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Patents Grants
last 30 patents
Information
Patent Grant
Cooling apparatus with offset flow paths
Patent number
12,369,277
Issue date
Jul 22, 2025
Motivair Corporation
Rich S Whitmore
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming semiconductor package structure
Patent number
12,362,256
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Po-Chen Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package and method for manufacturing the same
Patent number
12,354,926
Issue date
Jul 8, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power semiconductor device with dual heat dissipation structures
Patent number
12,334,414
Issue date
Jun 17, 2025
Infineon Technologies AG
Jayaganasan Narayanasamy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Baffles for electronic circuits immersed in cooling fluid in a tank
Patent number
12,322,676
Issue date
Jun 3, 2025
Auradine, Inc.
Anuya Reddy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Spring loaded compliant coolant distribution manifold for direct li...
Patent number
12,315,782
Issue date
May 27, 2025
Google LLC
Madhusudan K. Iyengar
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Grant
Bellows for immersion cooling
Patent number
12,309,972
Issue date
May 20, 2025
MTS IP Holdings Ltd
Nihal Joshua
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus including integrated pads and methods of manufacturing th...
Patent number
12,300,647
Issue date
May 13, 2025
Micron Technology, Inc.
Wei Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
12,300,573
Issue date
May 13, 2025
Mediatek Inc.
Bo-Jiun Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method
Patent number
12,300,575
Issue date
May 13, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heterogeneous integrated multi-chip cooler module
Patent number
12,300,577
Issue date
May 13, 2025
International Business Machines Corporation
Timothy J. Chainer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor module and semiconductor apparatus
Patent number
12,300,562
Issue date
May 13, 2025
Fuji Electric Co., Ltd.
Yushi Sato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High power module package structures
Patent number
12,293,955
Issue date
May 6, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Yusheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package and method of forming the same
Patent number
12,283,537
Issue date
Apr 22, 2025
Advanced Semiconductor Engineering, Inc.
You-Lung Yen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Coplanar control for film-type thermal interface
Patent number
12,278,162
Issue date
Apr 15, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Yu-Hsun Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
12,278,156
Issue date
Apr 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chin-Hua Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Direct liquid cooling with O-ring sealing
Patent number
12,272,619
Issue date
Apr 8, 2025
Google LLC
Jorge Padilla
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Double-sided coolable semiconductor package
Patent number
12,266,586
Issue date
Apr 1, 2025
Infineon Technologies AG
Juergen Hoegerl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Enhanced base die heat path using through-silicon vias
Patent number
12,266,589
Issue date
Apr 1, 2025
Intel Corporation
Weston Bertrand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and methods of manufacturing semiconductor dev...
Patent number
12,261,145
Issue date
Mar 25, 2025
Amkor Technology Singapore Holding Pte Ltd.
Ji Yeon Ryu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing the same
Patent number
12,255,120
Issue date
Mar 18, 2025
Denso Corporation
Yoshitaka Kato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and data transferring method for semiconductor...
Patent number
12,255,149
Issue date
Mar 18, 2025
PREFERRED NETWORKS, INC.
Nobuyoshi Tanaka
G06 - COMPUTING CALCULATING COUNTING
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Patent Grant
Thermal interface material containment
Patent number
12,218,031
Issue date
Feb 4, 2025
Infinera Corporation
John W. Osenbach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package-on-package assembly with wire bond vias
Patent number
12,211,821
Issue date
Jan 28, 2025
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Ellis Chau
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Camera module, and photosensitive assembly and manufacturing method...
Patent number
12,211,864
Issue date
Jan 28, 2025
NINGBO SUNNY OPOTECH CO., LTD.
Zhongyu Luan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Embedded liquid cooling
Patent number
12,199,011
Issue date
Jan 14, 2025
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Technologies for liquid cooling systems
Patent number
12,191,230
Issue date
Jan 7, 2025
Intel Corporation
Ralph W. Jensen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaging of a semiconductor device with dual sealing materials
Patent number
12,183,647
Issue date
Dec 31, 2024
Mitsubishi Electric Corporation
Soichi Sakamoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interposer directly bonded to bonding pads on a plurality of dies
Patent number
12,165,952
Issue date
Dec 10, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Wen-Shiang Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package including multiple semiconductor devices
Patent number
12,142,551
Issue date
Nov 12, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Jerome Teysseyre
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY WITH AN INTERLAYER COOLING PATHWAY
Publication number
20250226288
Publication date
Jul 10, 2025
STATS ChipPAC Pte Ltd.
JiSeon LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NOVEL CHIP COOLING PLATFORM BASED ON MICRO-NANO STRUCTURE
Publication number
20250226287
Publication date
Jul 10, 2025
GUANGDONG OCEAN UNIVERSITY
Haowei LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COPLANAR CONTROL FOR FILM-TYPE THERMAL INTERFACE
Publication number
20250210455
Publication date
Jun 26, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu-Hsun Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGES WITH THERMAL RESERVOIR DIES AND METHODS...
Publication number
20250210608
Publication date
Jun 26, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Lipu Kris Chuang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIQUID METAL ENCAPSULATION DEVICE
Publication number
20250201664
Publication date
Jun 19, 2025
DONGGUAN ZIITEK ELECTRONICAL MATERIAL AND TECHNOLOGY LTD.
Chih-Sheng Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND DATA TRANSFERRING METHOD FOR SEMICONDUCTOR...
Publication number
20250192063
Publication date
Jun 12, 2025
Preferred Networks, Inc.
Nobuyoshi TANAKA
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING SEMICONDUCTOR DEV...
Publication number
20250192093
Publication date
Jun 12, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Ji Yeon RYU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ENHANCED BASE DIE HEAT PATH USING THROUGH-SILICON VIAS
Publication number
20250191998
Publication date
Jun 12, 2025
Intel Corporation
Weston BERTRAND
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMBEDDED LIQUID COOLING
Publication number
20250183120
Publication date
Jun 5, 2025
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF PRODUCING HIGH POWER MODULE PACKAGE STRUCTURES
Publication number
20250174515
Publication date
May 29, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Yusheng LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMO-MECHANICAL DEVICE FOR COMPUTING SYSTEM
Publication number
20250174520
Publication date
May 29, 2025
Xilinx, Inc.
Gamal REFAI-AHMED
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS AND METHODS FOR COOLING AN INTEGRATED CIRCUIT
Publication number
20250157882
Publication date
May 15, 2025
ADVANCED MICRO DEVICES, INC.
ZhiXin Yao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC COMPONENT-INCORPORATING SUBSTRATE
Publication number
20250149404
Publication date
May 8, 2025
Shinko Electric Industries Co., Ltd.
Shinichiro Sekijima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, ELECTRIC POWER CONVERSION UNIT AND METHOD FOR...
Publication number
20250149405
Publication date
May 8, 2025
ROHM CO., LTD.
Kazunori FUJI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES
Publication number
20250140659
Publication date
May 1, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Jerome TEYSSEYRE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
Publication number
20250118705
Publication date
Apr 10, 2025
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Ellis Chau
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELECTIVE TRANSFER OF THERMAL MANAGEMENT DIES
Publication number
20250112196
Publication date
Apr 3, 2025
Intel Corporation
Feras Eid
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...
Publication number
20250105094
Publication date
Mar 27, 2025
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION
Publication number
20250079261
Publication date
Mar 6, 2025
UTAC Headquarters Pte. Ltd.
IL Kwon SHIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS FOR MULTI-ZONE TEMPERATURE CONTROL OF JET IMP...
Publication number
20250079262
Publication date
Mar 6, 2025
Intel Corporation
Sami Mohammed Alelyani
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND MANUFACTURING METHOD OF THE SAME
Publication number
20250062188
Publication date
Feb 20, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Wen-Shiang Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING UNIT FOR DIRECT COOLING OF SEMICONDUCTOR DEVICE AND MANUF...
Publication number
20250038069
Publication date
Jan 30, 2025
CHUNG-ANG UNIVERSITY INDUSTRY ACADEMIC COOPERATION FOUNDATION
HYOUNG SOON LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMING A SEMICONDUC...
Publication number
20250022768
Publication date
Jan 16, 2025
INFINEON TECHNOLOGIES AG
Chee Yang Ng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240429194
Publication date
Dec 26, 2024
SAMSUNG ELECTRONICS CO,. LTD.
EUNSU LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRESSURE RELIEF VALVE AND ADSORBENT CHAMBER FOR TWO-PHASE IMMERSION...
Publication number
20240404916
Publication date
Dec 5, 2024
MTS IP Holdings Ltd
Nihal Joshua
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Application
BELLOWS FOR IMMERSION COOLING
Publication number
20240389263
Publication date
Nov 21, 2024
MTS IP Holdings Ltd
Nihal Joshua
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240379488
Publication date
Nov 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chin-Hua WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMS-BASED ACTIVE COOLING SYSTEMS
Publication number
20240373593
Publication date
Nov 7, 2024
Frore Systems Inc.
Prabhu Sathyamurthy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE STRUCTURE AND FABRICATION
Publication number
20240371716
Publication date
Nov 7, 2024
Yangtze Memory Technologies Co., Ltd.
Li TAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES HAVING THERMAL CONDUCTIVE PATTERN
Publication number
20240363488
Publication date
Oct 31, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS