at the bonding interface of the layer connector

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H01L2224/29019

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/29019at the bonding interface of the layer connector

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Patents Grantslast 30 patents

Information Patent Grant
Selective micro device transfer to receiver substrate
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- Issue date Jan 14, 2025
- VueReal Inc.
- Gholamreza Chaji
- G01 - MEASURING TESTING
Information Patent Grant
Bonded structures
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- Issue date Sep 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
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- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Selective transfer of micro devices
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- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing semiconductor pa...
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- Chulyong Jang
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
Semiconductor device
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- Issue date Jan 2, 2024
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Information Patent Grant
Seal ring structures and methods of forming same
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Information Patent Grant
Selective micro device transfer to receiver substrate
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- Issue date Aug 22, 2023
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
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- Issue date Aug 22, 2023
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
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- Issue date Aug 22, 2023
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
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Information Patent Grant
Electrical connecting structure having nano-twins copper
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Information Patent Grant
Bonded structures
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Information Patent Grant
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Information Patent Grant
Selective micro device transfer to receiver substrate
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- Issue date Oct 18, 2022
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Information Patent Grant
Seal ring structures and methods of forming same
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- Issue date May 24, 2022
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- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connecting structure having nano-twins copper and method...
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- Issue date Oct 12, 2021
- NATIONAL YANG MING CHIAO TUNG UNIVERSITY
- Chih Chen
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Information Patent Grant
Bonded structure and method of manufacturing the same
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- Issue date Aug 17, 2021
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- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Porous Cu on Cu surface for semiconductor packages
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Information Patent Grant
Bonded structures
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Information Patent Grant
Integration and bonding of micro-devices into system substrate
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Information Patent Grant
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Information Patent Grant
Seal ring structures and methods of forming same
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Information Patent Grant
Power electronics assembly having an adhesion layer, and method for...
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Information Patent Grant
Bonded structures
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- Issue date Jan 28, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
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- Issue date Oct 22, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for cohesively connecting a first component of a power semic...
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- Issue date Oct 8, 2019
- Danfoss Silicon Power GmbH
- Martin Becker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic sandwich structure with two parts joined together by mea...
- Patent number 10,332,858
- Issue date Jun 25, 2019
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
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METHOD OF PRODUCING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICON...
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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
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- TERUAKI KUMAZAWA
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BONDED STRUCTURES
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- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
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CHIP-ON-FILM PACKAGE
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Information Patent Application
MEMBER, CONDUCTIVE LAYER, METHOD FOR MANUFACTURING MEMBER, AND METH...
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WAFER LEVEL CHIP SCALE PACKAGE OF POWER SEMICONDUCTOR AND MANUFACUT...
- Publication number 20230299026
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INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
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- VueReal Inc.
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DISPLAY PANEL AND DISPLAY APPARATUS
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CHIP PACKAGING STRUCTURE AND METHOD FOR PREPARING THE SAME, AND MET...
- Publication number 20230197666
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- CHANGXIN MEMORY TECHNOLOGIES, INC
- Zengyan FAN
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PACKAGE STRUCTURE AND METHOD FOR FABRICATING SAME
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- Ling-Yi CHUANG
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Circuits Including Micropatterns and Using Partial Curing to Adhere...
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MULTI-LAYER SHEET FOR MOLD UNDERFILL ENCAPSULATION, METHOD FOR MOLD...
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- NAGASE CHEMTEX CORPORATION
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- H01 - BASIC ELECTRIC ELEMENTS
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SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
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- H01 - BASIC ELECTRIC ELEMENTS
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SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220139857
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- H01 - BASIC ELECTRIC ELEMENTS
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- Publication number 20220068788
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- STMicroelectronics S.r.l
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- H01 - BASIC ELECTRIC ELEMENTS
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ELECTRICAL CONNECTING STRUCTURE HAVING NANO-TWINS COPPER
- Publication number 20210407960
- Publication date Dec 30, 2021
- National Yang Ming Chiao Tung University
- Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20210243894
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- VueReal Inc.
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- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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BONDED STRUCTURES
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- INVENSAS BONDING TECHNOLOGIES, INC.
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- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
- Publication number 20210020593
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- VueReal Inc.
- GHOLAMREZA CHAJI
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ELECTRICAL CONNECTING STRUCTURE HAVING NANO-TWINS COPPER AND METHOD...
- Publication number 20210020599
- Publication date Jan 21, 2021
- NATIONAL CHIAO-TUNG UNIVERSITY
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SINTER SHEET, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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Porous Cu on Cu Surface for Semiconductor Packages
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Information Patent Application
SEAL RING STRUCTURES AND METHODS OF FORMING SAME
- Publication number 20190109125
- Publication date Apr 11, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
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Information Patent Application
POWER ELECTRONICS ASSEMBLY HAVING AN ADHESION LAYER, AND METHOD FOR...
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- SEMIKRON ELEKTRONIK GMBH & CO. KG
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BONDED STRUCTURES
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- Publication date Nov 22, 2018
- INVENSAS BONDING TECHNOLOGIES, INC.
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MECHANICAL QUANTITY MEASURING DEVICE, AND SEM...
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- Hanae SHIMOKAWA
- H01 - BASIC ELECTRIC ELEMENTS

at the bonding interface of the layer connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Selective micro device transfer to receiver substrate

Bonded structures

Selective transfer of micro devices

Semiconductor package and method for manufacturing semiconductor pa...

Integration and bonding of micro-devices into system substrate

Method of producing semiconductor devices and corresponding semicon...

Semiconductor device

Seal ring structures and methods of forming same

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Electrical connecting structure having nano-twins copper

Bonded structures

Sinter sheet, semiconductor device and manufacturing method thereof

Selective micro device transfer to receiver substrate

Seal ring structures and methods of forming same

Electrical connecting structure having nano-twins copper and method...

Bonded structure and method of manufacturing the same

Porous Cu on Cu surface for semiconductor packages

Bonded structures

Integration and bonding of micro-devices into system substrate

Micro device metal joint process

Seal ring structures and methods of forming same

Power electronics assembly having an adhesion layer, and method for...

Bonded structures

Seal ring structures and methods of forming same

Method for cohesively connecting a first component of a power semic...

Electronic sandwich structure with two parts joined together by mea...

Patents Applicationslast 30 patents

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE TRANSFER OF MICRO DEVICES

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

LIGHT-EMITTING DEVICE, LIGHT-EMITTING MODULE AND PREPARATION METHOD...

METHOD OF PRODUCING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICON...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

BONDED STRUCTURES

CHIP-ON-FILM PACKAGE

MEMBER, CONDUCTIVE LAYER, METHOD FOR MANUFACTURING MEMBER, AND METH...

WAFER LEVEL CHIP SCALE PACKAGE OF POWER SEMICONDUCTOR AND MANUFACUT...

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

DISPLAY PANEL AND DISPLAY APPARATUS

CHIP PACKAGING STRUCTURE AND METHOD FOR PREPARING THE SAME, AND MET...

PACKAGE STRUCTURE AND METHOD FOR FABRICATING SAME

Circuits Including Micropatterns and Using Partial Curing to Adhere...

MULTI-LAYER SHEET FOR MOLD UNDERFILL ENCAPSULATION, METHOD FOR MOLD...

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

METHOD OF PRODUCING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICON...

ELECTRICAL CONNECTING STRUCTURE HAVING NANO-TWINS COPPER

SELECTIVE TRANSFER OF MICRO DEVICES

BONDED STRUCTURES

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

ELECTRICAL CONNECTING STRUCTURE HAVING NANO-TWINS COPPER AND METHOD...

SINTER SHEET, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Porous Cu on Cu Surface for Semiconductor Packages

SEAL RING STRUCTURES AND METHODS OF FORMING SAME

POWER ELECTRONICS ASSEMBLY HAVING AN ADHESION LAYER, AND METHOD FOR...

BONDED STRUCTURES

SEMICONDUCTOR DEVICE, MECHANICAL QUANTITY MEASURING DEVICE, AND SEM...