at the bonding interface

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H01L2224/16501

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/16501at the bonding interface

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Pre-molded leadframes in semiconductor devices
- Patent number 12,191,273
- Issue date Jan 7, 2025
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframes in semiconductor devices
- Patent number 12,183,703
- Issue date Dec 31, 2024
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with enhanced thermal dissipation and method f...
- Patent number 12,183,655
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for forming the same
- Patent number 12,057,424
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for low temperature bonding using nanoparticles
- Patent number 12,027,487
- Issue date Jul 2, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced device assembly structures and methods
- Patent number 11,999,001
- Issue date Jun 4, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for low temperature bonding using nanoparticles
- Patent number 11,973,056
- Issue date Apr 30, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,917,875
- Issue date Feb 27, 2024
- Samsung Display Co., Ltd.
- Ki Kyung Youk
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 11,735,561
- Issue date Aug 22, 2023
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 11,710,718
- Issue date Jul 25, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with graded modulus underfill and ass...
- Patent number 11,682,563
- Issue date Jun 20, 2023
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with enhanced thermal dissipation and method f...
- Patent number 11,626,343
- Issue date Apr 11, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing thereof
- Patent number 11,476,291
- Issue date Oct 18, 2022
- Sony Corporation
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shaped interconnect bumps in semiconductor devices
- Patent number 11,444,048
- Issue date Sep 13, 2022
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with graded modulus underfill and ass...
- Patent number 11,404,289
- Issue date Aug 2, 2022
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 11,367,704
- Issue date Jun 21, 2022
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 11,233,026
- Issue date Jan 25, 2022
- Murata Manufacturing Co., Ltd.
- Shintaro Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and method of manufacturing the same
- Patent number 11,177,249
- Issue date Nov 16, 2021
- SK hynix Inc.
- Kun Young Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframes in semiconductor devices
- Patent number 11,152,322
- Issue date Oct 19, 2021
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing interconnect structure
- Patent number 11,121,104
- Issue date Sep 14, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing a package using plateable encapsulant
- Patent number 11,081,417
- Issue date Aug 3, 2021
- Infineon Technologies AG
- Sook Woon Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-free solder joining of electronic structures
- Patent number 11,043,468
- Issue date Jun 22, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly comprising hybrid interconnecting means including intermed...
- Patent number 11,011,490
- Issue date May 18, 2021
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Rabih Khazaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-molded leadframes in semiconductor devices
- Patent number 10,957,666
- Issue date Mar 23, 2021
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,892,246
- Issue date Jan 12, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,886,250
- Issue date Jan 5, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip stack and method for manufacturing semiconductor...
- Patent number 10,861,813
- Issue date Dec 8, 2020
- SHARP KABUSHIKI KAISHA
- Toshiya Ishio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding package components through plating
- Patent number 10,840,212
- Issue date Nov 17, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,811,379
- Issue date Oct 20, 2020
- Samsung Electronics Co., Ltd.
- Doo Il Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 10,707,185
- Issue date Jul 7, 2020
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...
- Publication number 20250087553
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yang-Che CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced Device Assembly Structures And Methods
- Publication number 20250033138
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20240312954
- Publication date Sep 19, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240222305
- Publication date Jul 4, 2024
- Industrial Technology Research Institute
- Yu-Wei HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230343744
- Publication date Oct 26, 2023
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20230335531
- Publication date Oct 19, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20230132060
- Publication date Apr 27, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHAPED INTERCONNECT BUMPS IN SEMICONDUCTOR DEVICES
- Publication number 20230012200
- Publication date Jan 12, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20230005979
- Publication date Jan 5, 2023
- SONY GROUP CORPORATION
- Satoru WAKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...
- Publication number 20220367318
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yang-Che CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH GRADED MODULUS UNDERFILL AND ASS...
- Publication number 20220328326
- Publication date Oct 13, 2022
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220278072
- Publication date Sep 1, 2022
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced Device Assembly Structures And Methods
- Publication number 20220097166
- Publication date Mar 31, 2022
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH GRADED MODULUS UNDERFILL AND ASS...
- Publication number 20220068666
- Publication date Mar 3, 2022
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframes in Semiconductor Devices
- Publication number 20220037277
- Publication date Feb 3, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures And Methods For Low Temperature Bonding Using Nanoparticles
- Publication number 20210225801
- Publication date Jul 22, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pre-Molded Leadframes in Semiconductor Devices
- Publication number 20210210453
- Publication date Jul 8, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20200321308
- Publication date Oct 8, 2020
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20200294947
- Publication date Sep 17, 2020
- Murata Manufacturing Co., Ltd.
- Shintaro OTSUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200243499
- Publication date Jul 30, 2020
- SK HYNIX INC.
- Kun Young LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD-FREE SOLDER JOINING OF ELECTRONIC STRUCTURES
- Publication number 20200161272
- Publication date May 21, 2020
- International Business Machines Corporation
- CHARLES L. ARVIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures And Methods For Low Temperature Bonding Using Nanoparticles
- Publication number 20200152598
- Publication date May 14, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...
- Publication number 20200135613
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yang-Che CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20200066675
- Publication date Feb 27, 2020
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Package Components Through Plating
- Publication number 20200020662
- Publication date Jan 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package
- Publication number 20200013743
- Publication date Jan 9, 2020
- Samsung Electronics Co., Ltd.
- Doo Il KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP STACK AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20190371756
- Publication date Dec 5, 2019
- Sharp Kabushiki Kaisha
- TOSHIYA ISHIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing a package using plateable encapsulant
- Publication number 20190341324
- Publication date Nov 7, 2019
- INFINEON TECHNOLOGIES AG
- Sook Woon CHAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20190326344
- Publication date Oct 24, 2019
- SONY CORPORATION
- Satoru WAKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190157239
- Publication date May 23, 2019
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS

at the bonding interface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Pre-molded leadframes in semiconductor devices

Leadframes in semiconductor devices

Semiconductor device with enhanced thermal dissipation and method f...

Package structure and method for forming the same

Structures for low temperature bonding using nanoparticles

Advanced device assembly structures and methods

Methods for low temperature bonding using nanoparticles

Display device

Semiconductor device and method for manufacturing semiconductor device

Structures and methods for low temperature bonding using nanoparticles

Semiconductor device assembly with graded modulus underfill and ass...

Semiconductor device with enhanced thermal dissipation and method f...

Semiconductor device and method of manufacturing thereof

Shaped interconnect bumps in semiconductor devices

Semiconductor device assembly with graded modulus underfill and ass...

Semiconductor device and method for manufacturing semiconductor device

Electronic component

Semiconductor memory device and method of manufacturing the same

Leadframes in semiconductor devices

Method for manufacturing interconnect structure

Manufacturing a package using plateable encapsulant

Lead-free solder joining of electronic structures

Assembly comprising hybrid interconnecting means including intermed...

Pre-molded leadframes in semiconductor devices

Structures and methods for low temperature bonding using nanoparticles

Structures and methods for low temperature bonding using nanoparticles

Semiconductor chip stack and method for manufacturing semiconductor...

Bonding package components through plating

Semiconductor package

Semiconductor device and method for manufacturing semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...

Advanced Device Assembly Structures And Methods

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

SHAPED INTERCONNECT BUMPS IN SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...

SEMICONDUCTOR DEVICE ASSEMBLY WITH GRADED MODULUS UNDERFILL AND ASS...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Advanced Device Assembly Structures And Methods

SEMICONDUCTOR DEVICE ASSEMBLY WITH GRADED MODULUS UNDERFILL AND ASS...

Leadframes in Semiconductor Devices

Structures And Methods For Low Temperature Bonding Using Nanoparticles

Pre-Molded Leadframes in Semiconductor Devices

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

ELECTRONIC COMPONENT

SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME

LEAD-FREE SOLDER JOINING OF ELECTRONIC STRUCTURES

Structures And Methods For Low Temperature Bonding Using Nanoparticles

SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Bonding Package Components Through Plating

Semiconductor Package

SEMICONDUCTOR CHIP STACK AND METHOD FOR MANUFACTURING SEMICONDUCTOR...

Manufacturing a package using plateable encapsulant

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE