3474307

Information

• Patent Grant
• 3474307

• References
• Source

• Patent Number

  3,474,307

• Date Filed

  Not available

• Date Issued

  Tuesday, October 21, 1969
  55 years ago

• CPC

  • H01L23/055 - the leads having a passage through the base
  • H01L23/22 - liquid at the normal operating temperature of the device
  • H01L23/3135 - Double encapsulation or coating and encapsulation
  • H01L23/42 - Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
  • H01L23/66 - High-frequency adaptations
  • H01L24/49 - of a plurality of wire connectors
  • H02M7/537 - using semiconductor devices only
  • H03K17/693 - Switching arrangements with several input- or output-terminals
  • H01L24/45 - of an individual wire connector
  • H01L24/48 - of an individual wire connector
  • H01L2224/05624 - Aluminium [Al] as principal constituent
  • H01L2224/05639 - Silver [Ag] as principal constituent
  • H01L2224/05644 - Gold [Au] as principal constituent
  • H01L2224/45118 - Zinc (Zn) as principal constituent
  • H01L2224/45124 - Aluminium (Al) as principal constituent
  • H01L2224/45139 - Silver (Ag) as principal constituent
  • H01L2224/45144 - Gold (Au) as principal constituent
  • H01L2224/45147 - Copper (Cu) as principal constituent
  • H01L2224/48091 - Arched
  • H01L2224/48137 - the bodies being arranged next to each other
  • H01L2224/4823 - connecting the wire to a pin of the item
  • H01L2224/48465 - the other connecting portion not on the bonding area being a wedge bond
  • H01L2224/48505 - at the bonding interface
  • H01L2224/48624 - Aluminium (Al) as principal constituent
  • H01L2224/48639 - Silver (Ag) as principal constituent
  • H01L2224/48644 - Gold (Au) as principal constituent
  • H01L2224/48724 - Aluminium (Al) as principal constituent
  • H01L2224/48739 - Silver (Ag) as principal constituent
  • H01L2224/48744 - Gold (Au) as principal constituent
  • H01L2224/48824 - Aluminium (Al) as principal constituent
  • H01L2224/48839 - Silver (Ag) as principal constituent
  • H01L2224/48844 - Gold (Au) as principal constituent
  • H01L2224/49 - of a plurality of wire connectors
  • H01L2924/01004 - Beryllium [Be]
  • H01L2924/01005 - Boron [B]
  • H01L2924/01006 - Carbon [C]
  • H01L2924/01013 - Aluminum [Al]
  • H01L2924/01014 - Silicon [Si]
  • H01L2924/01019 - Potassium [K]
  • H01L2924/01023 - Vanadium [V]
  • H01L2924/01025 - Manganese [Mn]
  • H01L2924/01027 - Cobalt [Co]
  • H01L2924/01028 - Nickel [Ni]
  • H01L2924/01029 - Copper [Cu]
  • H01L2924/0103 - Zinc [Zn]
  • H01L2924/01032 - Germanium [Ge]
  • H01L2924/01033 - Arsenic [As]
  • H01L2924/01047 - Silver [Ag]
  • H01L2924/01074 - Tungsten [W]
  • H01L2924/01079 - Gold [Au]
  • H01L2924/01082 - Lead [Pb]
  • H01L2924/014 - Solder alloys
  • H01L2924/10252 - Germanium [Ge]
  • H01L2924/10253 - Silicon [Si]
  • H01L2924/12036 - PN diode
  • H01L2924/1306 - Field-effect transistor [FET]
  • H01L2924/16152 - Cap comprising a cavity for hosting the device
  • H01L2924/19043 - being a resistor
  • H01L2924/30105 - Capacitance
  • H01L2924/30107 - Inductance
  • H01L2924/3011 - Impedance

• US Classifications

  • 257 - Active solid-state devices