Auto-mechanical connection between a component and a PCB or between two PCBs

Industry

CPC
H05K2201/209

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/209Auto-mechanical connection between a component and a PCB or between two PCBs

Industries

Patents Grantslast 30 patents

Information Patent Grant
Methods for configuring light fixtures with programmable drivers
- Patent number 11,655,970
- Issue date May 23, 2023
- ABL IP Holding LLC
- Benjamin M. Suttles
- F21 - LIGHTING
Information Patent Grant
Method of manufacturing a flat device
- Patent number 11,406,020
- Issue date Aug 2, 2022
- IMEC VZW
- Jan Vanfleteren
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Interconnection system for lighting fixtures
- Patent number 11,384,928
- Issue date Jul 12, 2022
- ABL IP Holding LLC
- Benjamin M. Suttles
- F21 - LIGHTING
Information Patent Grant
Electronic foil
- Patent number 11,388,815
- Issue date Jul 12, 2022
- Teknologian tutkimuskeskus VTT Oy
- Vesa Pentikäinen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board supporting structure and light emitting device having...
- Patent number 11,191,162
- Issue date Nov 30, 2021
- Hoya Corporation
- Hiroaki Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PCB-based connector device
- Patent number 10,886,670
- Issue date Jan 5, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Martin Fischeneder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Supporting an electrical connector
- Patent number 10,881,156
- Issue date Jan 5, 2021
- Wearable Technology Limited
- Michael John Lynch
- A41 - WEARING APPAREL
Information Patent Grant
Electronic signal processing device
- Patent number 10,530,078
- Issue date Jan 7, 2020
- BizLink International Corp.
- Hsin-Tuan Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board system
- Patent number 10,165,676
- Issue date Dec 25, 2018
- Ledil Oy
- Hannu Hukkanen
- G02 - OPTICS
Information Patent Grant
Selectively conductive toy building elements
- Patent number 9,914,065
- Issue date Mar 13, 2018
- BRIXO SMART TOYS LTD.
- Boaz Almog
- A63 - SPORTS GAMES AMUSEMENTS
Information Patent Grant
Circuit board pad layout and mechanical retainer
- Patent number 9,799,973
- Issue date Oct 24, 2017
- Ross Video Limited
- Donald Mark Sizemore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting module and lighting device using the same
- Patent number 9,759,405
- Issue date Sep 12, 2017
- Samsung Electronics Co., Ltd.
- Chang Ho Shin
- G02 - OPTICS
Information Patent Grant
Combined wiring board
- Patent number 9,603,238
- Issue date Mar 21, 2017
- Ibiden Co., Ltd.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lamp with multiple flexible OLEDs
- Patent number 9,559,314
- Issue date Jan 31, 2017
- Universal Display Corporation
- Kamala Rajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a printed circuit board consisting of at least...
- Patent number 9,480,172
- Issue date Oct 25, 2016
- AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Volodymyr Karpovych
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting module and lighting device using the same
- Patent number 9,347,621
- Issue date May 24, 2016
- Samsung Electronics Co., Ltd.
- Chang Ho Shin
- F21 - LIGHTING
Information Patent Grant
High speed circuit assembly with integral terminal and mating bias...
- Patent number 9,350,124
- Issue date May 24, 2016
- HSIO Technologies, LLC
- James Rathburn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reducing impedance of a printed circuit board through a square wave...
- Patent number 9,084,362
- Issue date Jul 14, 2015
- NVIDIA Corporation
- Shuang Xu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rigid-flex printed circuit board and method for making same
- Patent number 9,072,173
- Issue date Jun 30, 2015
- FuKui Precision Component (Shenzhen) Co., Ltd.
- Ning Hou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Radio frequency interconnect circuits and techniques
- Patent number 8,981,869
- Issue date Mar 17, 2015
- Raytheon Company
- Angelo M. Puzella
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication method for multi-piece board
- Patent number 8,572,839
- Issue date Nov 5, 2013
- Ibiden Co., Ltd.
- Yasushi Hasegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-piece board and fabrication method therefor
- Patent number 8,378,237
- Issue date Feb 19, 2013
- Ibiden Co., Ltd.
- Yasushi Hasegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Self-locking features in a multi-chip module
- Patent number 8,315,065
- Issue date Nov 20, 2012
- Oracle America, Inc.
- Jing Shi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for connecting two joining surfaces
- Patent number 8,299,613
- Issue date Oct 30, 2012
- Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Hermann Oppermann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 8,293,577
- Issue date Oct 23, 2012
- Fujitsu Limited
- Yuji Awano
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Submount for electronic components
- Patent number 8,259,460
- Issue date Sep 4, 2012
- Koninklijke Philips Electronics N.V.
- Rabin Bhattacharya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive hook and loop attachment with metal scrim layer for a pr...
- Patent number 8,215,973
- Issue date Jul 10, 2012
- Kimberly-Clark Worldwide, Inc.
- Thomas Michael Ales
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multiple stem design for high density interconnects
- Patent number 8,152,549
- Issue date Apr 10, 2012
- Lockheed Martin Corporation
- Walter V. Werner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Voice output unit
- Patent number 8,150,071
- Issue date Apr 3, 2012
- Panasonic Corporation
- Mitsuru Kobayashi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device and electronic component module using the same
- Patent number 8,097,950
- Issue date Jan 17, 2012
- Kabushiki Kaisha Toshiba
- Satoru Hara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC FOIL
- Publication number 20200260567
- Publication date Aug 13, 2020
- Teknologian Tutkimuskeskus VTT Oy
- Vesa PENTIKÄINEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD SUPPORTING STRUCTURE AND LIGHT EMITTING DEVICE HAVING...
- Publication number 20200214133
- Publication date Jul 2, 2020
- Hoya Candeo Optronics Corporation
- Hiroaki WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing Shape-Retaining Non-Flat Devices
- Publication number 20200029440
- Publication date Jan 23, 2020
- IMEC vzw
- Jan Vanfleteren
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Supporting an Electrical Connector
- Publication number 20190200683
- Publication date Jul 4, 2019
- Wearable Technology Limited
- Michael John Lynch
- A41 - WEARING APPAREL
Information Patent Application
Component Carrier Having at Least a Part Formed as a Three-Dimensio...
- Publication number 20190110366
- Publication date Apr 11, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB-BASED CONNECTOR DEVICE
- Publication number 20170062992
- Publication date Mar 2, 2017
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Martin Fischeneder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD CONSISTING OF AT LEAST...
- Publication number 20140376196
- Publication date Dec 25, 2014
- Volodymyr Karpovych
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT ENGINE
- Publication number 20140264393
- Publication date Sep 18, 2014
- ABL IP HOLDING LLC
- Forrest Starnes McCanless
- F21 - LIGHTING
Information Patent Application
LAMP WITH MULTIPLE FLEXIBLE OLEDs
- Publication number 20140231793
- Publication date Aug 21, 2014
- UNIVERSAL DISPLAY CORPORATION
- Kamala Rajan
- F21 - LIGHTING
Information Patent Application
REDUCING IMPEDANCE OF A PRINTED CIRCUIT BOARD THROUGH A SQUARE WAVE...
- Publication number 20140192502
- Publication date Jul 10, 2014
- Shuang Xu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RIGID-FLEX PRINTED CIRCUIT BOARD AND METHOD FOR MAKING SAME
- Publication number 20140182900
- Publication date Jul 3, 2014
- ZHEN DING TECHNOLOGY CO., LTD.
- NING HOU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMBINED WIRING BOARD
- Publication number 20140133110
- Publication date May 15, 2014
- IBIDEN CO., LTD.
- Michimasa TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING MODULE AND LIGHTING DEVICE USING THE SAME
- Publication number 20140098544
- Publication date Apr 10, 2014
- Chang Ho SHIN
- G02 - OPTICS
Information Patent Application
DIMMABLE, HIGH-EFFICIENCY LED LINEAR LIGHTING SYSTEM WITH INTERCHAN...
- Publication number 20140092596
- Publication date Apr 3, 2014
- Linear Lighting Corp.
- Lawrence Adam Deutsch
- F21 - LIGHTING
Information Patent Application
LAYERED CONNECTOR AND METHOD OF MANUFACTURING A LAYERED CONNECTOR
- Publication number 20140017940
- Publication date Jan 16, 2014
- Tyco Electronics Corporation
- Bicheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE SURFACE MOUNT ELECTRICAL INTERCONNECT
- Publication number 20130244490
- Publication date Sep 19, 2013
- HSIO TECHNOLOGIES, LLC
- James Rathburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR, DETACHABLE COMPUTE LEAF FOR USE WITH COMPUTING SYSTEM
- Publication number 20120260063
- Publication date Oct 11, 2012
- Endicott Interconnect Technologies, Inc.
- Voya R. Markovich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTIPLE STEM DESIGN FOR HIGH DENSITY INTERCONNECTS
- Publication number 20120108082
- Publication date May 3, 2012
- Walter V. Werner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT MODULE USING THE SAME
- Publication number 20120080801
- Publication date Apr 5, 2012
- Kabushiki Kaisha Toshiba
- Satoru Hara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING DEVICE MODULE
- Publication number 20120002427
- Publication date Jan 5, 2012
- Yontae MOON
- F21 - LIGHTING
Information Patent Application
CONDUCTIVE HOOK AND LOOP ATTACHMENT WITH METAL SCRIM LAYER FOR A PR...
- Publication number 20110223782
- Publication date Sep 15, 2011
- Kimberly-Clark Worldwide, Inc.
- Thomas Michael Ales
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SELF-LOCKING FEATURES IN A MULTI-CHIP MODULE
- Publication number 20110075380
- Publication date Mar 31, 2011
- SUN MICROSYSTEMS, INC.
- Jing Shi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor package and method of manufacturing the same
- Publication number 20110021016
- Publication date Jan 27, 2011
- FUJITSU LIMITED
- Yuji Awano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR CONNECTING TWO JOINING SURFACES
- Publication number 20100270673
- Publication date Oct 28, 2010
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Hermann Oppermann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Panelizing Method for Printed Circuit Board Manufacturing
- Publication number 20100263207
- Publication date Oct 21, 2010
- Kimmo Paananen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE HOOK AND LOOP ATTACHMENT FOR A PRINTED CIRCUIT BOARD
- Publication number 20100248507
- Publication date Sep 30, 2010
- Kimberly-Clark Worldwide, Inc.
- Thomas Michael Ales
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SUBMOUNT FOR ELECTRONIC COMPONENTS
- Publication number 20100238637
- Publication date Sep 23, 2010
- Koninklijke Philips Electronics N.V.
- Rabin Bhattacharya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VOICE OUTPUT UNIT
- Publication number 20100183169
- Publication date Jul 22, 2010
- Panasonic Electric Works Co., Ltd.
- Mitsuru Kobayashi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Radio Frequency Interconnect Circuits and Techniques
- Publication number 20100126010
- Publication date May 27, 2010
- Raytheon Company
- Angelo M. Puzella
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MULTI-PIECE BOARD AND FABRICATION METHOD THEREFOR
- Publication number 20100118504
- Publication date May 13, 2010
- IBIDEN CO., LTD.
- Yasushi HASEGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Auto-mechanical connection between a component and a PCB or between two PCBs

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods for configuring light fixtures with programmable drivers

Method of manufacturing a flat device

Interconnection system for lighting fixtures

Electronic foil

Circuit board supporting structure and light emitting device having...

PCB-based connector device

Supporting an electrical connector

Electronic signal processing device

Circuit board system

Selectively conductive toy building elements

Circuit board pad layout and mechanical retainer

Light emitting module and lighting device using the same

Combined wiring board

Lamp with multiple flexible OLEDs

Method for producing a printed circuit board consisting of at least...

Light emitting module and lighting device using the same

High speed circuit assembly with integral terminal and mating bias...

Reducing impedance of a printed circuit board through a square wave...

Rigid-flex printed circuit board and method for making same

Radio frequency interconnect circuits and techniques

Fabrication method for multi-piece board

Multi-piece board and fabrication method therefor

Self-locking features in a multi-chip module

Method for connecting two joining surfaces

Semiconductor package and method of manufacturing the same

Submount for electronic components

Conductive hook and loop attachment with metal scrim layer for a pr...

Multiple stem design for high density interconnects

Voice output unit

Semiconductor device and electronic component module using the same

Patents Applicationslast 30 patents

ELECTRONIC FOIL

CIRCUIT BOARD SUPPORTING STRUCTURE AND LIGHT EMITTING DEVICE HAVING...

Method for Manufacturing Shape-Retaining Non-Flat Devices

Supporting an Electrical Connector

Component Carrier Having at Least a Part Formed as a Three-Dimensio...

PCB-BASED CONNECTOR DEVICE

METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD CONSISTING OF AT LEAST...

LIGHT ENGINE

LAMP WITH MULTIPLE FLEXIBLE OLEDs

REDUCING IMPEDANCE OF A PRINTED CIRCUIT BOARD THROUGH A SQUARE WAVE...

RIGID-FLEX PRINTED CIRCUIT BOARD AND METHOD FOR MAKING SAME

COMBINED WIRING BOARD

LIGHT EMITTING MODULE AND LIGHTING DEVICE USING THE SAME

DIMMABLE, HIGH-EFFICIENCY LED LINEAR LIGHTING SYSTEM WITH INTERCHAN...

LAYERED CONNECTOR AND METHOD OF MANUFACTURING A LAYERED CONNECTOR

HIGH PERFORMANCE SURFACE MOUNT ELECTRICAL INTERCONNECT

MODULAR, DETACHABLE COMPUTE LEAF FOR USE WITH COMPUTING SYSTEM

MULTIPLE STEM DESIGN FOR HIGH DENSITY INTERCONNECTS

SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT MODULE USING THE SAME

LIGHT EMITTING DEVICE MODULE

CONDUCTIVE HOOK AND LOOP ATTACHMENT WITH METAL SCRIM LAYER FOR A PR...

SELF-LOCKING FEATURES IN A MULTI-CHIP MODULE

Semiconductor package and method of manufacturing the same

METHOD FOR CONNECTING TWO JOINING SURFACES

Panelizing Method for Printed Circuit Board Manufacturing

CONDUCTIVE HOOK AND LOOP ATTACHMENT FOR A PRINTED CIRCUIT BOARD

SUBMOUNT FOR ELECTRONIC COMPONENTS

VOICE OUTPUT UNIT

Radio Frequency Interconnect Circuits and Techniques

MULTI-PIECE BOARD AND FABRICATION METHOD THEREFOR