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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/94at wafer-level

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Integrated semiconductor packaging system with enhanced dielectric-...
- Patent number 12,272,670
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info structure with copper pillar having reversed profile
- Patent number 12,261,074
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out wafer level packaging of semiconductor devices
- Patent number 12,261,084
- Issue date Mar 25, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- George Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 12,255,167
- Issue date Mar 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing the same
- Patent number 12,237,283
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package stress balance structures and related methods
- Patent number 12,230,502
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die connection system and method
- Patent number 12,218,093
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded cooling systems and methods of manufacturing embedded cool...
- Patent number 12,191,233
- Issue date Jan 7, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,191,191
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Min-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-molded leadframes in semiconductor devices
- Patent number 12,191,273
- Issue date Jan 7, 2025
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframes in semiconductor devices
- Patent number 12,183,703
- Issue date Dec 31, 2024
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process control for package formation
- Patent number 12,183,728
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive with brain-like elasticity and integrality based on sta...
- Patent number 12,176,902
- Issue date Dec 24, 2024
- iCometrue Company Ltd.
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level dicing method and semiconductor device
- Patent number 12,176,248
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked semiconductor devices and methods of forming same
- Patent number 12,170,207
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-shot encapsulation
- Patent number 12,166,001
- Issue date Dec 10, 2024
- Semtech Corporation
- Kok Khoon Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method of ball drop on thin wafer with edge...
- Patent number 12,154,877
- Issue date Nov 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Forming large chips through stitching
- Patent number 12,148,719
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and the methods of manufacturing
- Patent number 12,142,597
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating passive devices in package structures
- Patent number 12,132,029
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bonding structures and methods
- Patent number 12,119,238
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pressure sintering powder
- Patent number 12,113,039
- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Apparatus for stacking substrates and method for the same
- Patent number 12,100,667
- Issue date Sep 24, 2024
- Nikon Corporation
- Isao Sugaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-pin-wafer-level-chip-scale-packaging solution for high power...
- Patent number 12,100,679
- Issue date Sep 24, 2024
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna in embedded wafer-level ball-grid array package
- Patent number 12,094,843
- Issue date Sep 17, 2024
- STATS ChipPAC Pte. Ltd.
- Pandi Chelvam Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with surface-mount die support struct...
- Patent number 12,087,720
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective wafer grooving structure for wafer thinning and methods...
- Patent number 12,087,756
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an integrated fan-out package having fan-ou...
- Patent number 12,080,615
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method to minimize stress on stack via
- Patent number 12,080,600
- Issue date Sep 3, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit component with conductive terminals of different...
- Patent number 12,074,066
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250118718
- Publication date Apr 10, 2025
- SK HYNIX INC.
- Heon Yong CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE TRANSFER METHOD AND APPARATUS FOR MULTI-CHIP MODULE
- Publication number 20250118589
- Publication date Apr 10, 2025
- Silicon Box, Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming
- Publication number 20250118609
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL CHIP SCALE PACKAGE TRANSIENT VOLTAGE SUPPRESSION DIODE...
- Publication number 20250113508
- Publication date Apr 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Thomas Kronenberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING STACKED SEMICONDUCTOR CHIPS AND METHOD...
- Publication number 20250105210
- Publication date Mar 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AN...
- Publication number 20250105178
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- MinKi AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING STACKED SEMICONDUCTOR CHIPS AND METHOD...
- Publication number 20250105214
- Publication date Mar 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING SUBSTRATE STRUCTURE
- Publication number 20250107190
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Jonggu LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-SUBSTRATE COMPOSITE SEMICONDUCTOR DEVICE
- Publication number 20250096101
- Publication date Mar 20, 2025
- INFINEON TECHNOLOGIES AG
- Carsten Joachim von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR BONDING WAFERS OF KNOWN GOOD DIES, AND ASSEMBLIES RESUL...
- Publication number 20250096171
- Publication date Mar 20, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD FOR REDUCED CONTACT RESISTANCE
- Publication number 20250087609
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching Ju Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dicing Street Design for Hybrid Bonding
- Publication number 20250087629
- Publication date Mar 13, 2025
- International Business Machines Corporation
- Roy R. Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR BONDED STRUCTURE AND FABRICATING METHOD THEREOF
- Publication number 20250087600
- Publication date Mar 13, 2025
- Macronix International Co., Ltd.
- Cheng-Hsien Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20250087633
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS CONTROL FOR PACKAGE FORMATION
- Publication number 20250079429
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL FABRICATION OF ELECTROSTATIC DISCHARGE DEVICES
- Publication number 20250079401
- Publication date Mar 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Rongwei ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES EMPLOYING METAL OXIDE FOR DIRECT METAL BONDING
- Publication number 20250079364
- Publication date Mar 6, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20250070064
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ke-Gang Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL DICING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20250069954
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250062286
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER AND METHOD OF BALL DROP ON THIN WAFER WITH EDGE...
- Publication number 20250062263
- Publication date Feb 20, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FORMING LARGE CHIPS THROUGH STITCHING
- Publication number 20250054879
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Release Layer for IR Laser Lift-Off Process
- Publication number 20250054904
- Publication date Feb 13, 2025
- TOKYO ELECTRON LIMITED
- Panupong JAIPAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS WITH IMPLANTED ALIGNMENT MARK AND METHODS OF MANUFACTURIN...
- Publication number 20250046730
- Publication date Feb 6, 2025
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20250046753
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Dissipating Structure and Methods of Forming The Same
- Publication number 20250046667
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250046747
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Junyun KWEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD AND BONDING SYSTEM
- Publication number 20250029950
- Publication date Jan 23, 2025
- TOKYO ELECTRON LIMITED
- Yuji MIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR STACKING INTEGRATED CIRCUIT WAFERS AND DIES
- Publication number 20250015045
- Publication date Jan 9, 2025
- TOKYO ELECTRON LIMITED
- H. Jim Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUMMY DIES AND METHOD OF FORMING THE SAME
- Publication number 20250015050
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsing-Yuan HUANG
- H01 - BASIC ELECTRIC ELEMENTS

at wafer-level

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated semiconductor packaging system with enhanced dielectric-...

Info structure with copper pillar having reversed profile

Fan-out wafer level packaging of semiconductor devices

Semiconductor packages with an intermetallic layer

Semiconductor structure and method for manufacturing the same

Semiconductor package stress balance structures and related methods

Semiconductor die connection system and method

Embedded cooling systems and methods of manufacturing embedded cool...

Semiconductor structure and manufacturing method thereof

Pre-molded leadframes in semiconductor devices

Leadframes in semiconductor devices

Process control for package formation

Logic drive with brain-like elasticity and integrality based on sta...

Wafer level dicing method and semiconductor device

Stacked semiconductor devices and methods of forming same

Single-shot encapsulation

Semiconductor wafer and method of ball drop on thin wafer with edge...

Forming large chips through stitching

Integrated fan-out package and the methods of manufacturing

Integrating passive devices in package structures

Semiconductor bonding structures and methods

Low pressure sintering powder

Apparatus for stacking substrates and method for the same

Multi-pin-wafer-level-chip-scale-packaging solution for high power...

Antenna in embedded wafer-level ball-grid array package

Semiconductor device assembly with surface-mount die support struct...

Protective wafer grooving structure for wafer thinning and methods...

Method of manufacturing an integrated fan-out package having fan-ou...

Semiconductor device and method to minimize stress on stack via

Integrated circuit component with conductive terminals of different...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

DIE TRANSFER METHOD AND APPARATUS FOR MULTI-CHIP MODULE

Semiconductor Packages and Methods of Forming

WAFER-LEVEL CHIP SCALE PACKAGE TRANSIENT VOLTAGE SUPPRESSION DIODE...

ELECTRONIC DEVICE INCLUDING STACKED SEMICONDUCTOR CHIPS AND METHOD...

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AN...

ELECTRONIC DEVICE INCLUDING STACKED SEMICONDUCTOR CHIPS AND METHOD...

SEMICONDUCTOR DEVICES INCLUDING SUBSTRATE STRUCTURE

CHIP-SUBSTRATE COMPOSITE SEMICONDUCTOR DEVICE

METHODS FOR BONDING WAFERS OF KNOWN GOOD DIES, AND ASSEMBLIES RESUL...

BOND PAD FOR REDUCED CONTACT RESISTANCE

Dicing Street Design for Hybrid Bonding

SEMICONDUCTOR BONDED STRUCTURE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME

PROCESS CONTROL FOR PACKAGE FORMATION

WAFER-LEVEL FABRICATION OF ELECTROSTATIC DISCHARGE DEVICES

METHODS AND STRUCTURES EMPLOYING METAL OXIDE FOR DIRECT METAL BONDING

Semiconductor Device and Method

WAFER LEVEL DICING METHOD AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR WAFER AND METHOD OF BALL DROP ON THIN WAFER WITH EDGE...

FORMING LARGE CHIPS THROUGH STITCHING

Release Layer for IR Laser Lift-Off Process

APPARATUS WITH IMPLANTED ALIGNMENT MARK AND METHODS OF MANUFACTURIN...

INTEGRATED CIRCUIT PACKAGE AND METHOD

Heat Dissipating Structure and Methods of Forming The Same

SEMICONDUCTOR PACKAGE

BONDING METHOD AND BONDING SYSTEM

METHOD FOR STACKING INTEGRATED CIRCUIT WAFERS AND DIES

DUMMY DIES AND METHOD OF FORMING THE SAME