at the bonding interface of the layer connector

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H01L2224/29019

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/29019at the bonding interface of the layer connector

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Patents Grantslast 30 patents

Information Patent Grant
Bonded structures
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- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
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- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Selective transfer of micro devices
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Information Patent Grant
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Information Patent Grant
Seal ring structures and methods of forming same
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Information Patent Grant
Selective micro device transfer to receiver substrate
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Information Patent Grant
Selective micro device transfer to receiver substrate
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Information Patent Grant
Selective micro device transfer to receiver substrate
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Information Patent Grant
Selective micro device transfer to receiver substrate
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Information Patent Grant
Selective micro device transfer to receiver substrate
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
Selective micro device transfer to receiver substrate
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Information Patent Grant
Seal ring structures and methods of forming same
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Information Patent Grant
Electrical connecting structure having nano-twins copper and method...
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Information Patent Grant
Bonded structure and method of manufacturing the same
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Information Patent Grant
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Seal ring structures and methods of forming same
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Information Patent Grant
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Information Patent Grant
Seal ring structures and methods of forming same
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Information Patent Grant
Method for cohesively connecting a first component of a power semic...
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- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic sandwich structure with two parts joined together by mea...
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, mechanical quantity measuring device, and sem...
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- Issue date Apr 2, 2019
- Hitachi Automotive Systems, Ltd.
- Hanae Shimokawa
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
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BONDED STRUCTURES
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CHIP-ON-FILM PACKAGE
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MEMBER, CONDUCTIVE LAYER, METHOD FOR MANUFACTURING MEMBER, AND METH...
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WAFER LEVEL CHIP SCALE PACKAGE OF POWER SEMICONDUCTOR AND MANUFACUT...
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- Magnachip Semiconductor, Ltd.
- Myungho PARK
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INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
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DISPLAY PANEL AND DISPLAY APPARATUS
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- Zengyan FAN
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PACKAGE STRUCTURE AND METHOD FOR FABRICATING SAME
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- H01 - BASIC ELECTRIC ELEMENTS
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ELECTRICAL CONNECTING STRUCTURE HAVING NANO-TWINS COPPER
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- National Yang Ming Chiao Tung University
- Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
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- Publication number 20210243894
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- VueReal Inc.
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- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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BONDED STRUCTURES
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- INVENSAS BONDING TECHNOLOGIES, INC.
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- B81 - MICRO-STRUCTURAL TECHNOLOGY
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- NATIONAL CHIAO-TUNG UNIVERSITY
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Information Patent Application
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- Hanae SHIMOKAWA
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- INVENSAS BONDING TECHNOLOGIES INC.
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- H01 - BASIC ELECTRIC ELEMENTS

at the bonding interface of the layer connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonded structures

Selective transfer of micro devices

Semiconductor package and method for manufacturing semiconductor pa...

Integration and bonding of micro-devices into system substrate

Method of producing semiconductor devices and corresponding semicon...

Semiconductor device

Seal ring structures and methods of forming same

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Electrical connecting structure having nano-twins copper

Bonded structures

Sinter sheet, semiconductor device and manufacturing method thereof

Selective micro device transfer to receiver substrate

Seal ring structures and methods of forming same

Electrical connecting structure having nano-twins copper and method...

Bonded structure and method of manufacturing the same

Porous Cu on Cu surface for semiconductor packages

Bonded structures

Integration and bonding of micro-devices into system substrate

Micro device metal joint process

Seal ring structures and methods of forming same

Power electronics assembly having an adhesion layer, and method for...

Bonded structures

Seal ring structures and methods of forming same

Method for cohesively connecting a first component of a power semic...

Electronic sandwich structure with two parts joined together by mea...

Semiconductor device, mechanical quantity measuring device, and sem...

Patents Applicationslast 30 patents

SELECTIVE TRANSFER OF MICRO DEVICES

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

LIGHT-EMITTING DEVICE, LIGHT-EMITTING MODULE AND PREPARATION METHOD...

METHOD OF PRODUCING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICON...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

BONDED STRUCTURES

CHIP-ON-FILM PACKAGE

MEMBER, CONDUCTIVE LAYER, METHOD FOR MANUFACTURING MEMBER, AND METH...

WAFER LEVEL CHIP SCALE PACKAGE OF POWER SEMICONDUCTOR AND MANUFACUT...

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

DISPLAY PANEL AND DISPLAY APPARATUS

CHIP PACKAGING STRUCTURE AND METHOD FOR PREPARING THE SAME, AND MET...

PACKAGE STRUCTURE AND METHOD FOR FABRICATING SAME

Circuits Including Micropatterns and Using Partial Curing to Adhere...

MULTI-LAYER SHEET FOR MOLD UNDERFILL ENCAPSULATION, METHOD FOR MOLD...

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

METHOD OF PRODUCING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICON...

ELECTRICAL CONNECTING STRUCTURE HAVING NANO-TWINS COPPER

SELECTIVE TRANSFER OF MICRO DEVICES

BONDED STRUCTURES

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

ELECTRICAL CONNECTING STRUCTURE HAVING NANO-TWINS COPPER AND METHOD...

SINTER SHEET, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Porous Cu on Cu Surface for Semiconductor Packages

SEAL RING STRUCTURES AND METHODS OF FORMING SAME

POWER ELECTRONICS ASSEMBLY HAVING AN ADHESION LAYER, AND METHOD FOR...

BONDED STRUCTURES

SEMICONDUCTOR DEVICE, MECHANICAL QUANTITY MEASURING DEVICE, AND SEM...

BONDED STRUCTURES