Auxiliary carrier between devices, the carrier having no electrical connection structure

Industry

CPC
H01L2225/06575

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/06575Auxiliary carrier between devices, the carrier having no electrical connection structure

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 12,211,829
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Manho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with die support structures
- Patent number 12,148,727
- Issue date Nov 19, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 12,119,323
- Issue date Oct 15, 2024
- Kioxia Corporation
- Soichi Homma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tablet ultrasound system
- Patent number 12,102,480
- Issue date Oct 1, 2024
- Teratech Corporation
- Alice Chiang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stack packages including supporter
- Patent number 12,107,077
- Issue date Oct 1, 2024
- SK hynix Inc.
- Tae Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having dolmen structure and manufacturing meth...
- Patent number 12,074,139
- Issue date Aug 27, 2024
- Tatsuya Yahata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with glass spacer
- Patent number 12,046,581
- Issue date Jul 23, 2024
- Intel Corporation
- Mao Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device having dolmen structu...
- Patent number 11,935,870
- Issue date Mar 19, 2024
- Yoshinobu Ozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,908,837
- Issue date Feb 20, 2024
- Kioxia Corporation
- Soichiro Ibaraki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 11,876,080
- Issue date Jan 16, 2024
- Kioxia Corporation
- Masahiro Yoshihara
- G11 - INFORMATION STORAGE
Information Patent Grant
Tablet ultrasound system
- Patent number 11,857,363
- Issue date Jan 2, 2024
- Teratech Corporation
- Alice Chiang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor packages with chips partially embedded in adhesive
- Patent number 11,862,603
- Issue date Jan 2, 2024
- Samsung Electronics Co., Ltd.
- Taewook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,810,868
- Issue date Nov 7, 2023
- Samsung Electronics Co., Ltd.
- Byeonguk Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a protection mechanism and associated sys...
- Patent number 11,756,844
- Issue date Sep 12, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 11,728,252
- Issue date Aug 15, 2023
- Advanced Semiconductor Engineering, Inc.
- Hui Hua Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices having spacer chips with protective...
- Patent number 11,705,405
- Issue date Jul 18, 2023
- Samsung Electronics Co., Ltd.
- Jiwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,705,436
- Issue date Jul 18, 2023
- Kioxia Corporation
- Takeori Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package and packaging method thereof
- Patent number 11,670,622
- Issue date Jun 6, 2023
- Powertech Technology Inc.
- Yin-Huang Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,631,660
- Issue date Apr 18, 2023
- Samsung Electronics Co., Ltd.
- Manho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack packages including supporter
- Patent number 11,600,599
- Issue date Mar 7, 2023
- SK hynix Inc.
- Tae Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,594,519
- Issue date Feb 28, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Naruhiro Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 11,569,200
- Issue date Jan 31, 2023
- Samsung Electronics Co., Ltd.
- Kihong Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,538,789
- Issue date Dec 27, 2022
- Kioxia Corporation
- Yoshiyuki Kosaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device manufacturing method
- Patent number 11,482,502
- Issue date Oct 25, 2022
- Kioxia Corporation
- Keiichi Niwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,476,230
- Issue date Oct 18, 2022
- Kioxia Corporation
- Soichi Homma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,476,240
- Issue date Oct 18, 2022
- Kioxia Corporation
- Mariko Oishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 11,410,974
- Issue date Aug 9, 2022
- Kioxia Corporation
- Masahiro Yoshihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with glass spacer
- Patent number 11,393,788
- Issue date Jul 19, 2022
- Intel Corporation
- Mao Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,302,675
- Issue date Apr 12, 2022
- Kioxia Corporation
- Takeori Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tablet ultrasound system
- Patent number 11,179,138
- Issue date Nov 23, 2021
- Teratech Corporation
- Alice M. Chiang
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
THERMALLY CONDUCTIVE SPACER
- Publication number 20240404994
- Publication date Dec 5, 2024
- Western Digital Technologies, Inc.
- Jayavel Pachamuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MEMORY DEVICE WITH OVERHANG SUPPORT STRUCTURE
- Publication number 20240397735
- Publication date Nov 28, 2024
- Western Digital Technologies, Inc.
- Shujun Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTURE AND MANUFACTURING METH...
- Publication number 20240371832
- Publication date Nov 7, 2024
- Resonac Corporation
- Tatsuya YAHATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERRACED SUPPORT STRUCTURE TO MITIGATE STACKED DIE OVERHANG DEFLECTION
- Publication number 20240274580
- Publication date Aug 15, 2024
- Micron Technology, Inc.
- Faxing CHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240234367
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Kihong JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240224544
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- Kihong JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20230387080
- Publication date Nov 30, 2023
- Samsung Electronics Co., Ltd.
- Won Hee HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGES INCLUDING SUPPORTER
- Publication number 20230170332
- Publication date Jun 1, 2023
- SK HYNIX INC.
- Tae Hoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SUBSTRATE, AND METHOD FOR MANUFACTURING SEMIC...
- Publication number 20230170321
- Publication date Jun 1, 2023
- KIOXIA Corporation
- Keiichi NIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230163099
- Publication date May 25, 2023
- Samsung Electronics Co., Ltd.
- Kihong JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK
- Publication number 20230023328
- Publication date Jan 26, 2023
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230005879
- Publication date Jan 5, 2023
- KIOXIA Corporation
- Soichi HOMMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220302083
- Publication date Sep 22, 2022
- KIOXIA Corporation
- Soichiro IBARAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH GLASS SPACER
- Publication number 20220254757
- Publication date Aug 11, 2022
- Intel Corporation
- Mao Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220216184
- Publication date Jul 7, 2022
- KIOXIA Corporation
- Takeori MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE AND PACKAGING METHOD THEREOF
- Publication number 20220165709
- Publication date May 26, 2022
- Powertech Technology Inc.
- Yin-Huang KUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTU...
- Publication number 20220149009
- Publication date May 12, 2022
- Showa Denko Materials Co., Ltd.
- Yoshinobu OZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTURE AND MANUFACTURING METH...
- Publication number 20220149008
- Publication date May 12, 2022
- Showa Denko Materials Co., Ltd.
- Tatsuya YAHATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGES INCLUDING SUPPORTER
- Publication number 20220115355
- Publication date Apr 14, 2022
- SK HYNIX INC.
- Tae Hoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES HAVING SPACER CHIPS WITH PROTECTIVE...
- Publication number 20220059473
- Publication date Feb 24, 2022
- Samsung Electronics Co., Ltd.
- Jiwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220059519
- Publication date Feb 24, 2022
- Samsung Electronics Co., Ltd.
- Manho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220020722
- Publication date Jan 20, 2022
- KIOXIA Corporation
- Soichi HOMMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210407929
- Publication date Dec 30, 2021
- Samsung Electronics Co., Ltd.
- Byeonguk Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH GLASS SPACER
- Publication number 20210280558
- Publication date Sep 9, 2021
- Intel Corporation
- Mao Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210257336
- Publication date Aug 19, 2021
- KIOXIA Corporation
- Takeori MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20210249373
- Publication date Aug 12, 2021
- KIOXIA Corporation
- Keiichi NIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20210249382
- Publication date Aug 12, 2021
- Samsung Electronics Co., Ltd.
- Kihong JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210193617
- Publication date Jun 24, 2021
- Toshiba Memory Corporation
- Yoshiyuki KOSAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A PROTECTION MECHANISM AND ASSOCIATED SYS...
- Publication number 20210183716
- Publication date Jun 17, 2021
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH DIE SUPPORT STRUCTURES
- Publication number 20210167030
- Publication date Jun 3, 2021
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS

Auxiliary carrier between devices, the carrier having no electrical connection structure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package

Semiconductor device assembly with die support structures

Semiconductor device and method of manufacturing semiconductor device

Tablet ultrasound system

Stack packages including supporter

Semiconductor device having dolmen structure and manufacturing meth...

Integrated circuit package with glass spacer

Method for manufacturing semiconductor device having dolmen structu...

Semiconductor device

Semiconductor memory device

Tablet ultrasound system

Semiconductor packages with chips partially embedded in adhesive

Semiconductor package

Semiconductor device with a protection mechanism and associated sys...

Semiconductor device package

Packaged semiconductor devices having spacer chips with protective...

Semiconductor device and method for manufacturing the same

Stacked semiconductor package and packaging method thereof

Semiconductor package

Stack packages including supporter

Semiconductor device

Semiconductor package and method of manufacturing semiconductor pac...

Semiconductor device

Semiconductor device and semiconductor device manufacturing method

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device

Semiconductor memory device

Integrated circuit package with glass spacer

Semiconductor device and method for manufacturing the same

Tablet ultrasound system

Patents Applicationslast 30 patents

THERMALLY CONDUCTIVE SPACER

PACKAGED MEMORY DEVICE WITH OVERHANG SUPPORT STRUCTURE

SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTURE AND MANUFACTURING METH...

TERRACED SUPPORT STRUCTURE TO MITIGATE STACKED DIE OVERHANG DEFLECTION

SEMICONDUCTOR PACKAGE

PROCESSOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

STACK PACKAGES INCLUDING SUPPORTER

SEMICONDUCTOR DEVICE, SUBSTRATE, AND METHOD FOR MANUFACTURING SEMIC...

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT PACKAGE WITH GLASS SPACER

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

STACKED SEMICONDUCTOR PACKAGE AND PACKAGING METHOD THEREOF

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTU...

SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTURE AND MANUFACTURING METH...

STACK PACKAGES INCLUDING SUPPORTER

PACKAGED SEMICONDUCTOR DEVICES HAVING SPACER CHIPS WITH PROTECTIVE...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT PACKAGE WITH GLASS SPACER

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH A PROTECTION MECHANISM AND ASSOCIATED SYS...

SEMICONDUCTOR DEVICE ASSEMBLY WITH DIE SUPPORT STRUCTURES