at the bonding interface of the bump connector

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/13553at the bonding interface of the bump connector

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Patents Grantslast 30 patents

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Information Patent Grant
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at the bonding interface of the bump connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and method of manufacturing semiconductor pac...

Flip chip package unit comprising thermal protection film and assoc...

Semiconductor device with solder on pillar

Semiconductor package

Semiconductor structures and methods for forming the same

Low temperature hybrid bonding structures and manufacturing method...

Semiconductor devices

Metallic interconnect, a method of manufacturing a metallic interco...

Semiconductor package

Microelectronic substrate having embedded trace layers with integra...

Semicondcutor device and manufacturing method thereof

Semiconductor package

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Microelectronic substrate having embedded trace layers with integra...

Semiconductor device having a cylindrical shaped conductive portion

Semiconductor device and method of forming patterned repassivation...

Mounting structure and manufacturing method for same

Semiconductor device and method of forming flipchip interconnection...

Metal contact for chip packaging structure

Semiconductor device and method of forming patterned repassivation...

Semiconductor device having external connection terminals and metho...

Manufacturing method of contact structure

Contact structure having a compliant bump and a test pad

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH SOLDER ON PILLAR

SEMICONDUCTOR PACKAGE

MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE WITH A LINED-INTERCO...

SEMICONDUCTOR STRUCTURE HAVING COPPER PILLAR WITHIN SOLDER BUMP AND...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

FLIP CHIP BONDING METHOD AND CHIP USED THEREIN

ELECTRONIC DEVICE WITH SENSOR FACE STRESS PROTECTION

SEMICONDUCTOR STRUCTURES AND METHODS FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

SEMICONDUCTOR PACKAGE INCLUDING CHIP CONNECTION STRUCTURE

TERMINAL STRUCTURE AND WIRING SUBSTRATE

FLIP CHIP PACKAGE UNIT AND ASSOCIATED PACKAGING METHOD

PACKAGE STRUCTURE AND FORMING METHOD THEREOF

ELECTRICALLY CONDUCTIVE PILLAR, BONDING STRUCTURE, ELECTRONIC DEVIC...

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CHIP STRUCTURE, CHIP BONDING STRUCTURE USING THE SAME, AND MANUFACT...

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