Auxiliary support including alignment aids

Industry

CPC
H01L2221/68309

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00

Current Industry

H01L2221/68309Auxiliary support including alignment aids

Industries

Patents Grantslast 30 patents

Information Patent Grant
Display device and method of manufacturing the same
- Patent number 11,949,044
- Issue date Apr 2, 2024
- Samsung Display Co., Ltd.
- Buem Joon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photolithography alignment process for bonded wafers
- Patent number 11,916,022
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yeong-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device arrangement in donor substrate
- Patent number 11,854,783
- Issue date Dec 26, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ wafer rotation for carousel processing chambers
- Patent number 11,798,825
- Issue date Oct 24, 2023
- Applied Materials, Inc.
- Joseph Yudovsky
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and structures for die-to-die bonding
- Patent number 11,798,914
- Issue date Oct 24, 2023
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate treatment apparatus
- Patent number 11,766,765
- Issue date Sep 26, 2023
- Semes Co., Ltd.
- Ki Sang Eum
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Wet alignment method for micro-semiconductor chip and display trans...
- Patent number 11,764,095
- Issue date Sep 19, 2023
- Samsung Electronics Co., Ltd.
- Kyungwook Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-temperature superconducting striated tape combinations
- Patent number 11,711,983
- Issue date Jul 25, 2023
- The Government of the United States of America, as represented by the Secreta...
- Joseph C. Prestigiacomo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of aligning micro light emitting element and display transfe...
- Patent number 11,676,848
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Hyunjoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of high-temperature superconducting striated tape combi...
- Patent number 11,600,762
- Issue date Mar 7, 2023
- The Government of the United States of America, as represented by the Secreta...
- Joseph C. Prestigiacomo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer carrier and method
- Patent number 11,535,952
- Issue date Dec 27, 2022
- Infineon Technologies Americas Corp.
- Mihir Tungare
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous integration of components onto compact devices using...
- Patent number 11,469,131
- Issue date Oct 11, 2022
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of aligning micro light emitting element and display transfe...
- Patent number 11,469,132
- Issue date Oct 11, 2022
- Samsung Electronics Co. Ltd.
- Hyunjoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photolithography alignment process for bonded wafers
- Patent number 11,362,038
- Issue date Jun 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yeong-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-axis movement for transfer of semiconductor devices
- Patent number 11,217,471
- Issue date Jan 4, 2022
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device arrangement in donor substrate
- Patent number 11,195,741
- Issue date Dec 7, 2021
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier structure and micro device structure
- Patent number 11,177,154
- Issue date Nov 16, 2021
- PixeLED Display co., LTD.
- Pei-Hsin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a chip package module with improve heat dissi...
- Patent number 11,145,565
- Issue date Oct 12, 2021
- Youngtek Electronics Corporation
- Hsi-Ying Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum chuck for clamping workpieces, measuring devices and method...
- Patent number 11,062,934
- Issue date Jul 13, 2021
- Helmut Fischer GmbH Institut für Elektronik und Messtechnik
- Werner Volz
- G01 - MEASURING TESTING
Information Patent Grant
Microdevice transfer setup and integration of micro-devices into sy...
- Patent number 10,916,523
- Issue date Feb 9, 2021
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack structure and method of fabricating the same
- Patent number 10,879,214
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer carrier and method
- Patent number 10,829,866
- Issue date Nov 10, 2020
- Infineon Technologies Americas Corp.
- Mihir Tungare
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for precisely aligning backside pattern to frontside pattern...
- Patent number 10,833,021
- Issue date Nov 10, 2020
- Alpha and Omega Semiconductor (Cayman) LTD
- Lei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of separating electronic devices having a back layer and app...
- Patent number 10,796,961
- Issue date Oct 6, 2020
- Semiconductor Components Industries, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum chuck for clamping workpieces, measuring devices and method...
- Patent number 10,707,112
- Issue date Jul 7, 2020
- Helmut Fischer GmbH Institut für Elektronik und Messtechnik
- Werner Volz
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Chip handling and electronic component integration
- Patent number 10,658,182
- Issue date May 19, 2020
- International Business Machines Corporation
- Russell A. Budd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip handling and electronic component integration
- Patent number 10,651,036
- Issue date May 12, 2020
- International Business Machines Corporation
- Russell A. Budd
- B24 - GRINDING POLISHING
Information Patent Grant
Device, system and method for aligning electronic components
- Patent number 10,604,358
- Issue date Mar 31, 2020
- Muehlbauer GmbH & Co. KG
- Franz Brandl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device arrangement in donor substrate
- Patent number 10,535,546
- Issue date Jan 14, 2020
- VueReal Inc.
- Gholamreza Chaji
- G01 - MEASURING TESTING
Information Patent Grant
Method of separating electronic devices having a back layer and app...
- Patent number 10,366,923
- Issue date Jul 30, 2019
- Semiconductor Components Industries, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RESOURCE MANAGEMENT WITH TIME AND EXPENSE TRACKING
- Publication number 20240128115
- Publication date Apr 18, 2024
- VueReal Inc.
- Heidi Elizabeth Bailey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET ALIGNMENT AND REPAIR IN MICRO DEVICE TRANSFER
- Publication number 20240120231
- Publication date Apr 11, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR PROCESSING OF SINGULATED DIES AND METHODS FOR USING T...
- Publication number 20240096683
- Publication date Mar 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE WITH CHIPS, AND SUBSTRATE PROCES...
- Publication number 20240079403
- Publication date Mar 7, 2024
- TOKYO ELECTRON LIMITED
- Yoshihisa MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Carriers and Methods of Making and Using
- Publication number 20240055292
- Publication date Feb 15, 2024
- UTAC Headquarters Pte. Ltd.
- Roel Adeva Robles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASS TRANSFER OF SEMICONDUCTOR DIE USING TRANSFER ELEMENTS
- Publication number 20230402310
- Publication date Dec 14, 2023
- CreeLED, Inc.
- Colin Blakely
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-PRODUCT, METHOD AND ELECTRONIC DEVICE
- Publication number 20230352377
- Publication date Nov 2, 2023
- Hitachi Energy Switzerland AG
- Dominik TRUESSEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR DIE TILING
- Publication number 20230343774
- Publication date Oct 26, 2023
- Intel Corporation
- Srinivas PIETAMBARAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET ALIGNMENT METHOD FOR MICRO-SEMICONDUCTOR CHIP AND DISPLAY TRANS...
- Publication number 20230274970
- Publication date Aug 31, 2023
- Samsung Electronics Co., Ltd.
- Kyungwook HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET ALIGNMENT METHOD FOR MICRO-SEMICONDUCTOR CHIP AND DISPLAY TRANS...
- Publication number 20230274969
- Publication date Aug 31, 2023
- Samsung Electronics Co., Ltd.
- Kyungwook HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASS TRANSFER DEVICE FOR TRANSFERRING MICRO-LEDS ONTO ARRAY SUBSTRA...
- Publication number 20230207373
- Publication date Jun 29, 2023
- Century Technology (Shenzhen) Corporation Limited
- CHEN-FU MAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING AND DEBONDING SUBSTRATES
- Publication number 20230178410
- Publication date Jun 8, 2023
- Erich Thallner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET ALIGNMENT AND REPAIR IN MICRO DEVICE TRANSFER
- Publication number 20230144191
- Publication date May 11, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A SUBSTRATE FOR MANUFACTURING DISPLAY DEVICE AND A MANUFACTURING ME...
- Publication number 20230119947
- Publication date Apr 20, 2023
- LG ELECTRONICS INC.
- Jaewon CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Carrier and Method
- Publication number 20230093855
- Publication date Mar 30, 2023
- Infineon Technologies Americas Corp.
- Mihir Tungare
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MASS TRANSFER, LED DISPLAY DEVICE, AND DISPLAY APPARATUS
- Publication number 20230073010
- Publication date Mar 9, 2023
- CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
- Feng ZHAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOLITHOGRAPHY ALIGNMENT PROCESS FOR BONDED WAFERS
- Publication number 20220328419
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yeong-Jyh Lin
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD OF ALIGNING MICRO LIGHT EMITTING ELEMENT AND DISPLAY TRANSFE...
- Publication number 20220262667
- Publication date Aug 18, 2022
- Samsung Electronics Co., Ltd.
- Hyunjoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR TRANSFERRING LIGHT-EMITTING DIODE CHIP
- Publication number 20220246460
- Publication date Aug 4, 2022
- BOE TECHNOLOGY GROUP CO., LTD.
- Guangcai YUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY TRANSFERRING STRUCTURE AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20220246584
- Publication date Aug 4, 2022
- Samsung Electronics Co., Ltd.
- Junsik HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR DIE TILING
- Publication number 20220238506
- Publication date Jul 28, 2022
- Intel Corporation
- Srinivas PIETAMBARAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING DISPLAY DEVICE AND DISPLAY DEVICE
- Publication number 20220189814
- Publication date Jun 16, 2022
- Japan Display Inc.
- Kazuyuki YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY TRANSFER STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220190193
- Publication date Jun 16, 2022
- Samsung Electronics Co., Ltd.
- Seogwoo Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR DIE TILING
- Publication number 20220115367
- Publication date Apr 14, 2022
- Intel Corporation
- Srinivas PIETAMBARAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER SUBSTRATE
- Publication number 20220109081
- Publication date Apr 7, 2022
- Japan Display Inc.
- Keisuke ASADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR BONDING A PLURALITY OF DIES TO A CARRIER P...
- Publication number 20220102189
- Publication date Mar 31, 2022
- PYXIS CF PTE. LTD.
- HWEE SENG CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ALIGNING MICRO LIGHT EMITTING ELEMENT AND DISPLAY TRANSFE...
- Publication number 20220051924
- Publication date Feb 17, 2022
- Samsung Electronics Co., Ltd.
- Hyunjoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET ALIGNMENT METHOD FOR MICRO-SEMICONDUCTOR CHIP AND DISPLAY TRANS...
- Publication number 20220013400
- Publication date Jan 13, 2022
- Samsung Electronics Co., Ltd.
- Kyungwook HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOLITHOGRAPHY ALIGNMENT PROCESS FOR BONDED WAFERS
- Publication number 20210375781
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Yeong-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS INTEGRATION OF COMPONENTS ONTO COMPACT DEVICES USING...
- Publication number 20210134640
- Publication date May 6, 2021
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Auxiliary support including alignment aids

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device and method of manufacturing the same

Photolithography alignment process for bonded wafers

Micro device arrangement in donor substrate

In-situ wafer rotation for carousel processing chambers

Methods and structures for die-to-die bonding

Substrate treatment apparatus

Wet alignment method for micro-semiconductor chip and display trans...

High-temperature superconducting striated tape combinations

Method of aligning micro light emitting element and display transfe...

Fabrication of high-temperature superconducting striated tape combi...

Wafer carrier and method

Heterogeneous integration of components onto compact devices using...

Method of aligning micro light emitting element and display transfe...

Photolithography alignment process for bonded wafers

Multi-axis movement for transfer of semiconductor devices

Micro device arrangement in donor substrate

Carrier structure and micro device structure

Method of fabricating a chip package module with improve heat dissi...

Vacuum chuck for clamping workpieces, measuring devices and method...

Microdevice transfer setup and integration of micro-devices into sy...

Die stack structure and method of fabricating the same

Wafer carrier and method

Method for precisely aligning backside pattern to frontside pattern...

Method of separating electronic devices having a back layer and app...

Vacuum chuck for clamping workpieces, measuring devices and method...

Chip handling and electronic component integration

Chip handling and electronic component integration

Device, system and method for aligning electronic components

Micro device arrangement in donor substrate

Method of separating electronic devices having a back layer and app...

Patents Applicationslast 30 patents

RESOURCE MANAGEMENT WITH TIME AND EXPENSE TRACKING

OFFSET ALIGNMENT AND REPAIR IN MICRO DEVICE TRANSFER

APPARATUS FOR PROCESSING OF SINGULATED DIES AND METHODS FOR USING T...

METHOD FOR MANUFACTURING SUBSTRATE WITH CHIPS, AND SUBSTRATE PROCES...

Semiconductor Device Carriers and Methods of Making and Using

MASS TRANSFER OF SEMICONDUCTOR DIE USING TRANSFER ELEMENTS

PRE-PRODUCT, METHOD AND ELECTRONIC DEVICE

TECHNIQUES FOR DIE TILING

WET ALIGNMENT METHOD FOR MICRO-SEMICONDUCTOR CHIP AND DISPLAY TRANS...

WET ALIGNMENT METHOD FOR MICRO-SEMICONDUCTOR CHIP AND DISPLAY TRANS...

MASS TRANSFER DEVICE FOR TRANSFERRING MICRO-LEDS ONTO ARRAY SUBSTRA...

METHOD FOR BONDING AND DEBONDING SUBSTRATES

OFFSET ALIGNMENT AND REPAIR IN MICRO DEVICE TRANSFER

A SUBSTRATE FOR MANUFACTURING DISPLAY DEVICE AND A MANUFACTURING ME...

Wafer Carrier and Method

METHOD FOR MASS TRANSFER, LED DISPLAY DEVICE, AND DISPLAY APPARATUS

PHOTOLITHOGRAPHY ALIGNMENT PROCESS FOR BONDED WAFERS

METHOD OF ALIGNING MICRO LIGHT EMITTING ELEMENT AND DISPLAY TRANSFE...

APPARATUS FOR TRANSFERRING LIGHT-EMITTING DIODE CHIP

DISPLAY TRANSFERRING STRUCTURE AND DISPLAY DEVICE INCLUDING THE SAME

TECHNIQUES FOR DIE TILING

METHOD OF MANUFACTURING DISPLAY DEVICE AND DISPLAY DEVICE

DISPLAY TRANSFER STRUCTURE AND METHOD OF MANUFACTURING THE SAME

TECHNIQUES FOR DIE TILING

TRANSFER SUBSTRATE

APPARATUS AND METHOD FOR BONDING A PLURALITY OF DIES TO A CARRIER P...

METHOD OF ALIGNING MICRO LIGHT EMITTING ELEMENT AND DISPLAY TRANSFE...

WET ALIGNMENT METHOD FOR MICRO-SEMICONDUCTOR CHIP AND DISPLAY TRANS...

PHOTOLITHOGRAPHY ALIGNMENT PROCESS FOR BONDED WAFERS

HETEROGENEOUS INTEGRATION OF COMPONENTS ONTO COMPACT DEVICES USING...