Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support

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CPC
H01L2221/68318

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00

Current Industry

H01L2221/68318Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of selectively transferring semiconductor device
- Patent number 12,369,431
- Issue date Jul 22, 2025
- Epistar Corporation
- Hao-Min Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a chip package
- Patent number 12,362,178
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Debonding structures for wafer bonding
- Patent number 12,347,717
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Ting Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using a coreless signal distribution structure
- Patent number 12,322,731
- Issue date Jun 3, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Do Hyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with gap around component core and filled with fi...
- Patent number 12,322,622
- Issue date Jun 3, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Artan Baftiri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Infrared debond damage mitigation by copper fill pattern
- Patent number 12,300,615
- Issue date May 13, 2025
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive sheet
- Patent number 12,286,569
- Issue date Apr 29, 2025
- Nitto Denko Corporation
- Shusaku Ueno
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Integrated circuit structure
- Patent number 12,238,865
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source wafer, method, and optoelectronic devices
- Patent number 12,233,639
- Issue date Feb 25, 2025
- Rockley Photonics Limited
- Hua Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure having molding layer
- Patent number 12,218,095
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package, package-on-package structure, and manuf...
- Patent number 12,198,996
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temporary adhesive containing epoxy-modified polysiloxane
- Patent number 12,077,686
- Issue date Sep 3, 2024
- NISSAN CHEMICAL CORPORATION
- Kazuhiro Sawada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interbonded components, method for detaching components from interb...
- Patent number 12,059,881
- Issue date Aug 13, 2024
- Osram Opto Semiconductors GmbH
- Alexander Pfeuffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a substrate and system for producing a substrate
- Patent number 12,062,533
- Issue date Aug 13, 2024
- Disco Corporation
- Karl Heinz Priewasser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structures and methods for forming the same
- Patent number 11,961,791
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,948,808
- Issue date Apr 2, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a chip package
- Patent number 11,908,692
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of selectively transferring semiconductor device
- Patent number 11,901,478
- Issue date Feb 13, 2024
- Epistar Corporation
- Hao-Min Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using a coreless signal distribution structure
- Patent number 11,869,879
- Issue date Jan 9, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Do Hyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor element
- Patent number 11,854,856
- Issue date Dec 26, 2023
- Mitsubishi Electric Corporation
- Masahiro Fujikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D packages and methods for forming the same
- Patent number 11,830,745
- Issue date Nov 28, 2023
- TAIWANN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,798,898
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiao-Wen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 11,791,301
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure for transferring flat panel
- Patent number 11,784,083
- Issue date Oct 10, 2023
- G-NONE.Co.Ltd.
- Jae Cheon Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive material in the recess of an encapsulant and s...
- Patent number 11,756,802
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass substrate, laminated substrate, and laminate
- Patent number 11,753,330
- Issue date Sep 12, 2023
- AGC Inc.
- Yu Hanawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,749,640
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment mark design for packages
- Patent number 11,742,298
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for releasing ultra-small or ultra-thin discrete components...
- Patent number 11,728,201
- Issue date Aug 15, 2023
- Kulicke and Soffa Industries, Inc.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-stacked package-on-package structures
- Patent number 11,664,322
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING DISPLAY DEVICE
- Publication number 20250218848
- Publication date Jul 3, 2025
- SAMSUNG DISPLAY CO., LTD.
- Jae Gwang UM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING APPARATUS
- Publication number 20250218849
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Sangjun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE SHEET FOR SEMICONDUCTOR DEVICE
- Publication number 20250218851
- Publication date Jul 3, 2025
- INNOX ADVANCED MATERIALS CO., LTD.
- Keun-Young Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-TRANSFER PRINTING METHODS
- Publication number 20250210399
- Publication date Jun 26, 2025
- X-CELEPRINT LIMITED
- Ronald S. Cok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHEET FOR WORKPIECE PROCESSING AND MANUFACTURING METHOD OF PROCESSE...
- Publication number 20250201619
- Publication date Jun 19, 2025
- LINTEC CORPORATION
- Akio FUKUMOTO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20250191963
- Publication date Jun 12, 2025
- Kokusai Electric Corporation
- Toshiki FUJINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REMOVING RESIDUES FROM A SUBSTRATE SURFACE
- Publication number 20250183088
- Publication date Jun 5, 2025
- IMEC vzw
- Efrain Altamirano Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE HAVING MOLDING LAYER
- Publication number 20250167158
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE
- Publication number 20250159812
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MICRO HEATER MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250149372
- Publication date May 8, 2025
- ASTI GLOBAL INC., TAIWAN
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250105077
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE LAYER TRANSFER
- Publication number 20250105046
- Publication date Mar 27, 2025
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL DIE SINGULATION USING BURIED SACRIFICIAL STRUCTURE
- Publication number 20250048714
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Te Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARE FLIP-CHIP DIE STACK AND THE FABRICATION METHOD AND TOOLING THE...
- Publication number 20250015053
- Publication date Jan 9, 2025
- Qorvo US, Inc.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20250006525
- Publication date Jan 2, 2025
- TOKYO ELECTRON LIMITED
- Takeshi Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING LAMINATED ASSEMBLY
- Publication number 20240387229
- Publication date Nov 21, 2024
- Disco Corporation
- Fumihiro INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTUR...
- Publication number 20240387308
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY ADHESIVE CONTAINING EPOXY-MODIFIED POLYSILOXANE
- Publication number 20240376356
- Publication date Nov 14, 2024
- NISSAN CHEMICAL CORPORATION
- Kazuhiro SAWADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING LAMINATE AND KIT OF ADHESIVE COMPOSITIONS
- Publication number 20240363387
- Publication date Oct 31, 2024
- NISSAN CHEMICAL CORPORATION
- Takahisa OKUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE TAPE REMOVING
- Publication number 20240355651
- Publication date Oct 24, 2024
- Yangtze Memory Technologies Co., Ltd.
- Jinhua YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING LAMINATE AND KIT OF ADHESIVE COMPOSITIONS
- Publication number 20240352281
- Publication date Oct 24, 2024
- NISSAN CHEMICAL CORPORATION
- Takahisa OKUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE SHEET, PRODUCTION METHOD FOR ADHESIVE SHEET, ROLL, AND PRO...
- Publication number 20240355665
- Publication date Oct 24, 2024
- Resonac Corporation
- Kenta KIKUCHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DISSOLVING ADHESIVE BASE STRUCTURE TO RELEASE ELECTRONIC COMPONENT
- Publication number 20240347369
- Publication date Oct 17, 2024
- INFINEON TECHNOLOGIES AG
- Frank SINGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240332032
- Publication date Oct 3, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK GRINDING ADHESIVE FILM AND METHOD FOR MANUFACTURING ELECTRONIC...
- Publication number 20240274460
- Publication date Aug 15, 2024
- MITSUI CHEMICALS TOHCELLO, INC.
- Hiroto YASUI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240266203
- Publication date Aug 8, 2024
- MITSUI CHEMICALS TOHCELLO, INC.
- Hiroto YASUI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
LAMINATE, METHOD FOR MANUFACTURING LAMINATE, AND METHOD FOR MANUFAC...
- Publication number 20240222180
- Publication date Jul 4, 2024
- NISSAN CHEMICAL CORPORATION
- Masafumi YAGYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATE, RELEASE AGENT COMPOSITION, AND METHOD FOR MANUFACTURING P...
- Publication number 20240213072
- Publication date Jun 27, 2024
- NISSAN CHEMICAL CORPORATION
- Shunsuke MORIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATE, RELEASE AGENT COMPOSITION, AND METHOD FOR MANUFACTURING P...
- Publication number 20240208179
- Publication date Jun 27, 2024
- NISSAN CHEMICAL CORPORATION
- Hiroto OGATA
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
Semiconductor Package Using A Coreless Signal Distribution Structure
- Publication number 20240186292
- Publication date Jun 6, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Do Hyung Kim
- H01 - BASIC ELECTRIC ELEMENTS

Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of selectively transferring semiconductor device

Method for fabricating a chip package

Debonding structures for wafer bonding

Semiconductor package using a coreless signal distribution structure

Component carrier with gap around component core and filled with fi...

Infrared debond damage mitigation by copper fill pattern

Adhesive sheet

Integrated circuit structure

Source wafer, method, and optoelectronic devices

Chip package structure having molding layer

Integrated fan-out package, package-on-package structure, and manuf...

Temporary adhesive containing epoxy-modified polysiloxane

Interbonded components, method for detaching components from interb...

Method of producing a substrate and system for producing a substrate

Package structures and methods for forming the same

Semiconductor device and manufacturing method thereof

Method for fabricating a chip package

Method of selectively transferring semiconductor device

Semiconductor package using a coreless signal distribution structure

Method of manufacturing semiconductor element

3D packages and methods for forming the same

Package structure

Chip package structure

Pad structure for transferring flat panel

Thermally conductive material in the recess of an encapsulant and s...

Glass substrate, laminated substrate, and laminate

Semiconductor package and method of manufacturing the same

Alignment mark design for packages

Methods for releasing ultra-small or ultra-thin discrete components...

Multi-stacked package-on-package structures

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING DISPLAY DEVICE

WAFER BONDING APPARATUS

ADHESIVE SHEET FOR SEMICONDUCTOR DEVICE

MICRO-TRANSFER PRINTING METHODS

SHEET FOR WORKPIECE PROCESSING AND MANUFACTURING METHOD OF PROCESSE...

SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCT...

METHOD FOR REMOVING RESIDUES FROM A SUBSTRATE SURFACE

CHIP PACKAGE STRUCTURE HAVING MOLDING LAYER

INTEGRATED CIRCUIT STRUCTURE

MICRO HEATER MODULE AND METHOD OF MANUFACTURING THE SAME

PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SELECTIVE LAYER TRANSFER

WAFER-LEVEL DIE SINGULATION USING BURIED SACRIFICIAL STRUCTURE

BARE FLIP-CHIP DIE STACK AND THE FABRICATION METHOD AND TOOLING THE...

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

METHOD OF MANUFACTURING LAMINATED ASSEMBLY

MANUFACTURING METHOD OF PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTUR...

TEMPORARY ADHESIVE CONTAINING EPOXY-MODIFIED POLYSILOXANE

METHOD OF MANUFACTURING LAMINATE AND KIT OF ADHESIVE COMPOSITIONS

WORKPIECE TAPE REMOVING

METHOD OF MANUFACTURING LAMINATE AND KIT OF ADHESIVE COMPOSITIONS

ADHESIVE SHEET, PRODUCTION METHOD FOR ADHESIVE SHEET, ROLL, AND PRO...

DISSOLVING ADHESIVE BASE STRUCTURE TO RELEASE ELECTRONIC COMPONENT

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

BACK GRINDING ADHESIVE FILM AND METHOD FOR MANUFACTURING ELECTRONIC...

METHOD FOR MANUFACTURING ELECTRONIC DEVICE

LAMINATE, METHOD FOR MANUFACTURING LAMINATE, AND METHOD FOR MANUFAC...

LAMINATE, RELEASE AGENT COMPOSITION, AND METHOD FOR MANUFACTURING P...

LAMINATE, RELEASE AGENT COMPOSITION, AND METHOD FOR MANUFACTURING P...

Semiconductor Package Using A Coreless Signal Distribution Structure