Auxiliary members in containers characterised by their shape

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/433Auxiliary members in containers characterised by their shape

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Interposer directly bonded to bonding pads on a plurality of dies
- Patent number 12,165,952
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package including multiple semiconductor devices
- Patent number 12,142,551
- Issue date Nov 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a chip package, method of forming a semiconductor...
- Patent number 12,136,583
- Issue date Nov 5, 2024
- Infineon Technologies AG
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for optimization of vapor transport in a thermal...
- Patent number 12,104,856
- Issue date Oct 1, 2024
- KELVIN THERMAL TECHNOLOGIES, INC.
- Ryan John Lewis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal management of electronics using co-located microjet nozzles...
- Patent number 12,100,643
- Issue date Sep 24, 2024
- JetCool Technologies, Inc.
- Jordan Mizerak
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 12,100,642
- Issue date Sep 24, 2024
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS-based active cooling systems
- Patent number 12,089,374
- Issue date Sep 10, 2024
- Frore Systems Inc.
- Prabhu Sathyamurthy
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Semiconductor packages
- Patent number 12,087,657
- Issue date Sep 10, 2024
- Samsung Electronics Co., Ltd.
- Woojae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with releasable isolation layer protection
- Patent number 12,080,625
- Issue date Sep 3, 2024
- Infineon Technologies Austria AG
- Li Fong Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material layer and use thereof
- Patent number 12,074,087
- Issue date Aug 27, 2024
- Ningbo S J Electronics Co., Ltd.
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having thermal conductive pattern
- Patent number 12,068,224
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Frame member with a porous material between a semiconductor module...
- Patent number 12,068,217
- Issue date Aug 20, 2024
- Mitsubishi Electric Corporation
- Takashi Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced base die heat path using through-silicon vias
- Patent number 12,057,369
- Issue date Aug 6, 2024
- Intel Corporation
- Weston Bertrand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compressible foamed thermal interface materials and methods of maki...
- Patent number 12,033,971
- Issue date Jul 9, 2024
- Laird Technologies, Inc.
- Vijayaraghavan Rajagopal
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Thermal interface structures, electrical systems with thermal inter...
- Patent number 12,014,971
- Issue date Jun 18, 2024
- NXP USA, INC.
- Lu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with electrodes and heat sink and manufacturing method...
- Patent number 12,014,974
- Issue date Jun 18, 2024
- Mitsubishi Electric Corporation
- Masakazu Tani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 12,009,317
- Issue date Jun 11, 2024
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bellows for immersion cooling
- Patent number 11,997,825
- Issue date May 28, 2024
- MTS IP Holdings Ltd
- Nihal Joshua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for forming the same
- Patent number 11,984,381
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coplanar control for film-type thermal interface
- Patent number 11,973,005
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit direct cooling systems having substrates in cont...
- Patent number 11,967,540
- Issue date Apr 23, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabricating method thereof
- Patent number 11,961,797
- Issue date Apr 16, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Keun Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number RE49912
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Akihiro Kimura
Information Patent Grant
Encapsulation process for double-sided cooled packages
- Patent number 11,955,347
- Issue date Apr 9, 2024
- ASMPT SINGAPORE PTE. LTD.
- Teng Hock Kuah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of producing the same
- Patent number 11,929,303
- Issue date Mar 12, 2024
- Dexerials Corporation
- Yusuke Kubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics assembly including top and bottom packages in stac...
- Patent number 11,915,996
- Issue date Feb 27, 2024
- Intel Corporation
- Robert Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device with dual heat dissipation structures
- Patent number 11,908,771
- Issue date Feb 20, 2024
- Infineon Technologies AG
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling solution including microchannel arrays and methods of formi...
- Patent number 11,901,262
- Issue date Feb 13, 2024
- Intel Corporation
- Nicholas Neal
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor package
- Patent number 11,901,269
- Issue date Feb 13, 2024
- Samsung Electronics Co., Ltd.
- Seongchan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vented lids for integrated circuit packages
- Patent number 11,894,282
- Issue date Feb 6, 2024
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRESSURE RELIEF VALVE AND ADSORBENT CHAMBER FOR TWO-PHASE IMMERSION...
- Publication number 20240404916
- Publication date Dec 5, 2024
- MTS IP Holdings Ltd
- Nihal Joshua
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
BELLOWS FOR IMMERSION COOLING
- Publication number 20240389263
- Publication date Nov 21, 2024
- MTS IP Holdings Ltd
- Nihal Joshua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240379488
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hua WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS-BASED ACTIVE COOLING SYSTEMS
- Publication number 20240373593
- Publication date Nov 7, 2024
- Frore Systems Inc.
- Prabhu Sathyamurthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND FABRICATION
- Publication number 20240371716
- Publication date Nov 7, 2024
- Yangtze Memory Technologies Co., Ltd.
- Li TAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING THERMAL CONDUCTIVE PATTERN
- Publication number 20240363488
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20240347442
- Publication date Oct 17, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Keun Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COOLING SYSTEMS FOR DEVICE PACKAGES AND METHODS OF COOLING...
- Publication number 20240332128
- Publication date Oct 3, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312868
- Publication date Sep 19, 2024
- Shinko Electric Industries Co., Ltd.
- Yukinori Hatori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED BASE DIE HEAT PATH USING THROUGH-SILICON VIAS
- Publication number 20240282667
- Publication date Aug 22, 2024
- Intel Corporation
- Weston BERTRAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTION DAM FOR A POWER MODULE WITH SPACERS
- Publication number 20240282668
- Publication date Aug 22, 2024
- Semiconductor Components Industries, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240274505
- Publication date Aug 15, 2024
- Siliconware Precision Industries Co., Ltd.
- Shuai-Lin LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240258193
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND ELECTRIC POWER STEERING DEVICE
- Publication number 20240243030
- Publication date Jul 18, 2024
- Mitsubishi Electric Corporation
- Katsuhiko OMAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS
- Publication number 20240234246
- Publication date Jul 11, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240234287
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Geunwoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIEZOELECTRIC MEMS-BASED ACTIVE COOLING FOR HEAT DISSIPATION IN COM...
- Publication number 20240234247
- Publication date Jul 11, 2024
- Frore Systems Inc.
- Suryaprakash Ganti
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
EMBEDDED LIQUID COOLING
- Publication number 20240222222
- Publication date Jul 4, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIXED PHASE THERMAL INTERFACE MATERIAL ASSEMBLY WITH HIGH THERMAL C...
- Publication number 20240222221
- Publication date Jul 4, 2024
- NVIDIA Corporation
- Padam Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS INTEGRATED MULTI-CHIP COOLER MODULE
- Publication number 20240222223
- Publication date Jul 4, 2024
- International Business Machines Corporation
- Timothy J. Chainer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING SAME
- Publication number 20240194563
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- Hyunggyun Noh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PHOTONIC DEVICE AND ELECTRONIC DEVICE ARCHITECTURES
- Publication number 20240194657
- Publication date Jun 13, 2024
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED POWER MODULES WITH FLUIDIC-CHANNEL COOLED SUBSTRATES
- Publication number 20240186218
- Publication date Jun 6, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Oseob JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240170367
- Publication date May 23, 2024
- DENSO CORPORATION
- Yoichi SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS OF MANUFACTURING
- Publication number 20240145340
- Publication date May 2, 2024
- INFINEON TECHNOLOGIES AG
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240136273
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Geunwoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIEZOELECTRIC MEMS-BASED ACTIVE COOLING FOR HEAT DISSIPATION IN COM...
- Publication number 20240136252
- Publication date Apr 25, 2024
- Frore Systems Inc.
- Suryaprakash Ganti
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
Microfluidic Channels for Cooling Hybrid Bonded Interfaces
- Publication number 20240128156
- Publication date Apr 18, 2024
- Avago Technologies International Sales Pte. Limited
- Sam Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR DEVICE AND METHOD F...
- Publication number 20240120255
- Publication date Apr 11, 2024
- Hitachi Energy Switzerland AG
- Dominik TRUESSEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240112994
- Publication date Apr 4, 2024
- Littelfuse Semiconductor (Wuxi) Co., Ltd
- Lucas Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Auxiliary members in containers characterised by their shape

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Interposer directly bonded to bonding pads on a plurality of dies

Package including multiple semiconductor devices

Method of forming a chip package, method of forming a semiconductor...

Method and device for optimization of vapor transport in a thermal...

Thermal management of electronics using co-located microjet nozzles...

Electronic package and fabrication method thereof

MEMS-based active cooling systems

Semiconductor packages

Semiconductor package with releasable isolation layer protection

Thermal interface material layer and use thereof

Semiconductor packages having thermal conductive pattern

Frame member with a porous material between a semiconductor module...

Enhanced base die heat path using through-silicon vias

Compressible foamed thermal interface materials and methods of maki...

Thermal interface structures, electrical systems with thermal inter...

Power module with electrodes and heat sink and manufacturing method...

Semiconductor package structure and method for manufacturing the same

Bellows for immersion cooling

Semiconductor package structure and method for forming the same

Coplanar control for film-type thermal interface

Integrated circuit direct cooling systems having substrates in cont...

Semiconductor package and fabricating method thereof

Semiconductor device

Encapsulation process for double-sided cooled packages

Semiconductor device and method of producing the same

Microelectronics assembly including top and bottom packages in stac...

Power semiconductor device with dual heat dissipation structures

Cooling solution including microchannel arrays and methods of formi...

Semiconductor package

Vented lids for integrated circuit packages

Patents Applicationslast 30 patents

PRESSURE RELIEF VALVE AND ADSORBENT CHAMBER FOR TWO-PHASE IMMERSION...

BELLOWS FOR IMMERSION COOLING

SEMICONDUCTOR PACKAGE

MEMS-BASED ACTIVE COOLING SYSTEMS

CHIP PACKAGE STRUCTURE AND FABRICATION

SEMICONDUCTOR PACKAGES HAVING THERMAL CONDUCTIVE PATTERN

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

EMBEDDED COOLING SYSTEMS FOR DEVICE PACKAGES AND METHODS OF COOLING...

SEMICONDUCTOR DEVICE

ENHANCED BASE DIE HEAT PATH USING THROUGH-SILICON VIAS

PROTECTION DAM FOR A POWER MODULE WITH SPACERS

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

METHOD FOR FORMING SEMICONDUCTOR PACKAGE STRUCTURE

ELECTRONIC DEVICE AND ELECTRIC POWER STEERING DEVICE

INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

PIEZOELECTRIC MEMS-BASED ACTIVE COOLING FOR HEAT DISSIPATION IN COM...

EMBEDDED LIQUID COOLING

MIXED PHASE THERMAL INTERFACE MATERIAL ASSEMBLY WITH HIGH THERMAL C...

HETEROGENEOUS INTEGRATED MULTI-CHIP COOLER MODULE

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING SAME

INTEGRATED PHOTONIC DEVICE AND ELECTRONIC DEVICE ARCHITECTURES

MOLDED POWER MODULES WITH FLUIDIC-CHANNEL COOLED SUBSTRATES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND RELATED METHODS OF MANUFACTURING

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

PIEZOELECTRIC MEMS-BASED ACTIVE COOLING FOR HEAT DISSIPATION IN COM...

Microfluidic Channels for Cooling Hybrid Bonded Interfaces

POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR DEVICE AND METHOD F...

SEMICONDUCTOR PACKAGE