Auxiliary members in encapsulations

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H01L23/4334

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/4334Auxiliary members in encapsulations

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Interposer directly bonded to bonding pads on a plurality of dies
- Patent number 12,165,952
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package including multiple semiconductor devices
- Patent number 12,142,551
- Issue date Nov 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a chip package, method of forming a semiconductor...
- Patent number 12,136,583
- Issue date Nov 5, 2024
- Infineon Technologies AG
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with releasable isolation layer protection
- Patent number 12,080,625
- Issue date Sep 3, 2024
- Infineon Technologies Austria AG
- Li Fong Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having thermal conductive pattern
- Patent number 12,068,224
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Frame member with a porous material between a semiconductor module...
- Patent number 12,068,217
- Issue date Aug 20, 2024
- Mitsubishi Electric Corporation
- Takashi Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compressible foamed thermal interface materials and methods of maki...
- Patent number 12,033,971
- Issue date Jul 9, 2024
- Laird Technologies, Inc.
- Vijayaraghavan Rajagopal
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Power module with electrodes and heat sink and manufacturing method...
- Patent number 12,014,974
- Issue date Jun 18, 2024
- Mitsubishi Electric Corporation
- Masakazu Tani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit direct cooling systems having substrates in cont...
- Patent number 11,967,540
- Issue date Apr 23, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number RE49912
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Akihiro Kimura
Information Patent Grant
Encapsulation process for double-sided cooled packages
- Patent number 11,955,347
- Issue date Apr 9, 2024
- ASMPT SINGAPORE PTE. LTD.
- Teng Hock Kuah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of producing the same
- Patent number 11,929,303
- Issue date Mar 12, 2024
- Dexerials Corporation
- Yusuke Kubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device with dual heat dissipation structures
- Patent number 11,908,771
- Issue date Feb 20, 2024
- Infineon Technologies AG
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,901,269
- Issue date Feb 13, 2024
- Samsung Electronics Co., Ltd.
- Seongchan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal transfer structures for semiconductor die assemblies
- Patent number 11,862,611
- Issue date Jan 2, 2024
- Micron Technology, Inc.
- Ed A. Schrock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,848,251
- Issue date Dec 19, 2023
- AISIN CORPORATION
- Takanobu Naruse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module for improved heat dissipation and power...
- Patent number 11,823,996
- Issue date Nov 21, 2023
- Huawei Technologies Co., Ltd.
- Hamit Duran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus including integrated pads and methods of manufacturing th...
- Patent number 11,824,025
- Issue date Nov 21, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,817,422
- Issue date Nov 14, 2023
- Shinko Electric Industries Co., Ltd.
- Yohei Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power module package structures
- Patent number 11,810,775
- Issue date Nov 7, 2023
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with releasable isolation layer protection
- Patent number 11,791,238
- Issue date Oct 17, 2023
- Infineon Technologies Austria AG
- Li Fong Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compressible foamed thermal interface materials and methods of maki...
- Patent number 11,776,928
- Issue date Oct 3, 2023
- Laird Technologies, Inc.
- Vijayaraghavan Rajagopal
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Chip package
- Patent number 11,776,867
- Issue date Oct 3, 2023
- Industrial Technology Research Institute
- Kuo-Shu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics system with a switching device and a liquid cooli...
- Patent number 11,776,878
- Issue date Oct 3, 2023
- Semikron Elektronik GmbH & Co. KG
- Marco Lederer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High thermal conductivity, high modulus structure within a mold mat...
- Patent number 11,749,585
- Issue date Sep 5, 2023
- Intel Corporation
- Yiqun Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing chip packaging structure with dissipation l...
- Patent number 11,735,503
- Issue date Aug 22, 2023
- HEFEI SMAT TECHNOLOGY CO., LTD.
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 11,735,563
- Issue date Aug 22, 2023
- Invensas LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including lid structure with opening and recess
- Patent number 11,688,655
- Issue date Jun 27, 2023
- Mediatek Inc.
- Chia-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with through-mold cooling channel for...
- Patent number 11,688,664
- Issue date Jun 27, 2023
- Micron Technology, Inc.
- Bradley R. Bitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded power module with integrated exciter circuit
- Patent number 11,659,698
- Issue date May 23, 2023
- Audi AG
- Daniel Ruppert
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE STRUCTURE AND FABRICATION
- Publication number 20240371716
- Publication date Nov 7, 2024
- Yangtze Memory Technologies Co., Ltd.
- Li TAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING THERMAL CONDUCTIVE PATTERN
- Publication number 20240363488
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312868
- Publication date Sep 19, 2024
- Shinko Electric Industries Co., Ltd.
- Yukinori Hatori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTION DAM FOR A POWER MODULE WITH SPACERS
- Publication number 20240282668
- Publication date Aug 22, 2024
- Semiconductor Components Industries, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240274505
- Publication date Aug 15, 2024
- Siliconware Precision Industries Co., Ltd.
- Shuai-Lin LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS
- Publication number 20240234246
- Publication date Jul 11, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240234287
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Geunwoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING SAME
- Publication number 20240194563
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- Hyunggyun Noh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PHOTONIC DEVICE AND ELECTRONIC DEVICE ARCHITECTURES
- Publication number 20240194657
- Publication date Jun 13, 2024
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240170367
- Publication date May 23, 2024
- DENSO CORPORATION
- Yoichi SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS OF MANUFACTURING
- Publication number 20240145340
- Publication date May 2, 2024
- INFINEON TECHNOLOGIES AG
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240136273
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Geunwoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240112994
- Publication date Apr 4, 2024
- Littelfuse Semiconductor (Wuxi) Co., Ltd
- Lucas Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPRESSIBLE FOAMED THERMAL INTERFACE MATERIALS AND METHODS OF MAKI...
- Publication number 20240105663
- Publication date Mar 28, 2024
- Laird Technologies, Inc.
- Vijayaraghavan RAJAGOPAL
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240096743
- Publication date Mar 21, 2024
- Mitsubishi Electric Corporation
- Hiroyuki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND INVERTER UNIT
- Publication number 20240096744
- Publication date Mar 21, 2024
- Mitsubishi Electric Corporation
- Nobuyoshi KIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH POWER MODULE PACKAGE STRUCTURES
- Publication number 20240071860
- Publication date Feb 29, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240071866
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- CHEOL KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS INCLUDING INTEGRATED PADS AND METHODS OF MANUFACTURING TH...
- Publication number 20240063156
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20240055393
- Publication date Feb 15, 2024
- Invensas LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CHIP PACKAGE AND POWER MODULE
- Publication number 20240047302
- Publication date Feb 8, 2024
- Ganstronic INC.
- Cheng-Chuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PACKAGE WITH VERY THIN VAPOR CHAMBER FOR HEAT DISSIPATION
- Publication number 20240030097
- Publication date Jan 25, 2024
- WEI-LIN CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240030099
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Heat Dissipation Using Graphene
- Publication number 20240014093
- Publication date Jan 11, 2024
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Releasable Isolation Layer Protection
- Publication number 20230395462
- Publication date Dec 7, 2023
- Infineon Technologies Austria AG
- Li Fong Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONIC DEVICES AND METHODS OF PACKAGING POWER ELECTRONIC...
- Publication number 20230360998
- Publication date Nov 9, 2023
- Raytheon Technologies Corporation
- Hailing Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED POWER MODULES
- Publication number 20230361011
- Publication date Nov 9, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGING STRUCTURE
- Publication number 20230352368
- Publication date Nov 2, 2023
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20230352367
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE MODULE INCLUDING VERTICAL TERMINALS
- Publication number 20230326830
- Publication date Oct 12, 2023
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS

Auxiliary members in encapsulations

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Interposer directly bonded to bonding pads on a plurality of dies

Package including multiple semiconductor devices

Method of forming a chip package, method of forming a semiconductor...

Semiconductor package with releasable isolation layer protection

Semiconductor packages having thermal conductive pattern

Frame member with a porous material between a semiconductor module...

Compressible foamed thermal interface materials and methods of maki...

Power module with electrodes and heat sink and manufacturing method...

Integrated circuit direct cooling systems having substrates in cont...

Semiconductor device

Encapsulation process for double-sided cooled packages

Semiconductor device and method of producing the same

Power semiconductor device with dual heat dissipation structures

Semiconductor package

Thermal transfer structures for semiconductor die assemblies

Semiconductor device

Power semiconductor module for improved heat dissipation and power...

Apparatus including integrated pads and methods of manufacturing th...

Semiconductor device

High power module package structures

Semiconductor package with releasable isolation layer protection

Compressible foamed thermal interface materials and methods of maki...

Chip package

Power electronics system with a switching device and a liquid cooli...

High thermal conductivity, high modulus structure within a mold mat...

Method of manufacturing chip packaging structure with dissipation l...

Package-on-package assembly with wire bond vias

Semiconductor package including lid structure with opening and recess

Semiconductor device assembly with through-mold cooling channel for...

Molded power module with integrated exciter circuit

Patents Applicationslast 30 patents

CHIP PACKAGE STRUCTURE AND FABRICATION

SEMICONDUCTOR PACKAGES HAVING THERMAL CONDUCTIVE PATTERN

SEMICONDUCTOR DEVICE

PROTECTION DAM FOR A POWER MODULE WITH SPACERS

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING SAME

INTEGRATED PHOTONIC DEVICE AND ELECTRONIC DEVICE ARCHITECTURES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND RELATED METHODS OF MANUFACTURING

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE

COMPRESSIBLE FOAMED THERMAL INTERFACE MATERIALS AND METHODS OF MAKI...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND INVERTER UNIT

HIGH POWER MODULE PACKAGE STRUCTURES

SEMICONDUCTOR PACKAGE

APPARATUS INCLUDING INTEGRATED PADS AND METHODS OF MANUFACTURING TH...

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

POWER CHIP PACKAGE AND POWER MODULE

IC PACKAGE WITH VERY THIN VAPOR CHAMBER FOR HEAT DISSIPATION

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Semiconductor Device and Method of Heat Dissipation Using Graphene

Semiconductor Package with Releasable Isolation Layer Protection

POWER ELECTRONIC DEVICES AND METHODS OF PACKAGING POWER ELECTRONIC...

MOLDED POWER MODULES

POWER MODULE PACKAGING STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD

SEMICONDUCTOR PACKAGE MODULE INCLUDING VERTICAL TERMINALS