Auxiliary carrier between devices, the carrier having an electrical connection structure

Industry

CPC
H01L2225/06572

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/06572Auxiliary carrier between devices, the carrier having an electrical connection structure

Industries

Patents Grantslast 30 patents

Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 11,978,730
- Issue date May 7, 2024
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memories and memory components with interconnected and redundant da...
- Patent number 11,955,165
- Issue date Apr 9, 2024
- RAMBUS INC.
- Frederick A. Ware
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package structure
- Patent number 11,942,385
- Issue date Mar 26, 2024
- Advanced Semiconductor Engineering, Inc.
- Sheng-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a through-electrode penetrating a m...
- Patent number 11,942,458
- Issue date Mar 26, 2024
- Samsung Electronics Co., Ltd.
- Doohwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,901,252
- Issue date Feb 13, 2024
- Advanced Semiconductor Engineering, Inc.
- Ming-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 11,901,275
- Issue date Feb 13, 2024
- ADVANCED SEMICONDUCTOR ENGINEERING KOREA, INC.
- Soonheung Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking integrated circuits containing serializer and deserializer...
- Patent number 11,894,342
- Issue date Feb 6, 2024
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal delivery in stacked device
- Patent number 11,887,969
- Issue date Jan 30, 2024
- Brent Keeth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Land-side silicon capacitor design and semiconductor package using...
- Patent number 11,887,976
- Issue date Jan 30, 2024
- Mediatek Inc.
- Che-Hung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with through-mold via
- Patent number 11,869,829
- Issue date Jan 9, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Joo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Asymmetric stackup structure for SoC package substrates
- Patent number 11,862,597
- Issue date Jan 2, 2024
- Apple Inc.
- Yikang Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with discrete blocks
- Patent number 11,855,045
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 11,854,877
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including printed circuit board having shielding...
- Patent number 11,848,279
- Issue date Dec 19, 2023
- Samsung Electronics Co., Ltd.
- Daehee Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-in-package module
- Patent number 11,837,577
- Issue date Dec 5, 2023
- Samsung Electronics Co., Ltd.
- Ae-Nee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,837,581
- Issue date Dec 5, 2023
- Samsung Electronics Co., Ltd.
- Youngsang Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 11,830,841
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,804,457
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for thermal dissipation
- Patent number 11,804,475
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Company
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip
- Patent number 11,798,906
- Issue date Oct 24, 2023
- Samsung Electronics Co., Ltd.
- Jeong-gi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 11,798,932
- Issue date Oct 24, 2023
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and method of manufacturing the same
- Patent number 11,798,859
- Issue date Oct 24, 2023
- Advanced Semiconductor Engineering, Inc.
- Chia-Pin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package semiconductor assemblies and methods of manufact...
- Patent number 11,791,252
- Issue date Oct 17, 2023
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies including thermal circuits and methods of...
- Patent number 11,791,315
- Issue date Oct 17, 2023
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,791,311
- Issue date Oct 17, 2023
- Nagase & Co., Ltd.
- Yoichiro Kurita
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dual sided fan-out package having low warpage across all temperatures
- Patent number 11,784,166
- Issue date Oct 10, 2023
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 11,764,188
- Issue date Sep 19, 2023
- SILICONWARE PRECISION INDUSTRIES CO., LTD.
- Meng-Huan Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sloped interconnector for stacked die package
- Patent number 11,756,932
- Issue date Sep 12, 2023
- SanDisk Technologies LLC
- Xianlu Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally efficient semiconductor device assemblies including inter...
- Patent number 11,742,328
- Issue date Aug 29, 2023
- Micron Technology, Inc.
- Pezhman Monadgemi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through electrode substrate and semiconductor device
- Patent number 11,742,273
- Issue date Aug 29, 2023
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH THROUGH-MOLD VIA
- Publication number 20240145346
- Publication date May 2, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Dong Joo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SYSTEM INTEGRATION
- Publication number 20240128238
- Publication date Apr 18, 2024
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC RANDOM-ACCESS MEMORY IN A MOLDING BENEATH A DIE
- Publication number 20240113033
- Publication date Apr 4, 2024
- Intel Corporation
- Eng Huat GOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240087954
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JING-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...
- Publication number 20240072008
- Publication date Feb 29, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jinchang ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREOF
- Publication number 20240064901
- Publication date Feb 22, 2024
- Unimicron Technology Corp.
- Yu-Shen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-PERFORMANCE HYBRID BONDED INTERCONNECT SYSTEMS
- Publication number 20240038702
- Publication date Feb 1, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240030077
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- SANGHYEON JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE UNIT, METHOD OF MANUFACTURING THE SAME, AND PACKAGE ST...
- Publication number 20240030124
- Publication date Jan 25, 2024
- Walton Advanced Engineering, Inc
- HONG-CHI YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240014151
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
- Publication number 20240006401
- Publication date Jan 4, 2024
- Intel Corporation
- Russell K. MORTENSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230395484
- Publication date Dec 7, 2023
- Innolux Corporation
- Jen-Hai Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230395571
- Publication date Dec 7, 2023
- Siliconware Precision Industries Co., Ltd.
- Meng-Huan Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY EFFICIENT SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING INTER...
- Publication number 20230378137
- Publication date Nov 23, 2023
- Micron Technology, Inc.
- Pezhman Monadgemi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES WITH SYSTEMS AND METHODS FOR MANAGING HIGH...
- Publication number 20230369291
- Publication date Nov 16, 2023
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUSBAR WITH DIELECTRIC COATING
- Publication number 20230326834
- Publication date Oct 12, 2023
- Microchip Technology Caldicot Limited
- Piers Tremlett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN CLIENT FORM FACTOR ASSEMBLY
- Publication number 20230317705
- Publication date Oct 5, 2023
- Intel Corporation
- Carlton Hanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRONIC SYSTEM, AND ELECTROSTATIC DISCHARG...
- Publication number 20230290774
- Publication date Sep 14, 2023
- NANYA TECHNOLOGY CORPORATION
- Chun-Lu LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20230282557
- Publication date Sep 7, 2023
- DAI NIPPON PRINTING CO., LTD.
- Takamasa TAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE MATERIAL FOR ELECTRONIC DEVICES
- Publication number 20230268309
- Publication date Aug 24, 2023
- SUMITOMO CHEMICAL CO., LTD.
- Martin Humphries
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230245975
- Publication date Aug 3, 2023
- Samsung Electronics Co., Ltd.
- Hae-Jung YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHANNEL DEVICE STACKING
- Publication number 20230207437
- Publication date Jun 29, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230178515
- Publication date Jun 8, 2023
- LUXSHARE ELECTRONIC TECHNOLOGY (KUNSHAN) LTD.
- Xiaolei ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING ARCHITECTURE WITH INTERMEDIATE ROUTING LAYERS
- Publication number 20230178513
- Publication date Jun 8, 2023
- Intel Corporation
- Kimin Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230145182
- Publication date May 11, 2023
- Shinko Electric Industries Co., Ltd.
- Hitoshi Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL LTCC PACKAGE STRUCTURE
- Publication number 20230131658
- Publication date Apr 27, 2023
- ONANO INDUSTRIAL CORP.
- Chun-Hsia Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230118400
- Publication date Apr 20, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH INTERCONNECTION BETWEEN CHIPS AND PACKAGING...
- Publication number 20230102457
- Publication date Mar 30, 2023
- Unimicron Technology Corp.
- Jia Shiang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Asymmetric Stackup Structure for SoC Package Substrates
- Publication number 20230092505
- Publication date Mar 23, 2023
- Apple Inc.
- Yikang Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230061795
- Publication date Mar 2, 2023
- Samsung Electronics Co., Ltd.
- Youngsang CHO
- H01 - BASIC ELECTRIC ELEMENTS

Auxiliary carrier between devices, the carrier having an electrical connection structure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Offset interposers for large-bottom packages and large-die package-...

Memories and memory components with interconnected and redundant da...

Semiconductor package structure

Semiconductor package including a through-electrode penetrating a m...

Semiconductor device package and method of manufacturing the same

Semiconductor device package

Stacking integrated circuits containing serializer and deserializer...

Signal delivery in stacked device

Land-side silicon capacitor design and semiconductor package using...

Semiconductor device with through-mold via

Asymmetric stackup structure for SoC package substrates

Semiconductor device with discrete blocks

Semiconductor device and manufacturing method of the same

Electronic device including printed circuit board having shielding...

System-in-package module

Semiconductor package

Semiconductor package and method for manufacturing the same

Package structure and manufacturing method thereof

Semiconductor package for thermal dissipation

Semiconductor chip

Offset interposers for large-bottom packages and large-die package-...

Electronic device package and method of manufacturing the same

Package-on-package semiconductor assemblies and methods of manufact...

Semiconductor assemblies including thermal circuits and methods of...

Electronic device

Dual sided fan-out package having low warpage across all temperatures

Electronic package and manufacturing method thereof

Sloped interconnector for stacked die package

Thermally efficient semiconductor device assemblies including inter...

Through electrode substrate and semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH THROUGH-MOLD VIA

3D SYSTEM INTEGRATION

DYNAMIC RANDOM-ACCESS MEMORY IN A MOLDING BENEATH A DIE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...

CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREOF

HIGH-PERFORMANCE HYBRID BONDED INTERCONNECT SYSTEMS

PACKAGE AND METHOD OF FABRICATING THE SAME

CHIP PACKAGE UNIT, METHOD OF MANUFACTURING THE SAME, AND PACKAGE ST...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

THERMALLY EFFICIENT SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING INTER...

SEMICONDUCTOR ASSEMBLIES WITH SYSTEMS AND METHODS FOR MANAGING HIGH...

BUSBAR WITH DIELECTRIC COATING

THIN CLIENT FORM FACTOR ASSEMBLY

SEMICONDUCTOR DEVICE, ELECTRONIC SYSTEM, AND ELECTROSTATIC DISCHARG...

THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE

THERMALLY CONDUCTIVE MATERIAL FOR ELECTRONIC DEVICES

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

MULTI-CHANNEL DEVICE STACKING

DOUBLE-SIDED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGING ARCHITECTURE WITH INTERMEDIATE ROUTING LAYERS

SEMICONDUCTOR DEVICE

THREE-DIMENSIONAL LTCC PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE WITH INTERCONNECTION BETWEEN CHIPS AND PACKAGING...

Asymmetric Stackup Structure for SoC Package Substrates

SEMICONDUCTOR PACKAGE