at the bonding interface

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/48505at the bonding interface

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor apparatus
- Patent number 11,462,504
- Issue date Oct 4, 2022
- Mitsubishi Electric Corporation
- Koichi Tokubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical device
- Patent number 10,896,996
- Issue date Jan 19, 2021
- Rohm Co., Ltd.
- Tomoichiro Toyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical device
- Patent number 10,559,723
- Issue date Feb 11, 2020
- Rohm Co., Ltd.
- Tomoichiro Toyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly with impedance controlled wirebond and con...
- Patent number 8,994,195
- Issue date Mar 31, 2015
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge type pad structure of a semiconductor device
- Patent number 8,610,277
- Issue date Dec 17, 2013
- Samsung Electronics Co., Ltd.
- Jin-Man Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly with impedance controlled wirebond and con...
- Patent number 8,575,766
- Issue date Nov 5, 2013
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-formed conductive bumps on bonding pads
- Patent number 8,319,353
- Issue date Nov 27, 2012
- Marvell International Ltd.
- Shiann-Ming Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly with impedance controlled wirebond and con...
- Patent number 8,269,357
- Issue date Sep 18, 2012
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding on reactive metal surfaces of a metallization of a sem...
- Patent number 8,216,880
- Issue date Jul 10, 2012
- GLOBALFOUNDRIES Inc.
- Matthias Lehr
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wire bonding on reactive metal surfaces of a metallization of a sem...
- Patent number 8,043,956
- Issue date Oct 25, 2011
- GLOBALFOUNDRIES Inc.
- Matthias Lehr
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Pre-formed conductive bumps on bonding pads
- Patent number 8,030,098
- Issue date Oct 4, 2011
- Marvell International Ltd.
- Shiann-Ming Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly with impedance controlled wirebond and con...
- Patent number 7,923,851
- Issue date Apr 12, 2011
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with bonding pad
- Patent number 7,883,917
- Issue date Feb 8, 2011
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including an insulating film and insulating pi...
- Patent number 7,675,183
- Issue date Mar 9, 2010
- Kabushiki Kaisha Toshiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for laser assisted wirebonding
- Patent number 7,476,597
- Issue date Jan 13, 2009
- Texas Instruments Incorporated
- Willmar E. Subido
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus to eliminate galvanic corrosion on copper dope...
- Patent number 7,169,692
- Issue date Jan 30, 2007
- Atmel Corporation
- Philip A. Rochette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus to eliminate galvanic corrosion on copper dope...
- Patent number 6,989,608
- Issue date Jan 24, 2006
- Atmel Corporation
- Philip A. Rochette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with improved bonding
- Patent number 6,727,593
- Issue date Apr 27, 2004
- Kabushiki Kaisha Toshiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of improving interconnect of semiconductor devices by utiliz...
- Patent number 6,624,059
- Issue date Sep 23, 2003
- Micron Technology, Inc.
- Michael B. Ball
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of improving interconnect of semiconductor devices by using...
- Patent number 6,420,256
- Issue date Jul 16, 2002
- Micron Technology, Inc.
- Michael B. Ball
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of improving interconnect of semiconductor devices by using...
- Patent number 6,165,887
- Issue date Dec 26, 2000
- Micron Technology , Inc.
- Michael B. Ball
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus
- Patent number 6,112,969
- Issue date Sep 5, 2000
- Mitsubishi Denki Kabushiki Kaisha
- Hiroshi Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method, wire bonding apparatus and semiconductor devic...
- Patent number 6,105,848
- Issue date Aug 22, 2000
- Mitsubishi Denki Kabushki Kaisha
- Hiroshi Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of improving interconnect of semiconductor devices by utiliz...
- Patent number 6,034,440
- Issue date Mar 7, 2000
- Micron Technology, Inc.
- Michael B. Ball
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of improving interconnect of semiconductor device by utilizi...
- Patent number 5,976,964
- Issue date Nov 2, 1999
- Micron Technology, Inc.
- Michael B. Ball
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method, wire bonding apparatus and semiconductor devic...
- Patent number 5,838,071
- Issue date Nov 17, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Hiroshi Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding means and method
- Patent number 4,415,115
- Issue date Nov 15, 1983
- Motorola, Inc.
- Kristi L. James
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3474307
- Patent number 3,474,307
- Issue date Oct 21, 1969
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20210280554
- Publication date Sep 9, 2021
- Mitsubishi Electric Corporation
- Koichi TOKUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICE
- Publication number 20190067527
- Publication date Feb 28, 2019
- ROHM CO., LTD.
- Tomoichiro TOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate for Optical Device
- Publication number 20170250333
- Publication date Aug 31, 2017
- Point Engineering Co., Ltd.
- Young Woon Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTERNAL CONNECTION TERMINAL, SEMICONDUCTOR PACKAGE HAVING EXTERNAL...
- Publication number 20150091152
- Publication date Apr 2, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Eun Jung JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20140191393
- Publication date Jul 10, 2014
- Siliconware Precision Industries Co., Ltd.
- Lung-Tang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH IMPEDANCE CONTROLLED WIREBOND AND CON...
- Publication number 20140103500
- Publication date Apr 17, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CORE WIRE
- Publication number 20130319726
- Publication date Dec 5, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Chin Teck Siong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING ON REACTIVE METAL SURFACES OF A METALLIZATION OF A SEM...
- Publication number 20120009780
- Publication date Jan 12, 2012
- GLOBALFOUNDRIES Inc.
- Matthias Lehr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH IMPEDANCE CONTROLLED WIREBOND AND CON...
- Publication number 20110101535
- Publication date May 5, 2011
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH IMPEDANCE CONTROLLED WIREBOND AND CON...
- Publication number 20110095408
- Publication date Apr 28, 2011
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH IMPEDANCE CONTROLLED WIREBOND AND CON...
- Publication number 20100230828
- Publication date Sep 16, 2010
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING ON REACTIVE METAL SURFACES OF A METALLIZATION OF A SEM...
- Publication number 20090243105
- Publication date Oct 1, 2009
- Matthias Lehr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH BONDING PAD
- Publication number 20090124073
- Publication date May 14, 2009
- Taiwan Semiconductor Manufacturing Co., LTD
- Ming-Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20090032957
- Publication date Feb 5, 2009
- Samsung Electronics Co., Ltd.
- Jin-Man CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR LASER ASSISTED WIREBONDING
- Publication number 20090029542
- Publication date Jan 29, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Willmar E. SUBIDO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER ON ORGANIC SOLDERABILITY PRESERVATIVE (OSP) INTERCONNECT
- Publication number 20090008796
- Publication date Jan 8, 2009
- United Test & Assembly Center Ltd.
- Kian Teng Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH BONDING PAD
- Publication number 20080246152
- Publication date Oct 9, 2008
- Taiwan Semiconductor Manufacturing Co., LTD
- Ming-Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of semiconductor device
- Publication number 20080237863
- Publication date Oct 2, 2008
- Kabushiki Kaisha Tosiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Systems for Laser Assisted Wirebonding
- Publication number 20080009129
- Publication date Jan 10, 2008
- Willmar E. Subido
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods for protecting metal surfaces
- Publication number 20070071900
- Publication date Mar 29, 2007
- Philippe Soussan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and manufacturing method of semiconductor device
- Publication number 20060113674
- Publication date Jun 1, 2006
- Kabushiki Kaisha Toshiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus to eliminate galvanic corrosion on copper dope...
- Publication number 20050266669
- Publication date Dec 1, 2005
- Atmel Corporation
- Philip A. Rochette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS TO ELIMINATE GALVANIC CORROSION ON COPPER DOPE...
- Publication number 20050224992
- Publication date Oct 13, 2005
- Philip A. Rochette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of semiconductor device
- Publication number 20040159951
- Publication date Aug 19, 2004
- Kabushiki Kaisha Toshiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of improving interconnect of semiconductor devices by utiliz...
- Publication number 20020177296
- Publication date Nov 28, 2002
- Michael B. Ball
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of semiconductor device
- Publication number 20020121703
- Publication date Sep 5, 2002
- KABUSHI KAISHA TOSHIBA
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method to produce the same
- Publication number 20020113322
- Publication date Aug 22, 2002
- Shinichi Terashima
- H01 - BASIC ELECTRIC ELEMENTS

at the bonding interface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor apparatus

Optical device

Optical device

Microelectronic assembly with impedance controlled wirebond and con...

Bridge type pad structure of a semiconductor device

Microelectronic assembly with impedance controlled wirebond and con...

Pre-formed conductive bumps on bonding pads

Microelectronic assembly with impedance controlled wirebond and con...

Wire bonding on reactive metal surfaces of a metallization of a sem...

Wire bonding on reactive metal surfaces of a metallization of a sem...

Pre-formed conductive bumps on bonding pads

Microelectronic assembly with impedance controlled wirebond and con...

Semiconductor device with bonding pad

Semiconductor device including an insulating film and insulating pi...

Methods and systems for laser assisted wirebonding

Method and apparatus to eliminate galvanic corrosion on copper dope...

Method and apparatus to eliminate galvanic corrosion on copper dope...

Semiconductor device with improved bonding

Method of improving interconnect of semiconductor devices by utiliz...

Method of improving interconnect of semiconductor devices by using...

Method of improving interconnect of semiconductor devices by using...

Wire bonding apparatus

Wire bonding method, wire bonding apparatus and semiconductor devic...

Method of improving interconnect of semiconductor devices by utiliz...

Method of improving interconnect of semiconductor device by utilizi...

Wire bonding method, wire bonding apparatus and semiconductor devic...

Bonding means and method

3474307

Patents Applicationslast 30 patents

SEMICONDUCTOR APPARATUS

OPTICAL DEVICE

Substrate for Optical Device

EXTERNAL CONNECTION TERMINAL, SEMICONDUCTOR PACKAGE HAVING EXTERNAL...

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

MICROELECTRONIC ASSEMBLY WITH IMPEDANCE CONTROLLED WIREBOND AND CON...

MULTI-CORE WIRE

WIRE BONDING ON REACTIVE METAL SURFACES OF A METALLIZATION OF A SEM...

MICROELECTRONIC ASSEMBLY WITH IMPEDANCE CONTROLLED WIREBOND AND CON...

MICROELECTRONIC ASSEMBLY WITH IMPEDANCE CONTROLLED WIREBOND AND CON...

MICROELECTRONIC ASSEMBLY WITH IMPEDANCE CONTROLLED WIREBOND AND CON...

WIRE BONDING ON REACTIVE METAL SURFACES OF A METALLIZATION OF A SEM...

SEMICONDUCTOR DEVICE WITH BONDING PAD

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

METHODS AND SYSTEMS FOR LASER ASSISTED WIREBONDING

COPPER ON ORGANIC SOLDERABILITY PRESERVATIVE (OSP) INTERCONNECT

SEMICONDUCTOR DEVICE WITH BONDING PAD

Semiconductor device and manufacturing method of semiconductor device

Methods and Systems for Laser Assisted Wirebonding

Methods for protecting metal surfaces

Semiconductor device and manufacturing method of semiconductor device

Method and apparatus to eliminate galvanic corrosion on copper dope...

METHOD AND APPARATUS TO ELIMINATE GALVANIC CORROSION ON COPPER DOPE...

Semiconductor device and manufacturing method of semiconductor device

Method of improving interconnect of semiconductor devices by utiliz...

Semiconductor device and manufacturing method of semiconductor device

Semiconductor device and method to produce the same