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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/433Auxiliary members in containers characterised by their shape

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Cooling apparatus with offset flow paths
- Patent number 12,369,277
- Issue date Jul 22, 2025
- Motivair Corporation
- Rich S Whitmore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor package structure
- Patent number 12,362,256
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and method for manufacturing the same
- Patent number 12,354,926
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device with dual heat dissipation structures
- Patent number 12,334,414
- Issue date Jun 17, 2025
- Infineon Technologies AG
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Baffles for electronic circuits immersed in cooling fluid in a tank
- Patent number 12,322,676
- Issue date Jun 3, 2025
- Auradine, Inc.
- Anuya Reddy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spring loaded compliant coolant distribution manifold for direct li...
- Patent number 12,315,782
- Issue date May 27, 2025
- Google LLC
- Madhusudan K. Iyengar
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Bellows for immersion cooling
- Patent number 12,309,972
- Issue date May 20, 2025
- MTS IP Holdings Ltd
- Nihal Joshua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus including integrated pads and methods of manufacturing th...
- Patent number 12,300,647
- Issue date May 13, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,300,573
- Issue date May 13, 2025
- Mediatek Inc.
- Bo-Jiun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 12,300,575
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous integrated multi-chip cooler module
- Patent number 12,300,577
- Issue date May 13, 2025
- International Business Machines Corporation
- Timothy J. Chainer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and semiconductor apparatus
- Patent number 12,300,562
- Issue date May 13, 2025
- Fuji Electric Co., Ltd.
- Yushi Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power module package structures
- Patent number 12,293,955
- Issue date May 6, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method of forming the same
- Patent number 12,283,537
- Issue date Apr 22, 2025
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coplanar control for film-type thermal interface
- Patent number 12,278,162
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,278,156
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct liquid cooling with O-ring sealing
- Patent number 12,272,619
- Issue date Apr 8, 2025
- Google LLC
- Jorge Padilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided coolable semiconductor package
- Patent number 12,266,586
- Issue date Apr 1, 2025
- Infineon Technologies AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced base die heat path using through-silicon vias
- Patent number 12,266,589
- Issue date Apr 1, 2025
- Intel Corporation
- Weston Bertrand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of manufacturing semiconductor dev...
- Patent number 12,261,145
- Issue date Mar 25, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Yeon Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,255,120
- Issue date Mar 18, 2025
- Denso Corporation
- Yoshitaka Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and data transferring method for semiconductor...
- Patent number 12,255,149
- Issue date Mar 18, 2025
- PREFERRED NETWORKS, INC.
- Nobuyoshi Tanaka
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thermal interface material containment
- Patent number 12,218,031
- Issue date Feb 4, 2025
- Infinera Corporation
- John W. Osenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 12,211,821
- Issue date Jan 28, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module, and photosensitive assembly and manufacturing method...
- Patent number 12,211,864
- Issue date Jan 28, 2025
- NINGBO SUNNY OPOTECH CO., LTD.
- Zhongyu Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded liquid cooling
- Patent number 12,199,011
- Issue date Jan 14, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technologies for liquid cooling systems
- Patent number 12,191,230
- Issue date Jan 7, 2025
- Intel Corporation
- Ralph W. Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging of a semiconductor device with dual sealing materials
- Patent number 12,183,647
- Issue date Dec 31, 2024
- Mitsubishi Electric Corporation
- Soichi Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer directly bonded to bonding pads on a plurality of dies
- Patent number 12,165,952
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package including multiple semiconductor devices
- Patent number 12,142,551
- Issue date Nov 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY WITH AN INTERLAYER COOLING PATHWAY
- Publication number 20250226288
- Publication date Jul 10, 2025
- STATS ChipPAC Pte Ltd.
- JiSeon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL CHIP COOLING PLATFORM BASED ON MICRO-NANO STRUCTURE
- Publication number 20250226287
- Publication date Jul 10, 2025
- GUANGDONG OCEAN UNIVERSITY
- Haowei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPLANAR CONTROL FOR FILM-TYPE THERMAL INTERFACE
- Publication number 20250210455
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH THERMAL RESERVOIR DIES AND METHODS...
- Publication number 20250210608
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Lipu Kris Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL ENCAPSULATION DEVICE
- Publication number 20250201664
- Publication date Jun 19, 2025
- DONGGUAN ZIITEK ELECTRONICAL MATERIAL AND TECHNOLOGY LTD.
- Chih-Sheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND DATA TRANSFERRING METHOD FOR SEMICONDUCTOR...
- Publication number 20250192063
- Publication date Jun 12, 2025
- Preferred Networks, Inc.
- Nobuyoshi TANAKA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING SEMICONDUCTOR DEV...
- Publication number 20250192093
- Publication date Jun 12, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Yeon RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED BASE DIE HEAT PATH USING THROUGH-SILICON VIAS
- Publication number 20250191998
- Publication date Jun 12, 2025
- Intel Corporation
- Weston BERTRAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED LIQUID COOLING
- Publication number 20250183120
- Publication date Jun 5, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF PRODUCING HIGH POWER MODULE PACKAGE STRUCTURES
- Publication number 20250174515
- Publication date May 29, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMO-MECHANICAL DEVICE FOR COMPUTING SYSTEM
- Publication number 20250174520
- Publication date May 29, 2025
- Xilinx, Inc.
- Gamal REFAI-AHMED
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR COOLING AN INTEGRATED CIRCUIT
- Publication number 20250157882
- Publication date May 15, 2025
- ADVANCED MICRO DEVICES, INC.
- ZhiXin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT-INCORPORATING SUBSTRATE
- Publication number 20250149404
- Publication date May 8, 2025
- Shinko Electric Industries Co., Ltd.
- Shinichiro Sekijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRIC POWER CONVERSION UNIT AND METHOD FOR...
- Publication number 20250149405
- Publication date May 8, 2025
- ROHM CO., LTD.
- Kazunori FUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES
- Publication number 20250140659
- Publication date May 1, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20250118705
- Publication date Apr 10, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF THERMAL MANAGEMENT DIES
- Publication number 20250112196
- Publication date Apr 3, 2025
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...
- Publication number 20250105094
- Publication date Mar 27, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION
- Publication number 20250079261
- Publication date Mar 6, 2025
- UTAC Headquarters Pte. Ltd.
- IL Kwon SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR MULTI-ZONE TEMPERATURE CONTROL OF JET IMP...
- Publication number 20250079262
- Publication date Mar 6, 2025
- Intel Corporation
- Sami Mohammed Alelyani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND MANUFACTURING METHOD OF THE SAME
- Publication number 20250062188
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING UNIT FOR DIRECT COOLING OF SEMICONDUCTOR DEVICE AND MANUF...
- Publication number 20250038069
- Publication date Jan 30, 2025
- CHUNG-ANG UNIVERSITY INDUSTRY ACADEMIC COOPERATION FOUNDATION
- HYOUNG SOON LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMING A SEMICONDUC...
- Publication number 20250022768
- Publication date Jan 16, 2025
- INFINEON TECHNOLOGIES AG
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240429194
- Publication date Dec 26, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- EUNSU LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE RELIEF VALVE AND ADSORBENT CHAMBER FOR TWO-PHASE IMMERSION...
- Publication number 20240404916
- Publication date Dec 5, 2024
- MTS IP Holdings Ltd
- Nihal Joshua
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
BELLOWS FOR IMMERSION COOLING
- Publication number 20240389263
- Publication date Nov 21, 2024
- MTS IP Holdings Ltd
- Nihal Joshua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240379488
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hua WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS-BASED ACTIVE COOLING SYSTEMS
- Publication number 20240373593
- Publication date Nov 7, 2024
- Frore Systems Inc.
- Prabhu Sathyamurthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND FABRICATION
- Publication number 20240371716
- Publication date Nov 7, 2024
- Yangtze Memory Technologies Co., Ltd.
- Li TAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING THERMAL CONDUCTIVE PATTERN
- Publication number 20240363488
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS

Auxiliary members in containers characterised by their shape

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Cooling apparatus with offset flow paths

Method for forming semiconductor package structure

Package and method for manufacturing the same

Power semiconductor device with dual heat dissipation structures

Baffles for electronic circuits immersed in cooling fluid in a tank

Spring loaded compliant coolant distribution manifold for direct li...

Bellows for immersion cooling

Apparatus including integrated pads and methods of manufacturing th...

Semiconductor device and manufacturing method thereof

Semiconductor package and method

Heterogeneous integrated multi-chip cooler module

Semiconductor module and semiconductor apparatus

High power module package structures

Electronic package and method of forming the same

Coplanar control for film-type thermal interface

Semiconductor package

Direct liquid cooling with O-ring sealing

Double-sided coolable semiconductor package

Enhanced base die heat path using through-silicon vias

Semiconductor device and methods of manufacturing semiconductor dev...

Semiconductor device and method of manufacturing the same

Semiconductor device and data transferring method for semiconductor...

Thermal interface material containment

Package-on-package assembly with wire bond vias

Camera module, and photosensitive assembly and manufacturing method...

Embedded liquid cooling

Technologies for liquid cooling systems

Packaging of a semiconductor device with dual sealing materials

Interposer directly bonded to bonding pads on a plurality of dies

Package including multiple semiconductor devices

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE ASSEMBLY WITH AN INTERLAYER COOLING PATHWAY

NOVEL CHIP COOLING PLATFORM BASED ON MICRO-NANO STRUCTURE

COPLANAR CONTROL FOR FILM-TYPE THERMAL INTERFACE

INTEGRATED CIRCUIT PACKAGES WITH THERMAL RESERVOIR DIES AND METHODS...

LIQUID METAL ENCAPSULATION DEVICE

SEMICONDUCTOR DEVICE AND DATA TRANSFERRING METHOD FOR SEMICONDUCTOR...

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING SEMICONDUCTOR DEV...

ENHANCED BASE DIE HEAT PATH USING THROUGH-SILICON VIAS

EMBEDDED LIQUID COOLING

METHODS OF PRODUCING HIGH POWER MODULE PACKAGE STRUCTURES

THERMO-MECHANICAL DEVICE FOR COMPUTING SYSTEM

SYSTEMS AND METHODS FOR COOLING AN INTEGRATED CIRCUIT

ELECTRONIC COMPONENT-INCORPORATING SUBSTRATE

SEMICONDUCTOR DEVICE, ELECTRIC POWER CONVERSION UNIT AND METHOD FOR...

PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

SELECTIVE TRANSFER OF THERMAL MANAGEMENT DIES

INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...

SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION

METHODS AND APPARATUS FOR MULTI-ZONE TEMPERATURE CONTROL OF JET IMP...

SEMICONDUCTOR PACKAGES AND MANUFACTURING METHOD OF THE SAME

PACKAGING UNIT FOR DIRECT COOLING OF SEMICONDUCTOR DEVICE AND MANUF...

METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMING A SEMICONDUC...

SEMICONDUCTOR PACKAGE

PRESSURE RELIEF VALVE AND ADSORBENT CHAMBER FOR TWO-PHASE IMMERSION...

BELLOWS FOR IMMERSION COOLING

SEMICONDUCTOR PACKAGE

MEMS-BASED ACTIVE COOLING SYSTEMS

CHIP PACKAGE STRUCTURE AND FABRICATION

SEMICONDUCTOR PACKAGES HAVING THERMAL CONDUCTIVE PATTERN