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POWER MODULE
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Publication date Apr 25, 2024
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Hyundai Motor Company
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Sung Taek HWANG
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H01 - BASIC ELECTRIC ELEMENTS
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MULTI-CHIP PACKAGING
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Publication number 20240128256
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Publication date Apr 18, 2024
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Intel Corporation
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Robert L. Sankman
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20240120280
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Publication date Apr 11, 2024
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Samsung Electronics Co., Ltd.
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Kyungdon Mun
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H01 - BASIC ELECTRIC ELEMENTS
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PACKAGED INTERCONNECT STRUCTURES
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Publication number 20240113032
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Publication date Apr 4, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Kai-Fung CHANG
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20240105662
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Publication date Mar 28, 2024
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Samsung Electronics Co., Ltd.
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Jungho SHIM
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20240079349
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Publication date Mar 7, 2024
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Samsung Electronics Co., Ltd.
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Yanggyoo Jung
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H01 - BASIC ELECTRIC ELEMENTS