Assembly of a plurality of insulating substrates

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H01L23/5385

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/5385Assembly of a plurality of insulating substrates

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Photonic wafer communication systems and related packages
- Patent number 12,306,434
- Issue date May 20, 2025
- Lightmatter, Inc.
- Sukeshwar Kannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures to increase substrate routing density and methods of for...
- Patent number 12,308,321
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,308,336
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Jungho Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package
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- Issue date May 20, 2025
- Siliconware Precision Industries Co., Ltd.
- Sung-Hua Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-sided routing in 3D semiconductor system-in-package structure...
- Patent number 12,308,322
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
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- Issue date May 13, 2025
- INNOLUX CORPORATION
- Jen-Hai Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip with solid-state power storage device
- Patent number 12,302,628
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi Ching Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bypass structure
- Patent number 12,297,097
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Eason Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Die interconnect substrate, an electrical device and a method for f...
- Patent number 12,300,613
- Issue date May 13, 2025
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packages including redistribution layers with carbon-based c...
- Patent number 12,300,622
- Issue date May 13, 2025
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonics integrated circuit package
- Patent number 12,293,974
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Communication system between dies and operation method thereof
- Patent number 12,292,850
- Issue date May 6, 2025
- Global Unichip Corporation
- Yung-Sheng Fang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power semiconductor module
- Patent number 12,293,973
- Issue date May 6, 2025
- HITACHI ENERGY LTD
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Information Patent Grant
Power module and method for manufacturing same
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- Issue date Apr 29, 2025
- AMOSENSE CO., LTD.
- Jonguk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
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- Issue date Apr 29, 2025
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- Ju-Youn Choi
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Information Patent Grant
Method and apparatus for delivering power to semiconductors
- Patent number 12,289,050
- Issue date Apr 29, 2025
- Vicor Corporation
- Patrizio Vinciarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnection using fanout interposer chiplet
- Patent number 12,283,549
- Issue date Apr 22, 2025
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,278,189
- Issue date Apr 15, 2025
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package structure having inte...
- Patent number 12,278,190
- Issue date Apr 15, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having interposer substrate
- Patent number 12,272,628
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Yanggyoo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous nested interposer package for IC chips
- Patent number 12,272,656
- Issue date Apr 8, 2025
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having interconnections between die...
- Patent number 12,272,651
- Issue date Apr 8, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,272,652
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Jiwon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,266,638
- Issue date Apr 1, 2025
- Samsung Electronics Co., Ltd.
- Sangcheon Park
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Information Patent Grant
Molded direct bonded and interconnected stack
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- Issue date Apr 1, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including antenna pattern
- Patent number 12,261,135
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Se Ho You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an encapulant comprising conductive fi...
- Patent number 12,261,095
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,261,105
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Myungsam Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly having multiple substrate segments
- Patent number 12,261,110
- Issue date Mar 25, 2025
- Tesla, Inc.
- Mengzhi Pang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded dies in semiconductor packages and methods of forming same
- Patent number 12,261,163
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
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- Publication date May 22, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME
- Publication number 20250167126
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Han LEE
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Sangcheon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULES
- Publication number 20250169375
- Publication date May 22, 2025
- Hyundai Motor Company
- Suk Hyun LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Efficient Fan-Out (FO) Space Utilization in Package-On-Package (POP...
- Publication number 20250167186
- Publication date May 22, 2025
- Google LLC
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A STIFFENER
- Publication number 20250167135
- Publication date May 22, 2025
- STATS ChipPAC Pte Ltd.
- Jongkook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHODS OF MANUFACTURING THE SAME
- Publication number 20250167138
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250167163
- Publication date May 22, 2025
- ROHM CO., LTD.
- Kazunori FUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING POWER MANAGEMENT DIE IN A STACK AND...
- Publication number 20250167177
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET
- Publication number 20250157939
- Publication date May 15, 2025
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH
- Publication number 20250157985
- Publication date May 15, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE FOR HEAT DISSIPATION
- Publication number 20250157876
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A CONDUCTIVE PILLAR
- Publication number 20250157902
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS FORMED UTILIZING DU...
- Publication number 20250157956
- Publication date May 15, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE, ELECTRONIC DEVICE, AND PACKAGING METHOD OF...
- Publication number 20250157999
- Publication date May 15, 2025
- Huawei Technologies Co., Ltd
- Jinwen Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE INTERCONNECT SUBSTRATES, A SEMICONDUCTOR DEVICE AND A METHOD FO...
- Publication number 20250149501
- Publication date May 8, 2025
- Intel Corporation
- Rahul JAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY SWITCH CIRCUIT SYSTEM
- Publication number 20250151390
- Publication date May 8, 2025
- Industrial Technology Research Institute
- Jie ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20250149512
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE INTERMEDIATE, REDISTRI...
- Publication number 20250149527
- Publication date May 8, 2025
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEW METHOD TO ENABLE 30 MICRONS PITCH EMIB OR BELOW
- Publication number 20250149433
- Publication date May 8, 2025
- Intel Corporation
- Hongxia FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250149457
- Publication date May 8, 2025
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yu HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE ASSEMBLY AND A METHOD FOR FORMING THE SAME
- Publication number 20250140773
- Publication date May 1, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION STRUCTURE WITH PLANAR TOP SURFACES
- Publication number 20250140627
- Publication date May 1, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUS SYSTEM FOR A HIGH-POWER CONVERTER CIRCUIT
- Publication number 20250140706
- Publication date May 1, 2025
- Eaton Intelligent Power Limited
- Geraldo NOJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PA...
- Publication number 20250140709
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Junghoon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING PASSIVE DEVICES AND METHODS OF FOR...
- Publication number 20250140744
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250132261
- Publication date Apr 24, 2025
- Advanced Semiconductor Engineering, Inc.
- Chao Wei LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250132277
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Seokbeom Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF...
- Publication number 20250132238
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES
- Publication number 20250132259
- Publication date Apr 24, 2025
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS

Assembly of a plurality of insulating substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Photonic wafer communication systems and related packages

Structures to increase substrate routing density and methods of for...

Semiconductor package

Electronic package

Dual-sided routing in 3D semiconductor system-in-package structure...

Electronic device

Integrated chip with solid-state power storage device

Bypass structure

Die interconnect substrate, an electrical device and a method for f...

Device packages including redistribution layers with carbon-based c...

Photonics integrated circuit package

Communication system between dies and operation method thereof

Power semiconductor module

Power module and method for manufacturing same

Semiconductor package

Method and apparatus for delivering power to semiconductors

High density interconnection using fanout interposer chiplet

Electronic package and manufacturing method thereof

Manufacturing method of semiconductor package structure having inte...

Semiconductor package having interposer substrate

Heterogeneous nested interposer package for IC chips

Semiconductor package structure having interconnections between die...

Semiconductor package

Semiconductor package

Molded direct bonded and interconnected stack

Semiconductor packages including antenna pattern

Semiconductor package having an encapulant comprising conductive fi...

Semiconductor package

Electronic assembly having multiple substrate segments

Molded dies in semiconductor packages and methods of forming same

Patents Applicationslast 30 patents

MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE

POWER MODULES

Efficient Fan-Out (FO) Space Utilization in Package-On-Package (POP...

SEMICONDUCTOR PACKAGE INCLUDING A STIFFENER

PACKAGE STRUCTURE AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE INCLUDING POWER MANAGEMENT DIE IN A STACK AND...

HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET

SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH

PACKAGE STRUCTURE FOR HEAT DISSIPATION

SEMICONDUCTOR PACKAGE INCLUDING A CONDUCTIVE PILLAR

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS FORMED UTILIZING DU...

CHIP PACKAGE STRUCTURE, ELECTRONIC DEVICE, AND PACKAGING METHOD OF...

DIE INTERCONNECT SUBSTRATES, A SEMICONDUCTOR DEVICE AND A METHOD FO...

ARRAY SWITCH CIRCUIT SYSTEM

SEMICONDUCTOR PACKAGE AND RELATED METHODS

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE INTERMEDIATE, REDISTRI...

NEW METHOD TO ENABLE 30 MICRONS PITCH EMIB OR BELOW

ELECTRONIC DEVICE

ELECTRONIC PACKAGE ASSEMBLY AND A METHOD FOR FORMING THE SAME

PASSIVATION STRUCTURE WITH PLANAR TOP SURFACES

BUS SYSTEM FOR A HIGH-POWER CONVERTER CIRCUIT

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PA...

SEMICONDUCTOR PACKAGES INCLUDING PASSIVE DEVICES AND METHODS OF FOR...

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

INTERPOSER, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF...

MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES