
- Issue date Jun 10, 2025
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including redistribution substrate
- Patent number 12,327,824
- Issue date Jun 10, 2025
- Samsung Electronics Co., Ltd.
- Dongkyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Eccentric via structures for stress reduction
- Patent number 12,322,703
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with underfill
- Patent number 12,322,704
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,315,831
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic wafer communication systems and related packages
- Patent number 12,306,434
- Issue date May 20, 2025
- Lightmatter, Inc.
- Sukeshwar Kannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures to increase substrate routing density and methods of for...
- Patent number 12,308,321
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,308,336
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Jungho Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package
- Patent number 12,308,308
- Issue date May 20, 2025
- Siliconware Precision Industries Co., Ltd.
- Sung-Hua Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-sided routing in 3D semiconductor system-in-package structure...
- Patent number 12,308,322
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,300,624
- Issue date May 13, 2025
- INNOLUX CORPORATION
- Jen-Hai Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip with solid-state power storage device
- Patent number 12,302,628
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi Ching Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bypass structure
- Patent number 12,297,097
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Eason Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Die interconnect substrate, an electrical device and a method for f...
- Patent number 12,300,613
- Issue date May 13, 2025
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packages including redistribution layers with carbon-based c...
- Patent number 12,300,622
- Issue date May 13, 2025
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonics integrated circuit package
- Patent number 12,293,974
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Communication system between dies and operation method thereof
- Patent number 12,292,850
- Issue date May 6, 2025
- Global Unichip Corporation
- Yung-Sheng Fang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power semiconductor module
- Patent number 12,293,973
- Issue date May 6, 2025
- HITACHI ENERGY LTD
- Slavo Kicin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and method for manufacturing same
- Patent number 12,288,940
- Issue date Apr 29, 2025
- AMOSENSE CO., LTD.
- Jonguk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,288,780
- Issue date Apr 29, 2025
- Samsung Electronics Co., Ltd.
- Ju-Youn Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for delivering power to semiconductors
- Patent number 12,289,050
- Issue date Apr 29, 2025
- Vicor Corporation
- Patrizio Vinciarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnection using fanout interposer chiplet
- Patent number 12,283,549
- Issue date Apr 22, 2025
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,278,189
- Issue date Apr 15, 2025
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package structure having inte...
- Patent number 12,278,190
- Issue date Apr 15, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having interposer substrate
- Patent number 12,272,628
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Yanggyoo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous nested interposer package for IC chips
- Patent number 12,272,656
- Issue date Apr 8, 2025
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having interconnections between die...
- Patent number 12,272,651
- Issue date Apr 8, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,272,652
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Jiwon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,266,638
- Issue date Apr 1, 2025
- Samsung Electronics Co., Ltd.
- Sangcheon Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MODULAR PACKAGE STRUCTURES WITH INTERPOSERS HAVING ALIGNMENT FEATURES
- Publication number 20250192064
- Publication date Jun 12, 2025
- International Business Machines Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTEGRATED STACK CAPACITOR AND METHOD OF...
- Publication number 20250192121
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250192131
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND PACKGING METHOD
- Publication number 20250191936
- Publication date Jun 12, 2025
- Semiconductor Manufacturing International (Shanghai) Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250192060
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250191991
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER AND METHOD FOR MANUFACTU...
- Publication number 20250192019
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Module and Power Conversion Device
- Publication number 20250192061
- Publication date Jun 12, 2025
- Hitachi Astemo, Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250194007
- Publication date Jun 12, 2025
- InnoLux Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183186
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Sungoh Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250183187
- Publication date Jun 5, 2025
- DENSO CORPORATION
- Tetsuya OKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE
- Publication number 20250183190
- Publication date Jun 5, 2025
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183242
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Seokgeun Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE, RDL STRUCTURE COMPRISING REDIS...
- Publication number 20250183143
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE HAVING A PLURALITY OF CHIPLETS
- Publication number 20250181477
- Publication date Jun 5, 2025
- Rebellions Inc.
- Young-Jae Jin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WIRING BOARD AND SEMICONDUCTOR DEVICE
- Publication number 20250183184
- Publication date Jun 5, 2025
- Shinko Electric Industries Co., Ltd.
- Hiroshi TANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183214
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- SEUNGSOO HA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183241
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250183243
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183195
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183103
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Hyunjung Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIP MODULE WITH STILTED INTERCONNECTS
- Publication number 20250183183
- Publication date Jun 5, 2025
- Qorvo US, Inc.
- Kelly M. Lear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electric Device and Manufacturing Method thereof
- Publication number 20250183188
- Publication date Jun 5, 2025
- InnoLux Corporation
- Kuang-Ming FAN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DISPLAY APPARATUS
- Publication number 20250185173
- Publication date Jun 5, 2025
- SAMSUNG DISPLAY CO., LTD.
- WONTAE KIM
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
GLASS INTERPOSER SEMICONDUCTOR PACKAGE WITH INTEGRATED STACK CAPACI...
- Publication number 20250174567
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Yan LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250174516
- Publication date May 29, 2025
- Fuji Electric Co., Ltd.
- Tsubasa WATAKABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250174568
- Publication date May 29, 2025
- InnoLux Corporation
- Po-Yun HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULE AND COMMUNICATION DEVICE HAVING THE SAME MOUNTED THE...
- Publication number 20250174876
- Publication date May 29, 2025
- Murata Manufacturing Co., Ltd.
- Naotaka OIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULES
- Publication number 20250169375
- Publication date May 22, 2025
- Hyundai Motor Company
- Suk Hyun LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
- Publication number 20250167062
- Publication date May 22, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS

Assembly of a plurality of insulating substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Die coupling using a substrate with a glass core

ASIC package with photonics and vertical power delivery

Semiconductor package including redistribution substrate

Eccentric via structures for stress reduction

Package structure with underfill

Package structure and manufacturing method thereof

Photonic wafer communication systems and related packages

Structures to increase substrate routing density and methods of for...

Semiconductor package

Electronic package

Dual-sided routing in 3D semiconductor system-in-package structure...

Electronic device

Integrated chip with solid-state power storage device

Bypass structure

Die interconnect substrate, an electrical device and a method for f...

Device packages including redistribution layers with carbon-based c...

Photonics integrated circuit package

Communication system between dies and operation method thereof

Power semiconductor module

Power module and method for manufacturing same

Semiconductor package

Method and apparatus for delivering power to semiconductors

High density interconnection using fanout interposer chiplet

Electronic package and manufacturing method thereof

Manufacturing method of semiconductor package structure having inte...

Semiconductor package having interposer substrate

Heterogeneous nested interposer package for IC chips

Semiconductor package structure having interconnections between die...

Semiconductor package

Semiconductor package

Patents Applicationslast 30 patents

MODULAR PACKAGE STRUCTURES WITH INTERPOSERS HAVING ALIGNMENT FEATURES

SEMICONDUCTOR DEVICE WITH INTEGRATED STACK CAPACITOR AND METHOD OF...

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE AND PACKGING METHOD

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER AND METHOD FOR MANUFACTU...

Semiconductor Module and Power Conversion Device

ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE

MODULE

SEMICONDUCTOR PACKAGE

METHOD OF FORMING PACKAGE STRUCTURE, RDL STRUCTURE COMPRISING REDIS...

ELECTRONIC DEVICE HAVING A PLURALITY OF CHIPLETS

WIRING BOARD AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SIP MODULE WITH STILTED INTERCONNECTS

Electric Device and Manufacturing Method thereof

DISPLAY APPARATUS

GLASS INTERPOSER SEMICONDUCTOR PACKAGE WITH INTEGRATED STACK CAPACI...

SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE

ANTENNA MODULE AND COMMUNICATION DEVICE HAVING THE SAME MOUNTED THE...

POWER MODULES

MICROELECTRONIC STRUCTURES INCLUDING BRIDGES