Auxiliary members for HDI interconnects

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H01L2224/2499

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/2499Auxiliary members for HDI interconnects

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Display device and manufacturing method therefor
- Patent number 12,040,318
- Issue date Jul 16, 2024
- Samsung Display Co., Ltd.
- Jong Hyuk Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging substrate fine pitch metal bump and reinfor...
- Patent number 11,908,819
- Issue date Feb 20, 2024
- Apple Inc.
- Jun Chung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,842,970
- Issue date Dec 12, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bridged fanout chiplet connectivity
- Patent number 11,658,123
- Issue date May 23, 2023
- Advanced Micro Devices, Inc.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for improving reliability
- Patent number 11,557,560
- Issue date Jan 17, 2023
- Samsung Electronics Co., Ltd.
- Yeohoon Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded packaging module and manufacturing method for the same
- Patent number 11,552,039
- Issue date Jan 10, 2023
- Delta Electronics (Shanghai) Co., Ltd.
- Zengsheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,508,687
- Issue date Nov 22, 2022
- Samsung Electronics Co., Ltd.
- Minkyeong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure, semiconductor package and method of fabric...
- Patent number 11,342,296
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bare die integration with printed components on flexible substrate...
- Patent number 11,122,683
- Issue date Sep 14, 2021
- Palo Alto Research Center Incorporated
- Tse Nga Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,121,102
- Issue date Sep 14, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure, semiconductor device and method of fabricating t...
- Patent number 10,854,569
- Issue date Dec 1, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and fixture for chip attachment to physical objects
- Patent number 10,847,384
- Issue date Nov 24, 2020
- Palo Alto Research Center Incorporated
- Ping Mei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,833,041
- Issue date Nov 10, 2020
- Samsung Electronics Co., Ltd.
- Jun Oh Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip fan out package and methods of forming the same
- Patent number 10,833,039
- Issue date Nov 10, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterned structure for electronic device and manufacturing method...
- Patent number 10,818,497
- Issue date Oct 27, 2020
- Winbond Electronics Corp.
- Yen-Jui Chu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 10,790,210
- Issue date Sep 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging method
- Patent number 10,756,077
- Issue date Aug 25, 2020
- SHANGHAI ZHAOXIN SEMICONDUCTOR CO., LTD.
- Wen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked electronics package and method of manufacturing thereof
- Patent number 10,700,035
- Issue date Jun 30, 2020
- General Electric Company
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 10,535,620
- Issue date Jan 14, 2020
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 10,510,706
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for integrating at least one 3D interconnection for the manu...
- Patent number 10,438,923
- Issue date Oct 8, 2019
- 3DIS Technologies
- Ayad Ghannam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor structure
- Patent number 10,373,932
- Issue date Aug 6, 2019
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 10,332,856
- Issue date Jun 25, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser assisted transfer welding process
- Patent number 10,181,483
- Issue date Jan 15, 2019
- Etienne Menard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-chip fan out package and methods of forming the same
- Patent number 10,163,857
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bare die integration with printed components on flexible substrate...
- Patent number 10,165,677
- Issue date Dec 25, 2018
- Palo Alto Research Center Incorporated
- Ping Mei
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Die package with openings surrounding end-portions of through packa...
- Patent number 10,079,225
- Issue date Sep 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 9,929,113
- Issue date Mar 27, 2018
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for wireless connection in integrated...
- Patent number 9,837,340
- Issue date Dec 5, 2017
- Intel Corporation
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip fan out package and methods of forming the same
- Patent number 9,691,706
- Issue date Jun 27, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240258253
- Publication date Aug 1, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND MANUFACTURING METHOD THEREOF
- Publication number 20240178357
- Publication date May 30, 2024
- AUO Corporation
- Shih-Hsiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REINFORCED DIELECTRIC AND METHOD THEREFOR
- Publication number 20240105658
- Publication date Mar 28, 2024
- NXP B.V.
- Tsung Nan Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC PACKAGE
- Publication number 20240096835
- Publication date Mar 21, 2024
- Siliconware Precision Industries Co., Ltd.
- Pin-Jing SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE, METHOD, AND SYSTEM TO PROTECT THROUGH-DIELECTRIC VIAS OF A...
- Publication number 20240063147
- Publication date Feb 22, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230386949
- Publication date Nov 30, 2023
- Samsung Electronics Co., Ltd.
- Jiyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230230967
- Publication date Jul 20, 2023
- SAMSUNG DISPLAY CO., LTD.
- In Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER INTERCONNECTS WITH SELF-ALIGNED HOURGLASS-SHAPED METAL CAP
- Publication number 20230110587
- Publication date Apr 13, 2023
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE
- Publication number 20230066130
- Publication date Mar 2, 2023
- LG Display Co., Ltd.
- MinJae KANG
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20220359478
- Publication date Nov 10, 2022
- SAMSUNG DISPLAY CO., LTD.
- Xinxing LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220148987
- Publication date May 12, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP HAVING BS-PDN STRUCTURE
- Publication number 20220139863
- Publication date May 5, 2022
- Samsung Electronics Co., Ltd.
- Eunseok Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BRIDGED FANOUT CHIPLET CONNECTIVITY
- Publication number 20220102276
- Publication date Mar 31, 2022
- ADVANCED MICRO DEVICES, INC.
- RAHUL AGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE FOR IMPROVING RELIABILITY
- Publication number 20220059492
- Publication date Feb 24, 2022
- Samsung Electronics Co., Ltd.
- Yeohoon Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR PACKAGE AND METHOD OF FABRIC...
- Publication number 20210074665
- Publication date Mar 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200328170
- Publication date Oct 15, 2020
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PACKAGING MODULE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20200251438
- Publication date Aug 6, 2020
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Zengsheng WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE, SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING T...
- Publication number 20200118960
- Publication date Apr 16, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200043819
- Publication date Feb 6, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20190312004
- Publication date Oct 10, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20190139924
- Publication date May 9, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING METHOD
- Publication number 20190139952
- Publication date May 9, 2019
- Shanghai Zhaoxin Semiconductor Co., Ltd.
- Wen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARE DIE INTEGRATION WITH PRINTED COMPONENTS ON FLEXIBLE SUBSTRATE...
- Publication number 20190124757
- Publication date Apr 25, 2019
- Palo Alto Research Center Incorporated
- Tse Nga Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Chip Fan Out Package and Methods of Forming the Same
- Publication number 20190109118
- Publication date Apr 11, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20190035758
- Publication date Jan 31, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Jun Oh HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR INTEGRATING AT LEAST ONE 3D INTERCONNECTION FOR THE MANU...
- Publication number 20180254258
- Publication date Sep 6, 2018
- 3DIS Technologies
- Ayad Ghannam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20180240768
- Publication date Aug 23, 2018
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED ELECTRONICS PACKAGE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20180130762
- Publication date May 10, 2018
- GENERAL ELECTRIC COMPANY
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die package with Openings Surrounding End-portions of Through Packa...
- Publication number 20170229432
- Publication date Aug 10, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Associated Methods
- Publication number 20140345924
- Publication date Nov 27, 2014
- Nokia Corporation
- Mark Lee ALLEN
- H01 - BASIC ELECTRIC ELEMENTS

Auxiliary members for HDI interconnects

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device and manufacturing method therefor

Semiconductor packaging substrate fine pitch metal bump and reinfor...

Semiconductor package and manufacturing method thereof

Hybrid bridged fanout chiplet connectivity

Semiconductor package for improving reliability

Embedded packaging module and manufacturing method for the same

Semiconductor package

Semiconductor structure, semiconductor package and method of fabric...

Bare die integration with printed components on flexible substrate...

Semiconductor package and manufacturing method thereof

Package structure, semiconductor device and method of fabricating t...

Method and fixture for chip attachment to physical objects

Fan-out semiconductor package

Multi-chip fan out package and methods of forming the same

Patterned structure for electronic device and manufacturing method...

Semiconductor package and manufacturing method thereof

Chip packaging method

Stacked electronics package and method of manufacturing thereof

Semiconductor package and manufacturing method thereof

Package structure and method of fabricating the same

Method for integrating at least one 3D interconnection for the manu...

Stacked semiconductor structure

Package structure and method of fabricating the same

Laser assisted transfer welding process

Multi-chip fan out package and methods of forming the same

Bare die integration with printed components on flexible substrate...

Die package with openings surrounding end-portions of through packa...

Semiconductor package and manufacturing method thereof

Apparatus, system, and method for wireless connection in integrated...

Multi-chip fan out package and methods of forming the same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

DISPLAY PANEL AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH REINFORCED DIELECTRIC AND METHOD THEREFOR

MANUFACTURING METHOD OF ELECTRONIC PACKAGE

DEVICE, METHOD, AND SYSTEM TO PROTECT THROUGH-DIELECTRIC VIAS OF A...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

COPPER INTERCONNECTS WITH SELF-ALIGNED HOURGLASS-SHAPED METAL CAP

DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE

DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT CHIP HAVING BS-PDN STRUCTURE

HYBRID BRIDGED FANOUT CHIPLET CONNECTIVITY

SEMICONDUCTOR PACKAGE FOR IMPROVING RELIABILITY

SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR PACKAGE AND METHOD OF FABRIC...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

EMBEDDED PACKAGING MODULE AND MANUFACTURING METHOD FOR THE SAME

PACKAGE STRUCTURE, SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING T...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

CHIP PACKAGING METHOD

BARE DIE INTEGRATION WITH PRINTED COMPONENTS ON FLEXIBLE SUBSTRATE...

Multi-Chip Fan Out Package and Methods of Forming the Same

FAN-OUT SEMICONDUCTOR PACKAGE

METHOD FOR INTEGRATING AT LEAST ONE 3D INTERCONNECTION FOR THE MANU...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

STACKED ELECTRONICS PACKAGE AND METHOD OF MANUFACTURING THEREOF

Die package with Openings Surrounding End-portions of Through Packa...

Apparatus and Associated Methods