Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support

Industry

CPC
H01L2221/68318

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00

Current Industry

H01L2221/68318Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support

Industries

Patents Grantslast 30 patents

Information Patent Grant
Package structures and methods for forming the same
- Patent number 11,961,791
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,948,808
- Issue date Apr 2, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a chip package
- Patent number 11,908,692
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of selectively transferring semiconductor device
- Patent number 11,901,478
- Issue date Feb 13, 2024
- Epistar Corporation
- Hao-Min Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using a coreless signal distribution structure
- Patent number 11,869,879
- Issue date Jan 9, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Do Hyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor element
- Patent number 11,854,856
- Issue date Dec 26, 2023
- Mitsubishi Electric Corporation
- Masahiro Fujikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D packages and methods for forming the same
- Patent number 11,830,745
- Issue date Nov 28, 2023
- TAIWANN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,798,898
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiao-Wen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 11,791,301
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure for transferring flat panel
- Patent number 11,784,083
- Issue date Oct 10, 2023
- G-NONE.Co.Ltd.
- Jae Cheon Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive material in the recess of an encapsulant and s...
- Patent number 11,756,802
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass substrate, laminated substrate, and laminate
- Patent number 11,753,330
- Issue date Sep 12, 2023
- AGC Inc.
- Yu Hanawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,749,640
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment mark design for packages
- Patent number 11,742,298
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for releasing ultra-small or ultra-thin discrete components...
- Patent number 11,728,201
- Issue date Aug 15, 2023
- Kulicke and Soffa Industries, Inc.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-stacked package-on-package structures
- Patent number 11,664,322
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with Si-substrate-free interposer and method forming same
- Patent number 11,610,858
- Issue date Mar 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoplastic temporary adhesive for silicon handler with infra-red...
- Patent number 11,574,835
- Issue date Feb 7, 2023
- International Business Machines Corporation
- Bing Dang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for transferring thin layers
- Patent number 11,562,899
- Issue date Jan 24, 2023
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Pierre Montmeat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for separating a plate into individual components
- Patent number 11,527,440
- Issue date Dec 13, 2022
- OMMIC
- Peter Michael Frijlink
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure and packaging method for antenna
- Patent number 11,502,392
- Issue date Nov 15, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill between a first package and a second package
- Patent number 11,488,843
- Issue date Nov 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using a coreless signal distribution structure
- Patent number 11,476,233
- Issue date Oct 18, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Do Hyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for micro-transfer-printing
- Patent number 11,472,171
- Issue date Oct 18, 2022
- X Display Company Technology Limited
- Christopher Bower
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Direct transfer apparatus for a pattern array of semiconductor devi...
- Patent number 11,462,433
- Issue date Oct 4, 2022
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna feeder package structure and packaging method
- Patent number 11,437,707
- Issue date Sep 6, 2022
- SJ SEMICONDUCTOR(JIANGYIN) CORPORATION
- Jangshen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Handler bonding and debonding for semiconductor dies
- Patent number 11,424,152
- Issue date Aug 23, 2022
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for transferring micro device, and electronic...
- Patent number 11,417,546
- Issue date Aug 16, 2022
- Korea Institute of Machinery & Materials
- Byung-Ik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Components with backside adhesive layers
- Patent number 11,398,399
- Issue date Jul 26, 2022
- X Display Company Technology Limited
- António José Marques Trindade
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Printable 3D electronic components and structures
- Patent number 11,387,178
- Issue date Jul 12, 2022
- X-CELEPRINT LIMITED
- Kevin G. Oswalt
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIE SUCTION ASSISTANCE DEVICE
- Publication number 20240112943
- Publication date Apr 4, 2024
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Carriers and Methods of Making and Using
- Publication number 20240055292
- Publication date Feb 15, 2024
- UTAC Headquarters Pte. Ltd.
- Roel Adeva Robles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER PRINTING STAMPS AND METHODS OF STAMP DELAMINATION
- Publication number 20240038570
- Publication date Feb 1, 2024
- X-CELEPRINT LIMITED
- Ken G. Purchase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20240006218
- Publication date Jan 4, 2024
- INFINEON TECHNOLOGIES AG
- Gregor Langer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRODEVICE SUBSTRATE, DISPLAY PANEL, PREPARATION METHOD, AND DISPL...
- Publication number 20240006220
- Publication date Jan 4, 2024
- TIANMA ADVANCED DISPLAY TECHNOLOGY INSTITUTE (XIAMEN) CO., LTD.
- Sitao HUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Setting Up Ultra-Small or Ultra-Thin Discrete Components for Easy A...
- Publication number 20230377936
- Publication date Nov 23, 2023
- Kulicke and Soffa Industries, Inc.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20230369151
- Publication date Nov 16, 2023
- XINTEC INC.
- Hsiao-Lan YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND A BONDING DEVICE THEREOF
- Publication number 20230298913
- Publication date Sep 21, 2023
- ALL RING TECH CO., LTD.
- Chun-Hung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTING COMPONENTS SUSPENDED BY FRAMES
- Publication number 20230290663
- Publication date Sep 14, 2023
- X-CELEPRINT LIMITED
- António José Marques Trindade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYIMIDE PRECURSOR COMPOSITION, POLYIMIDE FILM FORMED FROM THE SAM...
- Publication number 20230279183
- Publication date Sep 7, 2023
- DONGWOO FINE-CHEM CO., LTD.
- Dong Ki KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER TRANSFER METHOD AND WAFER TRANSFER APPARATUS
- Publication number 20230268220
- Publication date Aug 24, 2023
- Disco Corporation
- Kazuki SUGIURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230268219
- Publication date Aug 24, 2023
- Oki Electric Industry Co., Ltd.
- Genichirou MATSUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID RELEASE LAYER FOR MICRODEVICE CARTRIDGE
- Publication number 20230230869
- Publication date Jul 20, 2023
- VueReal Inc.
- Gholamreza CHAJI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TEMPORARY ADHESION METHOD, DEVICE WAFER PROCESSING METHOD, LAMINATE...
- Publication number 20230178412
- Publication date Jun 8, 2023
- Shin-Etsu Chemical Co., Ltd.
- Tamotsu OOWADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT ARRANGEMENT STRUCTURE
- Publication number 20230117490
- Publication date Apr 20, 2023
- EPISTAR CORPORATION
- Chang-Tai HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOURCE WAFER, METHOD, AND OPTOELECTRONIC DEVICES
- Publication number 20230105335
- Publication date Apr 6, 2023
- ROCKLEY PHOTONICS LIMITED
- Hua YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEBONDING STRUCTURES FOR WAFER BONDING
- Publication number 20220415696
- Publication date Dec 29, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Ting YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Underfill Between a First Package and a Second Package
- Publication number 20220367212
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co, LTD.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DONOR PLATES, METHODS OF FABRICATION AND USES THEREOF FOR...
- Publication number 20220319900
- Publication date Oct 6, 2022
- Terecircuits Corporation
- Jayna Sheats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Gap Around Component Core and Filled With Fi...
- Publication number 20220310428
- Publication date Sep 29, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Artan Baftiri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ATTACHING A FIRST CONNECTION PARTNER TO A SECOND CONNECT...
- Publication number 20220310435
- Publication date Sep 29, 2022
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER RESIN FOR TRANSFERRING AN LED CHIP, AND AN APPARATUS FOR T...
- Publication number 20220254949
- Publication date Aug 11, 2022
- Lightizer CO., Ltd.
- JAE SIK MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC DEBONDING FOR WAFER-LEVEL PACKAGING APPLICATIONS
- Publication number 20220127496
- Publication date Apr 28, 2022
- Brewer Science, Inc.
- Rama Puligadda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD STRUCTURE FOR TRANSFERRING FLAT PANEL
- Publication number 20220115258
- Publication date Apr 14, 2022
- G-NONE.Co.Ltd.
- Jae Cheon KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT
- Publication number 20220059386
- Publication date Feb 24, 2022
- Mitsubishi Electric Corporation
- Masahiro FUJIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE, PACKAGE-ON-PACKAGE STRUCTURE, AND MANUF...
- Publication number 20210358824
- Publication date Nov 18, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING A SUBSTRATE AND SYSTEM FOR PRODUCING A SUBSTRATE
- Publication number 20210358736
- Publication date Nov 18, 2021
- Disco Corporation
- Karl Heinz PRIEWASSER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR SEPARATING A PLATE INTO INDIVIDUAL COMPONENTS
- Publication number 20210343593
- Publication date Nov 4, 2021
- OMMIC
- Peter Michael FRIJLINK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20210335728
- Publication date Oct 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Wen LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20210143182
- Publication date May 13, 2021
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Sung-Jae CHANG
- H01 - BASIC ELECTRIC ELEMENTS

Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package structures and methods for forming the same

Semiconductor device and manufacturing method thereof

Method for fabricating a chip package

Method of selectively transferring semiconductor device

Semiconductor package using a coreless signal distribution structure

Method of manufacturing semiconductor element

3D packages and methods for forming the same

Package structure

Chip package structure

Pad structure for transferring flat panel

Thermally conductive material in the recess of an encapsulant and s...

Glass substrate, laminated substrate, and laminate

Semiconductor package and method of manufacturing the same

Alignment mark design for packages

Methods for releasing ultra-small or ultra-thin discrete components...

Multi-stacked package-on-package structures

Packages with Si-substrate-free interposer and method forming same

Thermoplastic temporary adhesive for silicon handler with infra-red...

Method for transferring thin layers

Process for separating a plate into individual components

Packaging structure and packaging method for antenna

Underfill between a first package and a second package

Semiconductor package using a coreless signal distribution structure

Apparatus and methods for micro-transfer-printing

Direct transfer apparatus for a pattern array of semiconductor devi...

Antenna feeder package structure and packaging method

Handler bonding and debonding for semiconductor dies

Method and apparatus for transferring micro device, and electronic...

Components with backside adhesive layers

Printable 3D electronic components and structures

Patents Applicationslast 30 patents

DIE SUCTION ASSISTANCE DEVICE

Semiconductor Device Carriers and Methods of Making and Using

TRANSFER PRINTING STAMPS AND METHODS OF STAMP DELAMINATION

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

MICRODEVICE SUBSTRATE, DISPLAY PANEL, PREPARATION METHOD, AND DISPL...

Setting Up Ultra-Small or Ultra-Thin Discrete Components for Easy A...

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FABRICATING THE SAME

BONDING APPARATUS AND A BONDING DEVICE THEREOF

PRINTING COMPONENTS SUSPENDED BY FRAMES

POLYIMIDE PRECURSOR COMPOSITION, POLYIMIDE FILM FORMED FROM THE SAM...

WAFER TRANSFER METHOD AND WAFER TRANSFER APPARATUS

ELECTRONIC STRUCTURE AND METHOD OF MANUFACTURING THE SAME

HYBRID RELEASE LAYER FOR MICRODEVICE CARTRIDGE

TEMPORARY ADHESION METHOD, DEVICE WAFER PROCESSING METHOD, LAMINATE...

SEMICONDUCTOR ELEMENT ARRANGEMENT STRUCTURE

SOURCE WAFER, METHOD, AND OPTOELECTRONIC DEVICES

DEBONDING STRUCTURES FOR WAFER BONDING

Underfill Between a First Package and a Second Package

SELECTIVE DONOR PLATES, METHODS OF FABRICATION AND USES THEREOF FOR...

Component Carrier With Gap Around Component Core and Filled With Fi...

METHOD FOR ATTACHING A FIRST CONNECTION PARTNER TO A SECOND CONNECT...

TRANSFER RESIN FOR TRANSFERRING AN LED CHIP, AND AN APPARATUS FOR T...

PHOTONIC DEBONDING FOR WAFER-LEVEL PACKAGING APPLICATIONS

PAD STRUCTURE FOR TRANSFERRING FLAT PANEL

METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT

INTEGRATED FAN-OUT PACKAGE, PACKAGE-ON-PACKAGE STRUCTURE, AND MANUF...

METHOD OF PRODUCING A SUBSTRATE AND SYSTEM FOR PRODUCING A SUBSTRATE

PROCESS FOR SEPARATING A PLATE INTO INDIVIDUAL COMPONENTS

PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME