Auxiliary support including alignment aids

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H01L2221/68309

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00

Current Industry

H01L2221/68309Auxiliary support including alignment aids

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Heterogeneous integration of components onto compact devices using...
- Patent number 12,308,275
- Issue date May 20, 2025
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wet alignment method for micro-semiconductor chip and display trans...
- Patent number 12,230,528
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Kyungwook Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photolithography alignment process for bonded wafers
- Patent number 12,230,585
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yeong-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing display device and display device
- Patent number 12,198,970
- Issue date Jan 14, 2025
- Japan Display Inc.
- Kazuyuki Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for bonding a plurality of dies to a carrier p...
- Patent number 12,183,620
- Issue date Dec 31, 2024
- PYXIS CF PTE. LTD.
- Hwee Seng Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for separating dies from a semiconductor substrate
- Patent number 12,170,226
- Issue date Dec 17, 2024
- Infineon Technologies AG
- Franz-Josef Pichler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wet alignment method for micro-semiconductor chip and display trans...
- Patent number 12,080,585
- Issue date Sep 3, 2024
- Samsung Electronics Co., Ltd.
- Kyungwook Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microdevice transfer setup and integration of micro-devices into sy...
- Patent number 12,062,638
- Issue date Aug 13, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous integration of components onto compact devices using...
- Patent number 12,009,247
- Issue date Jun 11, 2024
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 11,949,044
- Issue date Apr 2, 2024
- Samsung Display Co., Ltd.
- Buem Joon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photolithography alignment process for bonded wafers
- Patent number 11,916,022
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yeong-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device arrangement in donor substrate
- Patent number 11,854,783
- Issue date Dec 26, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ wafer rotation for carousel processing chambers
- Patent number 11,798,825
- Issue date Oct 24, 2023
- Applied Materials, Inc.
- Joseph Yudovsky
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and structures for die-to-die bonding
- Patent number 11,798,914
- Issue date Oct 24, 2023
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate treatment apparatus
- Patent number 11,766,765
- Issue date Sep 26, 2023
- Semes Co., Ltd.
- Ki Sang Eum
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Wet alignment method for micro-semiconductor chip and display trans...
- Patent number 11,764,095
- Issue date Sep 19, 2023
- Samsung Electronics Co., Ltd.
- Kyungwook Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-temperature superconducting striated tape combinations
- Patent number 11,711,983
- Issue date Jul 25, 2023
- The Government of the United States of America, as represented by the Secreta...
- Joseph C. Prestigiacomo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of aligning micro light emitting element and display transfe...
- Patent number 11,676,848
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Hyunjoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of high-temperature superconducting striated tape combi...
- Patent number 11,600,762
- Issue date Mar 7, 2023
- The Government of the United States of America, as represented by the Secreta...
- Joseph C. Prestigiacomo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer carrier and method
- Patent number 11,535,952
- Issue date Dec 27, 2022
- Infineon Technologies Americas Corp.
- Mihir Tungare
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous integration of components onto compact devices using...
- Patent number 11,469,131
- Issue date Oct 11, 2022
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of aligning micro light emitting element and display transfe...
- Patent number 11,469,132
- Issue date Oct 11, 2022
- Samsung Electronics Co. Ltd.
- Hyunjoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photolithography alignment process for bonded wafers
- Patent number 11,362,038
- Issue date Jun 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yeong-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-axis movement for transfer of semiconductor devices
- Patent number 11,217,471
- Issue date Jan 4, 2022
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device arrangement in donor substrate
- Patent number 11,195,741
- Issue date Dec 7, 2021
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier structure and micro device structure
- Patent number 11,177,154
- Issue date Nov 16, 2021
- PixeLED Display co., LTD.
- Pei-Hsin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a chip package module with improve heat dissi...
- Patent number 11,145,565
- Issue date Oct 12, 2021
- Youngtek Electronics Corporation
- Hsi-Ying Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum chuck for clamping workpieces, measuring devices and method...
- Patent number 11,062,934
- Issue date Jul 13, 2021
- Helmut Fischer GmbH Institut für Elektronik und Messtechnik
- Werner Volz
- G01 - MEASURING TESTING
Information Patent Grant
Microdevice transfer setup and integration of micro-devices into sy...
- Patent number 10,916,523
- Issue date Feb 9, 2021
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack structure and method of fabricating the same
- Patent number 10,879,214
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OFFSET ALIGNMENT AND REPAIR IN MICRO DEVICE TRANSFER
- Publication number 20250167033
- Publication date May 22, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER SUBSTRATE AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE...
- Publication number 20250167031
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Hosin SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...
- Publication number 20250167171
- Publication date May 22, 2025
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...
- Publication number 20250167172
- Publication date May 22, 2025
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET ALIGNMENT AND REPAIR IN MICRO DEVICE TRANSFER
- Publication number 20250167032
- Publication date May 22, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOLITHOGRAPHY ALIGNMENT PROCESS FOR BONDED WAFERS
- Publication number 20250157943
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yeong-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC MICRODEVICE
- Publication number 20250160088
- Publication date May 15, 2025
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING APPARATUS AND DIE BONDING METHOD USING THE SAME
- Publication number 20250140588
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Ilyoung HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Detecting Semiconductor Wafer Ce...
- Publication number 20250112078
- Publication date Apr 3, 2025
- STATS ChipPAC Pte Ltd.
- Tack Chee Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER TAPE
- Publication number 20250087520
- Publication date Mar 13, 2025
- RENESAS ELECTRONICS CORPORATION
- Kouji NAKAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-ELEMENT, ALIGNMENT SYSTEM AND ASSEMBLING METHOD
- Publication number 20240404864
- Publication date Dec 5, 2024
- TOHOKU-MICROTEC CO., LTD.
- Makoto MOTOYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...
- Publication number 20240363585
- Publication date Oct 31, 2024
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SEPARATING DIES FROM A SEMICONDUCTOR SUBSTRATE
- Publication number 20240339361
- Publication date Oct 10, 2024
- INFINEON TECHNOLOGIES AG
- Franz-Josef Pichler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS INTEGRATION OF COMPONENTS ONTO COMPACT DEVICES USING...
- Publication number 20240332056
- Publication date Oct 3, 2024
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240304513
- Publication date Sep 12, 2024
- Samsung Electronics Co., Ltd.
- Anthony Dongick LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD OF WORKPIECE
- Publication number 20240266221
- Publication date Aug 8, 2024
- Disco Corporation
- Jinyan ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240243228
- Publication date Jul 18, 2024
- SAMSUNG DISPLAY CO., LTD.
- Buem Joon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC FILLED ALIGNMENT MARK STRUCTURES
- Publication number 20240203780
- Publication date Jun 20, 2024
- International Business Machines Corporation
- Somnath Ghosh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOLITHOGRAPHY ALIGNMENT PROCESS FOR BONDED WAFERS
- Publication number 20240186258
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yeong-Jyh Lin
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
DEVICE AND METHOD FOR ALIGNING LIGHT-EMITTING DIODES
- Publication number 20240178036
- Publication date May 30, 2024
- Century Technology (Shenzhen) Corporation Limited
- Hsin-Chieh Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESOURCE MANAGEMENT WITH TIME AND EXPENSE TRACKING
- Publication number 20240128115
- Publication date Apr 18, 2024
- VueReal Inc.
- Heidi Elizabeth Bailey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET ALIGNMENT AND REPAIR IN MICRO DEVICE TRANSFER
- Publication number 20240120231
- Publication date Apr 11, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR PROCESSING OF SINGULATED DIES AND METHODS FOR USING T...
- Publication number 20240096683
- Publication date Mar 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE WITH CHIPS, AND SUBSTRATE PROCES...
- Publication number 20240079403
- Publication date Mar 7, 2024
- TOKYO ELECTRON LIMITED
- Yoshihisa MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Carriers and Methods of Making and Using
- Publication number 20240055292
- Publication date Feb 15, 2024
- UTAC Headquarters Pte. Ltd.
- Roel Adeva Robles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASS TRANSFER OF SEMICONDUCTOR DIE USING TRANSFER ELEMENTS
- Publication number 20230402310
- Publication date Dec 14, 2023
- CreeLED, Inc.
- Colin Blakely
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-PRODUCT, METHOD AND ELECTRONIC DEVICE
- Publication number 20230352377
- Publication date Nov 2, 2023
- Hitachi Energy Switzerland AG
- Dominik TRUESSEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR DIE TILING
- Publication number 20230343774
- Publication date Oct 26, 2023
- Intel Corporation
- Srinivas PIETAMBARAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET ALIGNMENT METHOD FOR MICRO-SEMICONDUCTOR CHIP AND DISPLAY TRANS...
- Publication number 20230274970
- Publication date Aug 31, 2023
- Samsung Electronics Co., Ltd.
- Kyungwook HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET ALIGNMENT METHOD FOR MICRO-SEMICONDUCTOR CHIP AND DISPLAY TRANS...
- Publication number 20230274969
- Publication date Aug 31, 2023
- Samsung Electronics Co., Ltd.
- Kyungwook HWANG
- H01 - BASIC ELECTRIC ELEMENTS

Auxiliary support including alignment aids

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Heterogeneous integration of components onto compact devices using...

Wet alignment method for micro-semiconductor chip and display trans...

Photolithography alignment process for bonded wafers

Method of manufacturing display device and display device

Apparatus and method for bonding a plurality of dies to a carrier p...

Method for separating dies from a semiconductor substrate

Wet alignment method for micro-semiconductor chip and display trans...

Microdevice transfer setup and integration of micro-devices into sy...

Heterogeneous integration of components onto compact devices using...

Display device and method of manufacturing the same

Photolithography alignment process for bonded wafers

Micro device arrangement in donor substrate

In-situ wafer rotation for carousel processing chambers

Methods and structures for die-to-die bonding

Substrate treatment apparatus

Wet alignment method for micro-semiconductor chip and display trans...

High-temperature superconducting striated tape combinations

Method of aligning micro light emitting element and display transfe...

Fabrication of high-temperature superconducting striated tape combi...

Wafer carrier and method

Heterogeneous integration of components onto compact devices using...

Method of aligning micro light emitting element and display transfe...

Photolithography alignment process for bonded wafers

Multi-axis movement for transfer of semiconductor devices

Micro device arrangement in donor substrate

Carrier structure and micro device structure

Method of fabricating a chip package module with improve heat dissi...

Vacuum chuck for clamping workpieces, measuring devices and method...

Microdevice transfer setup and integration of micro-devices into sy...

Die stack structure and method of fabricating the same

Patents Applicationslast 30 patents

OFFSET ALIGNMENT AND REPAIR IN MICRO DEVICE TRANSFER

CARRIER SUBSTRATE AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE...

MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...

MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...

OFFSET ALIGNMENT AND REPAIR IN MICRO DEVICE TRANSFER

PHOTOLITHOGRAPHY ALIGNMENT PROCESS FOR BONDED WAFERS

OPTOELECTRONIC MICRODEVICE

DIE BONDING APPARATUS AND DIE BONDING METHOD USING THE SAME

Semiconductor Device and Method of Detecting Semiconductor Wafer Ce...

CARRIER TAPE

MICRO-ELEMENT, ALIGNMENT SYSTEM AND ASSEMBLING METHOD

MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...

METHOD FOR SEPARATING DIES FROM A SEMICONDUCTOR SUBSTRATE

HETEROGENEOUS INTEGRATION OF COMPONENTS ONTO COMPACT DEVICES USING...

SEMICONDUCTOR DEVICE

PROCESSING METHOD OF WORKPIECE

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

DIELECTRIC FILLED ALIGNMENT MARK STRUCTURES

PHOTOLITHOGRAPHY ALIGNMENT PROCESS FOR BONDED WAFERS

DEVICE AND METHOD FOR ALIGNING LIGHT-EMITTING DIODES

RESOURCE MANAGEMENT WITH TIME AND EXPENSE TRACKING

OFFSET ALIGNMENT AND REPAIR IN MICRO DEVICE TRANSFER

APPARATUS FOR PROCESSING OF SINGULATED DIES AND METHODS FOR USING T...

METHOD FOR MANUFACTURING SUBSTRATE WITH CHIPS, AND SUBSTRATE PROCES...

Semiconductor Device Carriers and Methods of Making and Using

MASS TRANSFER OF SEMICONDUCTOR DIE USING TRANSFER ELEMENTS

PRE-PRODUCT, METHOD AND ELECTRONIC DEVICE

TECHNIQUES FOR DIE TILING

WET ALIGNMENT METHOD FOR MICRO-SEMICONDUCTOR CHIP AND DISPLAY TRANS...

WET ALIGNMENT METHOD FOR MICRO-SEMICONDUCTOR CHIP AND DISPLAY TRANS...