Avoid chemical alteration

Follow

Industry

CPC
B81C1/00785

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C1/00Manufacture or treatment of devices or systems in or on a substrate

Current Industry

B81C1/00785Avoid chemical alteration

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Methods for fabricating pressure sensors with non-silicon diaphragms
- Patent number 11,624,668
- Issue date Apr 11, 2023
- ZHEJIANG DUNAN ARTIFICIAL ENVIRONMENT CO., LTD.
- Tom Kwa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Selective wafer removal process for wafer bonding applications
- Patent number 11,167,983
- Issue date Nov 9, 2021
- Texas Instruments Incorporated
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electro-mechanical system structure and method for forming th...
- Patent number 10,457,546
- Issue date Oct 29, 2019
- United Microelectronics Corp.
- Yuan-Sheng Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods for fabricating pressure sensors with non-silicon diaphragms
- Patent number 10,378,985
- Issue date Aug 13, 2019
- DunAn Sensing, LLC
- Tom Kwa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for providing a low-k spacer
- Patent number 10,224,414
- Issue date Mar 5, 2019
- Lam Research Corporation
- Straford A. Wild
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensor with support structure for non-silicon diaphragm
- Patent number 9,804,046
- Issue date Oct 31, 2017
- DunAn Sensing, LLC
- Tom Kwa
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SELECTIVE WAFER REMOVAL PROCESS FOR WAFER BONDING APPLICATIONS
- Publication number 20200223690
- Publication date Jul 16, 2020
- TEXAS INSTRUMENTS INCORPORATED
- John Charles EHMKE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS FOR FABRICATING PRESSURE SENSORS WITH NON-SILICON DIAPHRAGMS
- Publication number 20190310153
- Publication date Oct 10, 2019
- DunAn Sensing, LLC
- TOM KWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS FOR FABRICATING PRESSURE SENSORS WITH NON-SILICON DIAPHRAGMS
- Publication number 20170113927
- Publication date Apr 27, 2017
- DunAn Sensing, LLC
- Tom Kwa
- B81 - MICRO-STRUCTURAL TECHNOLOGY