Assembly of a plurality of insulating substrates

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CPC
H01L23/5385

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/5385Assembly of a plurality of insulating substrates

Industries

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Patents Grantslast 30 patents

Information Patent Grant
SIP package structure
- Patent number 12,249,582
- Issue date Mar 11, 2025
- JCET GROUP CO., LTD.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure, RDL structure comprising redistribution layer ha...
- Patent number 12,249,564
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures including bridges
- Patent number 12,243,792
- Issue date Mar 4, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wirebondable interposer for flip chip packaged integrated circuit die
- Patent number 12,243,840
- Issue date Mar 4, 2025
- Samtec, Inc.
- Edwin Loy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D stack of split graphics processing logic dies
- Patent number 12,243,797
- Issue date Mar 4, 2025
- Kepler Computing Inc.
- Amrita Mathuriya
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board with bridge chiplets
- Patent number 12,238,872
- Issue date Feb 25, 2025
- Advanced Micro Devices, Inc.
- Robert N. McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and methods of manufacturing the same
- Patent number 12,237,277
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier structure including pockets for accommodating semiconductor...
- Patent number 12,230,575
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Hyeongmun Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chiplet device
- Patent number 12,230,578
- Issue date Feb 18, 2025
- Global Unichip Corporation
- Sheng-Fan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate z-disaggregation with liquid metal interconnects
- Patent number 12,230,564
- Issue date Feb 18, 2025
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-film package and display apparatus including the same
- Patent number 12,230,576
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Jaemin Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including power management die in a stack and...
- Patent number 12,230,607
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Double-sided substrate with cavities for direct die-to-die intercon...
- Patent number 12,230,610
- Issue date Feb 18, 2025
- Intel Corporation
- Pooya Tadayon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to enable 30 microns pitch EMIB or below
- Patent number 12,230,563
- Issue date Feb 18, 2025
- Intel Corporation
- Hongxia Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 12,230,606
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package, and semiconductor pa...
- Patent number 12,230,580
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Junghoon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die interconnect substrates, a semiconductor device and a method fo...
- Patent number 12,224,264
- Issue date Feb 11, 2025
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including passive devices and methods of for...
- Patent number 12,224,266
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-wafer coaxial transition
- Patent number 12,218,067
- Issue date Feb 4, 2025
- HRL Laboratories, LLC
- Florian G. Herrault
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 12,218,077
- Issue date Feb 4, 2025
- Advanced Semiconductor Engineering, Inc.
- Cheng-Nan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus
- Patent number 12,219,710
- Issue date Feb 4, 2025
- Samsung Display Co., Ltd.
- Wontae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembling on adhesion layer or dielectric layer, extending be...
- Patent number 12,218,098
- Issue date Feb 4, 2025
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation structure with planar top surfaces
- Patent number 12,218,022
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer, semiconductor package including the same, and method of...
- Patent number 12,218,043
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,218,044
- Issue date Feb 4, 2025
- Renesas Electronics Corporation
- Nobuhiro Kinoshita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making a photonic semiconductor...
- Patent number 12,218,114
- Issue date Feb 4, 2025
- STATS ChipPAC Pte. Ltd.
- KyungOe Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure for heat dissipation
- Patent number 12,218,026
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded silicon interconnects in bridges for integrated-circuit pack...
- Patent number 12,218,064
- Issue date Feb 4, 2025
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with dummy pattern not electrically connected...
- Patent number 12,211,806
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Jin-Woo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple substrate package systems and related methods
- Patent number 12,211,775
- Issue date Jan 28, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MODULE
- Publication number 20250079420
- Publication date Mar 6, 2025
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20250079322
- Publication date Mar 6, 2025
- Shinko Electric Industries Co., Ltd.
- Kosuke TSUKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250079326
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20250079382
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Jaeean Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vertically Oriented Component Stack And Assembly
- Publication number 20250079419
- Publication date Mar 6, 2025
- KYOCERA AVX Components Corporation
- Jonathan Herr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package
- Publication number 20250079425
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Eunsil Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250079253
- Publication date Mar 6, 2025
- Kabushiki Kaisha Toshiba
- Kento ADACHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250079320
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vertically Oriented Interposer Stack And Assembly
- Publication number 20250079321
- Publication date Mar 6, 2025
- KYOCERA AVX Components Corporation
- Jonathan Herr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNMENT STRUCTURES FOR DIE PICK-AND-PLACEMENT AND METHODS OF USIN...
- Publication number 20250079329
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250079338
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Sunggu KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vertical Component Stack And Assembly
- Publication number 20250079404
- Publication date Mar 6, 2025
- KYOCERA AVX Components Corporation
- Jonathan Herr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power converter package with shielding against common mode conducte...
- Publication number 20250079332
- Publication date Mar 6, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Andreas Munding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERTER, EMBEDDED INTEGRATED DEVICE UNIT, HIGH-HEAT-DISSIPA...
- Publication number 20250079353
- Publication date Mar 6, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Jianhong ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR PACKAGE WITH DIE-MOUNTED VOLTAGE REGULATOR
- Publication number 20250070031
- Publication date Feb 27, 2025
- ADVANCED MICRO DEVICES, INC.
- Gabriel H LOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH VARIABLE SOLDER RESIST OPENING DIMENSION...
- Publication number 20250070033
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Tsung-Yen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND PACKAGE STRUCTURE
- Publication number 20250070006
- Publication date Feb 27, 2025
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
- Publication number 20250070056
- Publication date Feb 27, 2025
- Intel Corporation
- Dae-Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER
- Publication number 20250070032
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Jong-youn Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250070057
- Publication date Feb 27, 2025
- Fuji Electric Co., Ltd.
- Hiroaki ICHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062266
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Gyunghwan Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062237
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Kwangsoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY HIGH-POWER DENSITY MODULE POWER SUPPLY, PARALLEL COM...
- Publication number 20250062243
- Publication date Feb 20, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Jianhong ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062186
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Junghoo Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250054917
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Eunseok Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250054846
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Jaesun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE BRIDGE AND METHOD FOR MANUFACTURING IT
- Publication number 20250054868
- Publication date Feb 13, 2025
- ROBERT BOSCH GmbH
- Irfan AYDOGMUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250054900
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Yen Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PACKAGE
- Publication number 20250046724
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Eunsu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS FOR FORMING THE SAME
- Publication number 20250046726
- Publication date Feb 6, 2025
- STATS ChipPAC Pte Ltd.
- MingYu KIM
- H01 - BASIC ELECTRIC ELEMENTS

Assembly of a plurality of insulating substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

SIP package structure

Package structure, RDL structure comprising redistribution layer ha...

Microelectronic structures including bridges

Wirebondable interposer for flip chip packaged integrated circuit die

3D stack of split graphics processing logic dies

Circuit board with bridge chiplets

Package structure and methods of manufacturing the same

Carrier structure including pockets for accommodating semiconductor...

Semiconductor chiplet device

Package substrate z-disaggregation with liquid metal interconnects

Chip-on-film package and display apparatus including the same

Semiconductor device including power management die in a stack and...

Double-sided substrate with cavities for direct die-to-die intercon...

Method to enable 30 microns pitch EMIB or below

Semiconductor package and related methods

Method of manufacturing semiconductor package, and semiconductor pa...

Die interconnect substrates, a semiconductor device and a method fo...

Semiconductor packages including passive devices and methods of for...

Through-wafer coaxial transition

Semiconductor device package

Display apparatus

Chip assembling on adhesion layer or dielectric layer, extending be...

Passivation structure with planar top surfaces

Interposer, semiconductor package including the same, and method of...

Semiconductor device

Semiconductor device and method of making a photonic semiconductor...

Package structure for heat dissipation

Molded silicon interconnects in bridges for integrated-circuit pack...

Semiconductor package with dummy pattern not electrically connected...

Multiple substrate package systems and related methods

Patents Applicationslast 30 patents

MODULE

STACKED WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

Vertically Oriented Component Stack And Assembly

Semiconductor Package

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGES

Vertically Oriented Interposer Stack And Assembly

ALIGNMENT STRUCTURES FOR DIE PICK-AND-PLACEMENT AND METHODS OF USIN...

SEMICONDUCTOR PACKAGE

Vertical Component Stack And Assembly

Power converter package with shielding against common mode conducte...

POWER CONVERTER, EMBEDDED INTEGRATED DEVICE UNIT, HIGH-HEAT-DISSIPA...

3D SEMICONDUCTOR PACKAGE WITH DIE-MOUNTED VOLTAGE REGULATOR

SEMICONDUCTOR PACKAGE WITH VARIABLE SOLDER RESIST OPENING DIMENSION...

PACKAGE SUBSTRATE AND PACKAGE STRUCTURE

METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

HIGH-FREQUENCY HIGH-POWER DENSITY MODULE POWER SUPPLY, PARALLEL COM...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

POWER MODULE BRIDGE AND METHOD FOR MANUFACTURING IT

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SUBSTRATE PACKAGE

SEMICONDUCTOR DEVICES AND METHODS FOR FORMING THE SAME