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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/433Auxiliary members in containers characterised by their shape

Industries

Patents Grantslast 30 patents

Information Patent Grant
Coplanar control for film-type thermal interface
- Patent number 11,973,005
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit direct cooling systems having substrates in cont...
- Patent number 11,967,540
- Issue date Apr 23, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabricating method thereof
- Patent number 11,961,797
- Issue date Apr 16, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Keun Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number RE49912
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Akihiro Kimura
Information Patent Grant
Encapsulation process for double-sided cooled packages
- Patent number 11,955,347
- Issue date Apr 9, 2024
- ASMPT SINGAPORE PTE. LTD.
- Teng Hock Kuah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of producing the same
- Patent number 11,929,303
- Issue date Mar 12, 2024
- Dexerials Corporation
- Yusuke Kubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics assembly including top and bottom packages in stac...
- Patent number 11,915,996
- Issue date Feb 27, 2024
- Intel Corporation
- Robert Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device with dual heat dissipation structures
- Patent number 11,908,771
- Issue date Feb 20, 2024
- Infineon Technologies AG
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling solution including microchannel arrays and methods of formi...
- Patent number 11,901,262
- Issue date Feb 13, 2024
- Intel Corporation
- Nicholas Neal
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor package
- Patent number 11,901,269
- Issue date Feb 13, 2024
- Samsung Electronics Co., Ltd.
- Seongchan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vented lids for integrated circuit packages
- Patent number 11,894,282
- Issue date Feb 6, 2024
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure relief valve and adsorbent chamber for two-phase immersion...
- Patent number 11,894,288
- Issue date Feb 6, 2024
- MTS IP Holdings Ltd
- Nihal Joshua
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor storage device
- Patent number 11,887,911
- Issue date Jan 30, 2024
- Kioxia Corporation
- Daigo Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal transfer structures for semiconductor die assemblies
- Patent number 11,862,611
- Issue date Jan 2, 2024
- Micron Technology, Inc.
- Ed A. Schrock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor package
- Patent number 11,862,528
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced base die heat path using through-silicon vias
- Patent number 11,854,935
- Issue date Dec 26, 2023
- Intel Corporation
- Weston Bertrand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,854,936
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal peak suppression device
- Patent number 11,848,250
- Issue date Dec 19, 2023
- Global Unichip Corporation
- Chih-Chieh Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,848,251
- Issue date Dec 19, 2023
- AISIN CORPORATION
- Takanobu Naruse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mobile phone and other compute device cooling architecture
- Patent number 11,830,789
- Issue date Nov 28, 2023
- Frore Systems Inc.
- Suryaprakash Ganti
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Grant
Embedded substrate heat sink for bottom side cooling
- Patent number 11,830,783
- Issue date Nov 28, 2023
- Intel Corporation
- Aastha Uppal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module for improved heat dissipation and power...
- Patent number 11,823,996
- Issue date Nov 21, 2023
- Huawei Technologies Co., Ltd.
- Hamit Duran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus including integrated pads and methods of manufacturing th...
- Patent number 11,824,025
- Issue date Nov 21, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and data transferring method for semiconductor...
- Patent number 11,824,009
- Issue date Nov 21, 2023
- PREFERRED NETWORKS, INC.
- Nobuyoshi Tanaka
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device
- Patent number 11,817,422
- Issue date Nov 14, 2023
- Shinko Electric Industries Co., Ltd.
- Yohei Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power module package structures
- Patent number 11,810,775
- Issue date Nov 7, 2023
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct liquid micro jet (DLMJ) structures for addressing thermal pe...
- Patent number 11,804,418
- Issue date Oct 31, 2023
- Intel Corporation
- Nicholas Neal
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Memory auxiliary heat transfer structure
- Patent number 11,805,621
- Issue date Oct 31, 2023
- Asia Vital Components (China) Co., Ltd.
- Sung-Wei Lee
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Integrated heat spreader (IHS) with heating element
- Patent number 11,798,861
- Issue date Oct 24, 2023
- Intel Corporation
- Peng Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with metal post having non-vertical structure
- Patent number 11,798,864
- Issue date Oct 24, 2023
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS OF MANUFACTURING
- Publication number 20240145340
- Publication date May 2, 2024
- INFINEON TECHNOLOGIES AG
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240136273
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Geunwoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIEZOELECTRIC MEMS-BASED ACTIVE COOLING FOR HEAT DISSIPATION IN COM...
- Publication number 20240136252
- Publication date Apr 25, 2024
- Frore Systems Inc.
- Suryaprakash Ganti
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
Microfluidic Channels for Cooling Hybrid Bonded Interfaces
- Publication number 20240128156
- Publication date Apr 18, 2024
- Avago Technologies International Sales Pte. Limited
- Sam Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR DEVICE AND METHOD F...
- Publication number 20240120255
- Publication date Apr 11, 2024
- Hitachi Energy Switzerland AG
- Dominik TRUESSEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240112994
- Publication date Apr 4, 2024
- Littelfuse Semiconductor (Wuxi) Co., Ltd
- Lucas Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Water Cooling System for Semiconductor Package
- Publication number 20240105550
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPRESSIBLE FOAMED THERMAL INTERFACE MATERIALS AND METHODS OF MAKI...
- Publication number 20240105663
- Publication date Mar 28, 2024
- Laird Technologies, Inc.
- Vijayaraghavan RAJAGOPAL
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240096731
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hua WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240096743
- Publication date Mar 21, 2024
- Mitsubishi Electric Corporation
- Hiroyuki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND INVERTER UNIT
- Publication number 20240096744
- Publication date Mar 21, 2024
- Mitsubishi Electric Corporation
- Nobuyoshi KIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240087986
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH POWER MODULE PACKAGE STRUCTURES
- Publication number 20240071860
- Publication date Feb 29, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240071866
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- CHEOL KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS INCLUDING INTEGRATED PADS AND METHODS OF MANUFACTURING TH...
- Publication number 20240063156
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH REINFORCING STRUCTURE
- Publication number 20240063077
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Jongbeom PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20240055393
- Publication date Feb 15, 2024
- Invensas LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CHIP PACKAGE AND POWER MODULE
- Publication number 20240047302
- Publication date Feb 8, 2024
- Ganstronic INC.
- Cheng-Chuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND DATA TRANSFERRING METHOD FOR SEMICONDUCTOR...
- Publication number 20240047366
- Publication date Feb 8, 2024
- Preferred Networks, Inc.
- Nobuyoshi TANAKA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IC PACKAGE WITH VERY THIN VAPOR CHAMBER FOR HEAT DISSIPATION
- Publication number 20240030097
- Publication date Jan 25, 2024
- WEI-LIN CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240030099
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Heat Dissipation Using Graphene
- Publication number 20240014093
- Publication date Jan 11, 2024
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPLANAR CONTROL FOR FILM-TYPE THERMAL INTERFACE
- Publication number 20240014100
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hermetic Package Cooling Using Silver Tubes with Getter Absorption...
- Publication number 20240006267
- Publication date Jan 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Li Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240006393
- Publication date Jan 4, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Young Do KWEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20240006268
- Publication date Jan 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Chiang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Releasable Isolation Layer Protection
- Publication number 20230395462
- Publication date Dec 7, 2023
- Infineon Technologies Austria AG
- Li Fong Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING UNIT FOR DIRECT COOLING OF SEMICONDUCTOR DEVICE AND MANUF...
- Publication number 20230361000
- Publication date Nov 9, 2023
- CHUNG-ANG UNIVERSITY INDUSTRY ACADEMIC COOPERAITON FOUNDATION
- Hyoung Soon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONIC DEVICES AND METHODS OF PACKAGING POWER ELECTRONIC...
- Publication number 20230360998
- Publication date Nov 9, 2023
- Raytheon Technologies Corporation
- Hailing Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED POWER MODULES
- Publication number 20230361011
- Publication date Nov 9, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS

Auxiliary members in containers characterised by their shape

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Coplanar control for film-type thermal interface

Integrated circuit direct cooling systems having substrates in cont...

Semiconductor package and fabricating method thereof

Semiconductor device

Encapsulation process for double-sided cooled packages

Semiconductor device and method of producing the same

Microelectronics assembly including top and bottom packages in stac...

Power semiconductor device with dual heat dissipation structures

Cooling solution including microchannel arrays and methods of formi...

Semiconductor package

Vented lids for integrated circuit packages

Pressure relief valve and adsorbent chamber for two-phase immersion...

Semiconductor storage device

Thermal transfer structures for semiconductor die assemblies

Method for forming semiconductor package

Enhanced base die heat path using through-silicon vias

Semiconductor device

Thermal peak suppression device

Semiconductor device

Mobile phone and other compute device cooling architecture

Embedded substrate heat sink for bottom side cooling

Power semiconductor module for improved heat dissipation and power...

Apparatus including integrated pads and methods of manufacturing th...

Semiconductor device and data transferring method for semiconductor...

Semiconductor device

High power module package structures

Direct liquid micro jet (DLMJ) structures for addressing thermal pe...

Memory auxiliary heat transfer structure

Integrated heat spreader (IHS) with heating element

Semiconductor package with metal post having non-vertical structure

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND RELATED METHODS OF MANUFACTURING

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

PIEZOELECTRIC MEMS-BASED ACTIVE COOLING FOR HEAT DISSIPATION IN COM...

Microfluidic Channels for Cooling Hybrid Bonded Interfaces

POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR DEVICE AND METHOD F...

SEMICONDUCTOR PACKAGE

Water Cooling System for Semiconductor Package

COMPRESSIBLE FOAMED THERMAL INTERFACE MATERIALS AND METHODS OF MAKI...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND INVERTER UNIT

SEMICONDUCTOR DEVICE

HIGH POWER MODULE PACKAGE STRUCTURES

SEMICONDUCTOR PACKAGE

APPARATUS INCLUDING INTEGRATED PADS AND METHODS OF MANUFACTURING TH...

SEMICONDUCTOR PACKAGE WITH REINFORCING STRUCTURE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

POWER CHIP PACKAGE AND POWER MODULE

SEMICONDUCTOR DEVICE AND DATA TRANSFERRING METHOD FOR SEMICONDUCTOR...

IC PACKAGE WITH VERY THIN VAPOR CHAMBER FOR HEAT DISSIPATION

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Semiconductor Device and Method of Heat Dissipation Using Graphene

COPLANAR CONTROL FOR FILM-TYPE THERMAL INTERFACE

Hermetic Package Cooling Using Silver Tubes with Getter Absorption...

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

Semiconductor Package with Releasable Isolation Layer Protection

PACKAGING UNIT FOR DIRECT COOLING OF SEMICONDUCTOR DEVICE AND MANUF...

POWER ELECTRONIC DEVICES AND METHODS OF PACKAGING POWER ELECTRONIC...

MOLDED POWER MODULES